Abstract: The present disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate. According to various embodiments of the disclosure, there is provided a method of a terminal including a plurality of SIMs in a wireless communication system, the method including: based on a type of a SIM used for a current communication service of the terminal, determining whether to enable a dual connectivity feature of the terminal; and transmitting information on whether to enable the dual connectivity feature to a base station, wherein the terminal and the base station are configured to support the dual connectivity feature, wherein the plurality of SIMs include a first SIM and a second SIM, and the first SIM and the second SIM include different subscription information.

Abstract: In examples, a device comprises a semiconductor die, a thin-film layer, and an air cavity positioned between the semiconductor die and the thin-film layer. The air cavity comprises a resonator positioned on the semiconductor die. A rib couples to a surface of the thin-film layer opposite the air cavity.

Abstract: The present disclosure relates to power end frame assemblies having a plurality of bearing plates coupled together by a structural support. The frame assembly can include a plurality of bearing plates to support one or more components of a crankshaft assembly. Adjacent bearing plates of the frame assembly can form receptacles to accommodate a portion of one or more components of a crosshead assembly. The bearing plates of the frame assembly can have one or more openings to receive one or more structural supports. The one or more structural supports can couple together the plurality of bearing plates. Some configurations have bearing plates with portions that extend beyond the receptacle formed by adjacent bearing plates. In such configurations a structural support can couple the bearing plates via openings on these extended portions.

Abstract: An example method performed by a first terminal in a wireless communication system may include identifying a connection state of a second terminal, receiving capability information from the second terminal, if the second terminal is connected with the first terminal using short-range communication, and is not connected with a serving cell of the first terminal over a wireless network, and transmitting a list of at least one candidate cell identified based on the capability information to the second terminal.

Abstract: A mixer and method for mixing are provided. The mixer includes a housing including a fluid inlet, an additive inlet, and an outlet. The housing defines a mixing chamber in fluid communication with the fluid inlet, the additive inlet, and the outlet. The mixer also includes an impeller disposed in the mixing chamber. When rotated, the impeller pumps fluid through the fluid inlet. The mixer also includes a slinger disposed in the mixing chamber and configured to receive the fluid from the impeller and to receive an additive from the additive inlet. When rotated, the slinger slings the fluid and the additive radially outwards. The mixer further includes a flush line extending between the mixing chamber and the additive inlet. The flush line is receives, from the mixing chamber, a portion of the fluid pumped by the impeller and to deliver the portion of the fluid to the additive inlet.

Abstract: According to an embodiment of the present disclosure, a method performed by a user equipment in a wireless communication system, may include: receiving, from a base station, information for measurement, the information for measurement including frequency information related to at least one cell related to the measurement, or the frequency information and identifier information of the at least one cell; performing the measurement on a standalone (SA) cell excluding a cell matching a cell identified by information of at least one non-standalone (NSA) cell among the at least one cell, based on the information for the measurement and a specified NSA cell list including information of the at least one NSA cell; and transmitting, to the base station, a measurement report of the SA cell.

Abstract: A method includes forming a stress sensitive component on a first semiconductor die; forming a solder seal on the first semiconductor die, the solder seal extending from a first surface of the first semiconductor die, and surrounding the stress sensitive component, the solder seal having an interior surface that surrounds the stress sensitive component and having an exterior surface facing away from the stress sensitive component; flip chip mounting the first semiconductor die to a first surface of a second semiconductor die, the stress sensitive component facing the first surface of the second semiconductor die; and forming a solder joint between the solder seal and the first surface of the second semiconductor die.

Abstract: Apparatuses, assemblies, and methods for facilitating assembly, disassembly, and/or service of a fluid end for a pump may include a fluid end handling system, including a lift adaptor and a support frame. The lift adaptor may include a lift connector configured to be connected to a lifting mechanism for lifting the lift adaptor and the fluid end, and a fluid end support positioned to support the fluid end and orient the fluid end relative to a pump frame for assembly and removal of the fluid end. The support frame may include a pump frame connector to connect the support frame to the pump frame, a ramp having a ramp face extending in a direction substantially parallel to a direction in which the fluid end is moved for connection to the pump frame, and an actuator connector associated with the ramp and positioned to connect the support frame to an actuator.

Abstract: In examples, a device comprises a semiconductor die, a thin-film layer, and an air cavity positioned between the semiconductor die and the thin-film layer. The air cavity comprises a resonator positioned on the semiconductor die. A rib couples to a surface of the thin-film layer opposite the air cavity.

Abstract: An electrochemical system comprises a plurality of stacked bipolar plates, each of which is composed of two structured half-plates that describe corrugation peaks and corrugation valleys. Coolant channels are formed between the half-plates of each bipolar plate by means of the corrugation peaks and corrugation valleys, and at the same time the outer faces of the bipolar plates delimit flow channels for operating media. A membrane assembly is located between each pair of bipolar plates. An assembly of flow channels, said assembly being mirror-symmetrical with respect to a plane on which the membrane assembly lies, transitions into an assembly which is offset in the transverse direction in a transition region between an active field and a distributing field of each bipolar plate.

Abstract: An electronic device includes a semiconductor die, a die attach pad, an adhesive, a conductive lead, and a package structure, where the semiconductor die has opposite first and second sides, a conductive terminal on the second side, and an electrical isolation coating layer that extends on the first side, the adhesive adheres the first side of the semiconductor die to the die attach pad, the conductive lead is electrically coupled to the conductive terminal of the semiconductor die, and the package structure encloses at least a portion of the semiconductor die.

