Abstract: Crankshaft and connecting rod assemblies for hydraulic fracturing pumps and related methods may enhance the flow of fracturing fluid into a wellhead during a high-pressure fracturing operation. The assemblies and methods may include a crankshaft having a crankpin between first and second journals. The crankpin may include first and second longitudinally spaced ridges at least partially extending circumferentially around the crankpin. The assemblies and methods further may include first and second connecting rods connected to the crankpin. The first connecting rod may include first and second crankpin connectors connected to the crankpin and at least partially defining therebetween a connecting rod clearance between and positioned to at least partially receive therein an end of a second connecting rod. The assemblies and methods also may include first and second rod clamps connected to the first crankpin connector, thereby to rotatably connect the first and second connecting rods to the crankpin.

Abstract: The disclosure relates to a fifth generation (5G) or sixth generation (6G) communication system for supporting a higher data transfer rate. A method performed by a user equipment in a wireless communication system is provided. The method includes executing an application in the user equipment, identifying a user equipment route selection policy (URSP) rule mapped to the application, based on configuration information on the application, identifying a single-network slice selection assistance information (S-NSSAI) mapped to the application, based on the URSP rule mapped to the application, and transmitting a message requesting registration of the S-NSSAI mapped to the application to a core network via a base station. The S-NSSAI may correspond to a network slice selection assistance information (NSSAI) not allowed by the core network to be registered among NSSAIs configured for the user equipment.

Abstract: A test strip for sampling a bodily fluid may include multiple layers of a substrate material, an adhesive between at least some of the multiple layers, and a microfluidic channel formed between at least some of the multiple layers. The test strip may further include multiple electrodes on one of the multiple layers, positioned and partially exposed within the microfluidic channel, an additional material positioned at or near an entrance to the microfluidic channel, to selectively limit the flow of at least one of bubbles or debris into the microfluidic channel, and at least one exit port in at least one of the multiple layers to allow for release of pressure from the test strip. In some embodiments, the test strip is a saliva analysis test strip. In some embodiments, the test strip includes multiple exit ports to prevent blockage of sample flow.

Abstract: A method for using saliva to measure at least one substance or physiological parameter of a human or animal subject may involve inserting a first end of a sensor into a handheld saliva testing device. The method may also involve receiving saliva from the subject on a second end of the sensor, moving the saliva from the second end of the sensor to the first end, and processing the saliva with the handheld saliva testing device to provide initial saliva data related to the at least one substance or physiological parameter of the subject. In some embodiments, the sensor remains inserted in the handheld device while the subject deposits saliva on the opposite, free end of the sensor.

Abstract: In a described example, an apparatus includes: a first package substrate having a die mount surface; a semiconductor die flip chip mounted to the first package substrate on the die mount surface, the semiconductor die having post connects having proximate ends on bond pads on an active surface of the semiconductor die, and extending to distal ends away from the semiconductor die having solder bumps, wherein the solder bumps form solder joints to the package substrate; a second package substrate having a thermal pad positioned with the thermal pad over a backside surface of the semiconductor die, the thermal pad comprising a thermally conductive material; and a mold compound covering a portion of the first package substrate, a portion of the second package substrate, the semiconductor die, and the post connects, thermal pad having a surface exposed from the mold compound.

Abstract: An electronic device includes a die attach pad, a semiconductor die, a lead, a package structure, and tie bars, where the die attach pad has opposite first and second sides, the semiconductor die is attached to the second side of the die attach pad, the lead has a first portion connected to a circuit of the semiconductor die by a bond wire, the package structure exposes a portion of the first side of the die attach pad and the second portion of the lead. Four tie bars extend outward from the die attach pad and the tie bars have respective ends exposed outside the package structure.

Abstract: A method for making a semiconductor device is provided. The method generally includes forming a package having a first plurality of leads extending from a first side of the package, the package disposed on a leadframe. The method generally includes making a first cut adjacent to a first side of a first lead of the first plurality of leads, the first side extending from the first side of the package. The method generally includes making a second cut adjacent to a second side of the first lead of the first plurality of the lead, the second side of the lead opposite the first side of the lead and extending from the first side of the package.

Abstract: A mixer and method for mixing are provided. The mixer includes a housing including a fluid inlet, an additive inlet, and an outlet. The housing defines a mixing chamber in fluid communication with the fluid inlet, the additive inlet, and the outlet. The mixer also includes an impeller disposed in the mixing chamber. When rotated, the impeller pumps fluid through the fluid inlet. The mixer also includes a slinger disposed in the mixing chamber and configured to receive the fluid from the impeller and to receive an additive from the additive inlet. When rotated, the slinger slings the fluid and the additive radially outwards. The mixer further includes a flush line extending between the mixing chamber and the additive inlet. The flush line is receives, from the mixing chamber, a portion of the fluid pumped by the impeller and to deliver the portion of the fluid to the additive inlet.

Abstract: The present invention provides a chip for sample assay and a sample assay method using same, the chip being capable of assaying a target analyte included in a sample, even with a trace amount of the sample, due to improved efficiency in capture of the target analyte included in the sample.

