Patents by Inventor Hau Ng

Hau Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7565457
    Abstract: A method, circuit, and system are disclosed. In one embodiment, the method comprises sending a step pulse across a serial advanced technology attachment (SATA) transmission line, determining the length of time the transmission line takes to charge from common mode voltage to supply voltage, and determining whether a device is connected to the SATA transmission line based on the length of the transmission line charge time.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: July 21, 2009
    Assignee: Intel Corporation
    Inventors: Eng Hun Ooi, Fei Deng, Jien Hau Ng, Serge Bedwani, Siang Lin Tan
  • Publication number: 20090083587
    Abstract: An apparatus and a method are provided for selectively enabling and disabling a squelch circuit in a Serial Advanced Technology Attachment (SATA) host or SATA device while maintaining proper operation of the host and device. An apparatus and method are provided which allow the squelch circuit to be selectively enabled and disabled across SATA power states (PHY Ready, Partial, and Slumber) and in Advanced Host Controller Interface (AHCI) Listen mode.
    Type: Application
    Filed: September 26, 2007
    Publication date: March 26, 2009
    Inventors: Jien-Hau Ng, Tea M. Lee
  • Publication number: 20090012825
    Abstract: The present invention generally relates to methods for determining and/or managing corrosion and/or contamination. More specifically, the present invention relates to various methods to identify, determine and/or quantify the nature, amount and/or extent of corrosion and/or contamination situations, issues and/or concerns in various commercial, production and/or industrial supply chains. In another embodiment, the present invention permits one to identify, determine and/or quantify the nature, amount and/or extent of corrosion and/or contamination situations, issues and/or concerns in various commercial and/or industrial supply chains and recommends various methods by which to mitigate, reduce and/or eliminate such corrosion and/or contamination. In still another embodiment, the present invention provides a method for matching and/or developing specific products, systems, and/or services to solve, address and/or identify corrosion and/or contamination situations, issues and/or concerns.
    Type: Application
    Filed: February 20, 2007
    Publication date: January 8, 2009
    Inventor: Ik-Hau Ng
  • Publication number: 20080001480
    Abstract: A method, circuit, and system are disclosed. In one embodiment, the method comprises sending a step pulse across a serial advanced technology attachment (SATA) transmission line, determining the length of time the transmission line takes to charge from common mode voltage to supply voltage, and determining whether a device is connected to the SATA transmission line based on the length of the transmission line charge time.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 3, 2008
    Inventors: Eng Hun Ooi, Fei Deng, Jien Hau Ng, Serge Bedwani, Siang Lin Tan
  • Publication number: 20060223237
    Abstract: The present invention relates to an integrated circuit package having a thermally conductive element thermally coupled to a semiconductor die and a heat sink, and a method of manufacturing said integrated circuit package. The thermally conductive element is integrated into the package to enhance thermal dissipation characteristics of the package.
    Type: Application
    Filed: March 6, 2006
    Publication date: October 5, 2006
    Inventors: Edward Combs, Robert Sheppard, Tai Pun, Hau Ng, Chan Fan, Neil McLellan
  • Publication number: 20050003585
    Abstract: The present invention relates to an integrated circuit package having a thermally conductive element thermally coupled to a semiconductor die and a heat sink, and a method of manufacturing said integrated circuit package. The thermally conductive element is integrated into the package to enhance thermal dissipation characteristics of the package.
    Type: Application
    Filed: March 18, 2004
    Publication date: January 6, 2005
    Inventors: Edward Combs, Robert Sheppard, Tai Pun, Hau Ng, Chun Fan, Neil McLellen