Abstract: Disclosed herein are systems and methods that may be implemented in real time to determine the total volumetric rate of airflow through a chassis enclosure of an information handling system platform directly from real time measured cooling fan power consumption in combination with standalone or system-level cooling fan power characteristics (e.g., expressed as cooling fan power curves) that relate cooling fan volumetric airflow rate to cooling fan power consumption at the current fan rotation speed. This determined value of total real time volumetric airflow rate may then be used, for example, by individual system level thermal control algorithms and/or data center level thermal control algorithms.

Abstract: An information handling system may calculate multiple temperature changes within the information handling system. Each of the temperature changes is across a different bank of components of the information handling system. The system may calculate multiple inlet temperatures, each of which is associated with a different component of the information handling system. The inlet temperatures are utilized in determining whether cooling requirements for the system configuration are met. Based on the temperature changes and the inlet velocities, the system may determine whether the cooling requirements are met. In response to the cooling requirements for the system configuration not being met, the system may decrease a current cooling fan speed for the information handling system. In response to the cooling requirements for the system configuration being met, the system may store the current cooling fan speed.

Abstract: An information handling system includes a management controller configured to determine whether to initiate control of power consumption of a memory subsystem of the information handling system. A closed-loop memory thermal controller may receive temperature values to determine a temperature setpoint for the memory subsystem, and calculate an error value that is a difference between the temperature setpoint and a temperature measurement. If the error value is within a temperature margin, then the thermal controller may determine a proportional-integral power signal based on the temperature margin and the temperature measurement; and determine a proportional-integral gain based on a maximum rate of change of the temperature measurement between polling events of the temperature measurement and a polling rate of the temperature measurement.

Abstract: An information handling system includes a memory module having a first temperature sensor collocated with first memory devices associated with a first memory channel, and a second temperature sensor collocated with second memory devices associated with a second memory channel. A processor receives a first temperature from the first temperature sensor and a second temperature from the second temperature sensor, receives a first power level associated with the first memory channel and a second power level associated with the second memory channel from the memory module, determines a first thermal resistance of the first memory devices based upon the first temperature and the first power level, and determines a second thermal resistance of the second memory device based upon the second temperature and the second power level.

Abstract: An Information Handling System (IHS) includes multiple hardware devices, and a baseboard Management Controller (BMC) in communication with the plurality of hardware devices. The BMC includes executable instructions for monitoring a parameter of one or more of the hardware devices of the IHS when a custom BMC firmware stack is executed on the BMC. The instructions that monitor the parameter are separate and distinct from the instructions of the custom BMC firmware stack. When the parameter exceeds a specified threshold, the instructions are further executed to control the BMC to perform one or more operations to remediate the excessive parameter.

Abstract: A system for controlling one or more fans, comprising an open loop control system configured to receive a CPU power level and to maintain a fan speed at an open loop fan speed level. A closed loop control system configured to receive the CPU power level and temperature, and to modify the fan speed as a function of the CPU power level and temperature, wherein the fan speed is maintained at a level that is not lower than the open loop fan speed level.

Abstract: An Information Handling System (IHS) includes multiple hardware devices, and a baseboard Management Controller (BMC) in communication with the plurality of hardware devices. The BMC includes executable instructions for monitoring a parameter of one or more of the hardware devices of the IHS when a custom BMC firmware stack is executed on the BMC. The instructions that monitor the parameter are separate and distinct from the instructions of the custom BMC firmware stack. When the parameter exceeds a specified threshold, the instructions are further executed to control the BMC to perform one or more operations to remediate the excessive parameter.

Abstract: Disclosed herein are systems and methods of determining a maximum allowable air temperature limit for closed loop (CL) control of the inlet boundary or threshold temperature of a given computer expansion slot that contains a particular mating expansion card. The maximum allowable air temperature limit may be determined for closed loop control of the expansion slot inlet boundary temperature by using reverse correlation of an open loop (OL) cooling tier curve that has been designated for open loop control of cooling air velocity provided to the particular expansion card of the given expansion slot. The reverse correlation may be performed in further view of the particular expansion slot airflow characteristics (e.g., maximum expansion slot airflow velocity capacity or limit) corresponding to a expansion card received in a given expansion slot.

Abstract: An information handling system includes a memory module having a first temperature sensor collocated with first memory devices associated with a first memory channel, and a second temperature sensor collocated with second memory devices associated with a second memory channel. A processor receives a first temperature from the first temperature sensor and a second temperature from the second temperature sensor, receives a first power level associated with the first memory channel and a second power level associated with the second memory channel from the memory module, determines a first thermal resistance of the first memory devices based upon the first temperature and the first power level, and determines a second thermal resistance of the second memory device based upon the second temperature and the second power level.