Abstract: In examples, a device comprises a semiconductor die, a thin-film layer, and an air cavity positioned between the semiconductor die and the thin-film layer. The air cavity comprises a resonator positioned on the semiconductor die. A rib couples to a surface of the thin-film layer opposite the air cavity.

Abstract: A mixer and method for mixing are provided. The mixer includes a housing including a fluid inlet, an additive inlet, and an outlet. The housing defines a mixing chamber in fluid communication with the fluid inlet, the additive inlet, and the outlet. The mixer also includes an impeller disposed in the mixing chamber. When rotated, the impeller pumps fluid through the fluid inlet. The mixer also includes a slinger disposed in the mixing chamber and configured to receive the fluid from the impeller and to receive an additive from the additive inlet. When rotated, the slinger slings the fluid and the additive radially outwards. The mixer further includes a flush line extending between the mixing chamber and the additive inlet. The flush line is receives, from the mixing chamber, a portion of the fluid pumped by the impeller and to deliver the portion of the fluid to the additive inlet.

Abstract: An integrated circuit package includes a die attach pad (DAP) having a top surface and a layer of insulating material applied to the top surface of the DAP. A silicon-on-insulator (SOI) device is mounted on the insulating material using a die attach paste or film. A plurality of leads are coupled to the SOI device using bond wires. A mold compound covers at least a portion of the DAP and the SOI device. The insulating material may be polyimide or polyamide-imide that has been inkjet printed or screen printed on the DAP. The insulating material may be a parylene material that is applied to the top surface of the DAP using chemical vapor deposition. The insulating material has a thickness of 1-25 um and has a breakdown voltage of approximately 250V/um.

Abstract: A crosshead assembly for a reciprocating pump. The crosshead assembly has a crosshead and a connecting rod configured to connect with a crankshaft of the reciprocating pump. Trunnions detachably connect with the connecting rod and facilitate pivotable connection of the connecting rod and the crosshead.

Abstract: A reciprocating pump having a power end, a fluid end, and a spacer section interposing the power and fluid ends. The power end includes a structural support frame having structural members that are each a discrete, unitary member. Each structural member forms a portion of a crankcase frame, a portion of a crosshead support frame, and a portion of a support base. The support base portion extends beneath the crosshead support frame and the spacer section.

Abstract: One example includes a method for fabricating an integrated circuit (IC) device. The method includes fabricating a semiconductor die comprising an IC. The method also includes patterning a film over a portion of the first surface of the semiconductor die. The method also includes attaching a second surface of the semiconductor die opposite the first surface to a substrate. The method further includes depositing molding material over the semiconductor die to cover at least the first surface of the semiconductor die.

Abstract: In examples, a device comprises a semiconductor die, a thin-film layer, and an air cavity positioned between the semiconductor die and the thin-film layer. The air cavity comprises a resonator positioned on the semiconductor die. A rib couples to a surface of the thin-film layer opposite the air cavity.

Abstract: Systems and methods presented herein are directed toward a reciprocating pump. The reciprocating pump includes a fluid section including a plurality of fluid-displacing members. Each fluid-displacing member is configured to displace fluid through the reciprocating pump. The reciprocating pump also includes a power section including a plurality of crossheads. Each crosshead is coupled to a respective fluid-displacing member. The power section is configured to actuate the fluid section by actuating the plurality of crossheads through respective crosshead bores formed through the power section. The power section includes a plurality of structural members. The power section also includes a plurality of pairs of support plates. Each pair of support plates is permanently joined to two structural members of the plurality of structural members. Each support plate comprises a precision interior surface. The power section further includes a plurality of pairs of arcuate crosshead guide sections.

Abstract: A described example includes: a package substrate having a die pad with a die side surface and having an opposite backside surface, having leads arranged along two opposite sides and having die pad straps extending from two opposing ends of the die pad. The leads lie in a first plane, a portion of the die pad straps lie in a second plane that is spaced from the first plane and located closer to the die pad, and the die pad lies in a third plane that is spaced from and parallel to the second plane in a direction away from the first plane. A semiconductor die is mounted to the die side surface and mold compound covers the semiconductor die, a portion of the leads, and the die side surface of the die pad, and the backside surface of the die pad exposed from the mold compound.

Abstract: A described example includes: a MEMS component on a device side surface of a first semiconductor substrate; a second semiconductor substrate bonded to the device side surface of the first semiconductor substrate by a first seal patterned to form sidewalls that surround the MEMS component; a third semiconductor substrate having a second seal extending from a surface and bonded to the backside surface of the first semiconductor substrate by the second seal, the second seal forming sidewalls of a gap beneath the MEMS component. A trench extends through the first semiconductor substrate and at least partially surrounds the MEMS component. The third semiconductor substrate is mounted on a package substrate. A bond wire or ribbon bond couples the bond pad to a conductive lead on the package substrate; and mold compound covers the MEMS component, the bond wire, and a portion of the package substrate.

Abstract: A substantially continuous stream of aqueous fluid and a substantially continuous stream of gel having a first concentration are combined to form a substantially continuous stream of gel having a second concentration. The second concentration is substantially lower than the first concentration. The gel having the second concentration may thereafter be utilized in conjunction with a well fracturing operation.