Abstract: Apparatuses, assemblies, and methods for facilitating assembly and disassembly of high-power fluid pumps may include a pivoting support assembly to facilitate assembly and disassembly of the pump. The pivoting support assembly may include a base, a first support connected to the base and configured to be connected to a pump frame of the pump, and a second support connected to the first support and configured to be connected to the pump frame of the pump. The pivoting support assembly further may include a first actuator connected to the base and the first support, and a second actuator connected to the first support and the second support. The first actuator may be configured to pivot the first support to re-orient the pump frame for installation of a crankshaft, and the second actuator may be configured to pivot the second support to re-orient the pump frame for installation of a connecting rod.

Abstract: A described example includes: a package substrate having a die pad with a die side surface and having an opposite backside surface, having leads arranged along two opposite sides and having die pad straps extending from two opposing ends of the die pad. The leads lie in a first plane, a portion of the die pad straps lie in a second plane that is spaced from the first plane and located closer to the die pad, and the die pad lies in a third plane that is spaced from and parallel to the second plane in a direction away from the first plane. A semiconductor die is mounted to the die side surface and mold compound covers the semiconductor die, a portion of the leads, and the die side surface of the die pad, and the backside surface of the die pad exposed from the mold compound.

Abstract: A mixing unit comprising a frame, a rheology control portion, and a high-volume solids blending portion. The rheology control portion comprises means for receiving a first material from a first transfer mechanism, a dispersing/mixing system connected with the frame, and a first metering system to meter the first material from the first material receiving means to the dispersing/mixing system. The dispersing/mixing system disperses/mixes the metered first material with a fluid to form a first fluid mixture. The high-volume solids blending portion comprises means for receiving a second material from a second transfer mechanism, a solids blending system connected with the frame, and a second metering system to meter the second material from the second material receiving means to the solids blending system. The solids blending system blends the metered second material with the first fluid mixture to form a second fluid mixture.

Abstract: In a described example, an apparatus includes: a first semiconductor die with a component on a first surface; a second semiconductor die mounted on a package substrate and having a third surface facing away from the package substrate; a solder seal bonded to and extending from the first surface of the first semiconductor die flip chip mounted to the third surface of the second semiconductor die, the solder seal at least partially surrounding the stress sensitive component; a first solder joint formed between the solder seal and the third surface of the second semiconductor die; a second solder joint formed between solder at an end of the post connect and the third surface of the second semiconductor die; and a mold compound covering the second surface of the first semiconductor die, a portion of the second semiconductor die, and an outside periphery of the solder seal.

Abstract: A described example includes: a package substrate having a die pad with a die side surface and having an opposite backside surface, having leads arranged along two opposite sides and having die pad straps extending from two opposing ends of the die pad. The leads lie in a first plane, a portion of the die pad straps lie in a second plane that is spaced from the first plane and located closer to the die pad, and the die pad lies in a third plane that is spaced from and parallel to the second plane in a direction away from the first plane. A semiconductor die is mounted to the die side surface and mold compound covers the semiconductor die, a portion of the leads, and the die side surface of the die pad, and the backside surface of the die pad exposed from the mold compound.

Abstract: A reciprocating pump includes a fluid section that includes fluid-displacing members and a power section that includes crossheads coupled to a respective fluid-displacing member. The power section actuates the fluid section by actuating the crossheads through respective crosshead bores formed through the power section. The power section also includes structural members, pairs of support plates, and pairs of arcuate crosshead sections secured in place between the structural members against a respective pair of support plates. Each pair of the arcuate guide sections comprises a top section and a bottom section that form a portion of a respective crosshead bore. Each pair of the arcuate crosshead guide sections are also secured in place using clamping segments secured to edges of windows of the structural members by bolts extending through interior passages of the clamping segments and having threads that mate with threaded holes extending into the edges of the windows.

Abstract: Crankshaft and connecting rod assemblies for hydraulic fracturing pumps and related methods may enhance the flow of fracturing fluid into a wellhead during a high-pressure fracturing operation. The assemblies and methods may include a crankshaft having a crankpin between first and second journals. The crankpin may include first and second longitudinally spaced ridges at least partially extending circumferentially around the crankpin. The assemblies and methods further may include first and second connecting rods connected to the crankpin. The first connecting rod may include first and second crankpin connectors connected to the crankpin and at least partially defining therebetween a connecting rod clearance between and positioned to at least partially receive therein an end of a second connecting rod. The assemblies and methods also may include first and second rod clamps connected to the first crankpin connector, thereby to rotatably connect the first and second connecting rods to the crankpin.

Abstract: In a described example, an apparatus includes: a first package substrate having a die mount surface; a semiconductor die flip chip mounted to the first package substrate on the die mount surface, the semiconductor die having post connects having proximate ends on bond pads on an active surface of the semiconductor die, and extending to distal ends away from the semiconductor die having solder bumps, wherein the solder bumps form solder joints to the package substrate; a second package substrate having a thermal pad positioned with the thermal pad over a backside surface of the semiconductor die, the thermal pad comprising a thermally conductive material; and a mold compound covering a portion of the first package substrate, a portion of the second package substrate, the semiconductor die, and the post connects, thermal pad having a surface exposed from the mold compound.

Abstract: A method for making a semiconductor device is provided. The method generally includes forming a package having a first plurality of leads extending from a first side of the package, the package disposed on a leadframe. The method generally includes making a first cut adjacent to a first side of a first lead of the first plurality of leads, the first side extending from the first side of the package. The method generally includes making a second cut adjacent to a second side of the first lead of the first plurality of the lead, the second side of the lead opposite the first side of the lead and extending from the first side of the package.