Abstract: Apparatuses for expansion device retention. Specifically, the disclosed apparatuses implement retention mechanisms capable of being temporarily fastened to expansion slots whereat expansion devices may be installed. By fastening to the expansion slots, any permanent redesign and/or modification to the printed circuit boards, whereon the expansion slots may be mounted, may be minimized (if not eliminated). Amongst the disclosed apparatuses, an attachable hockey stick is introduced for expansion devices lacking a hockey stick shaped feature, where the attachable hockey stick engages with the aforementioned retention mechanisms to secure the expansion devices during, for example, shock events.

Abstract: A management controller is configured to determine a thermal resistance of a heat sink, and determine a thermal resistance curve that includes the thermal resistance. The management controller may also determine a fan speed setting corresponding with the thermal resistance, and set a speed of the fan based on the fan speed setting.

Abstract: An information handling system includes a memory module having a first temperature sensor collocated with first memory devices associated with a first memory channel, and a second temperature sensor collocated with second memory devices associated with a second memory channel. A processor receives a first temperature from the first temperature sensor and a second temperature from the second temperature sensor, receives a first power level associated with the first memory channel and a second power level associated with the second memory channel from the memory module, determines a first thermal resistance of the first memory devices based upon the first temperature and the first power level, and determines a second thermal resistance of the second memory device based upon the second temperature and the second power level.

Abstract: An information handling system may include an information handling resource, an air mover configured to drive air to cool the information handling resource, and a thermal control system for controlling the air mover and configured to determine an air speed requirement for the air mover and regulate an air speed of the air mover to optimize an airflow-versus-power efficiency of the air mover while satisfying the air speed requirement.

Abstract: An information handling system includes a management controller configured to determine whether to initiate control of power consumption of a memory subsystem of the information handling system. A closed-loop memory thermal controller may receive temperature values to determine a temperature setpoint for the memory subsystem, and calculate an error value that is a difference between the temperature setpoint and a temperature measurement. if the error value is within a temperature margin, then the thermal controller may determine a proportional-integral power signal based on the temperature margin and the temperature measurement; and determine a proportional-integral gain based on a maximum rate of change of the temperature measurement between polling events of the temperature measurement and a polling rate of the temperature measurement.

Abstract: Disclosed herein are systems and methods that may be implemented in real time to determine the total volumetric rate of airflow through a chassis enclosure of an information handling system platform directly from real time measured cooling fan power consumption in combination with standalone or system-level cooling fan power characteristics (e.g., expressed as cooling fan power curves) that relate cooling fan volumetric airflow rate to cooling fan power consumption at the current fan rotation speed. This determined value of total real time volumetric airflow rate may then be used, for example, by individual system level thermal control algorithms and/or data center level thermal control algorithms.

Abstract: Disclosed herein are systems and methods of determining a maximum allowable air temperature limit for closed loop (CL) control of the inlet boundary or threshold temperature of a given computer expansion slot that contains a particular mating expansion card. The maximum allowable air temperature limit may be determined for closed loop control of the expansion slot inlet boundary temperature by using reverse correlation of an open loop (OL) cooling tier curve that has been designated for open loop control of cooling air velocity provided to the particular expansion card of the given expansion slot. The reverse correlation may be performed in further view of the particular expansion slot airflow characteristics (e.g., maximum expansion slot airflow velocity capacity or limit) corresponding to a expansion card received in a given expansion slot.

Abstract: A system may include a cooling subsystem comprising at least one air mover configured to generate a cooling airflow in the system and a thermal manager communicatively coupled to the cooling subsystem for control of the cooling subsystem and configured to determine an acoustic limit associated with the cooling subsystem, correlate the acoustic limit to an acoustic-based air mover speed limit for the at least one air mover, and control the cooling subsystem to maintain an air mover speed of the at least one air mover below the acoustic-based air mover speed limit.

Abstract: A communication module may be used in an information handling system comprising an air mover configured to drive a flow of air and a processing component communicatively coupled to the air mover for controlling operation of the air mover via a first wire configured to communicate air mover speed commands from the processing component to the air mover for controlling a speed of the air mover and a second wire configured to communicate tachometer information from the air mover to the processing component. The communication module may include a connector other than an air mover connector configured to couple the air mover to the first and second wire and logic configured to monitor for an escape sequence communicated via first wire from the processing component to enter a command mode and responsive to detecting the escape sequence, communicating information regarding the air mover to the processing component via second wire.

Abstract: A management controller is configured to determine a thermal resistance of a heat sink, and determine a thermal resistance curve that includes the thermal resistance. The management controller may also determine a fan speed setting corresponding with the thermal resistance, and set a speed of the fan based on the fan speed setting.

Abstract: A method and system to control an operating temperature of a processor of an information handling system, including executing a workload by the processor at the information handling system; in response to execution of the workload, determining that the processor is in a steady-state condition; in response to determining that the processor is in the steady-state condition: increasing a cooling parameter of a cooling module of the information handling system to decrease a temperature of the processor; determining, based on the decreased temperature of the processor, whether a power used by the processor has decreased; and when the power used by the processor has decreased, iteratively increasing the cooling parameter of the cooling module until the power of the processor stops decreasing to identify the operating temperature of the processor where the processor is operating at a minimal power.