Patents by Inventor Hau Nguyen

Hau Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240055327
    Abstract: A method for making a semiconductor device is provided. The method generally includes forming a package having a first plurality of leads extending from a first side of the package, the package disposed on a leadframe. The method generally includes making a first cut adjacent to a first side of a first lead of the first plurality of leads, the first side extending from the first side of the package. The method generally includes making a second cut adjacent to a second side of the first lead of the first plurality of the lead, the second side of the lead opposite the first side of the lead and extending from the first side of the package.
    Type: Application
    Filed: August 9, 2022
    Publication date: February 15, 2024
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Makoto Yoshino, Hiroki Kawano, Hau Nguyen
  • Publication number: 20240033695
    Abstract: A mixer and method for mixing are provided. The mixer includes a housing including a fluid inlet, an additive inlet, and an outlet. The housing defines a mixing chamber in fluid communication with the fluid inlet, the additive inlet, and the outlet. The mixer also includes an impeller disposed in the mixing chamber. When rotated, the impeller pumps fluid through the fluid inlet. The mixer also includes a slinger disposed in the mixing chamber and configured to receive the fluid from the impeller and to receive an additive from the additive inlet. When rotated, the slinger slings the fluid and the additive radially outwards. The mixer further includes a flush line extending between the mixing chamber and the additive inlet. The flush line is receives, from the mixing chamber, a portion of the fluid pumped by the impeller and to deliver the portion of the fluid to the additive inlet.
    Type: Application
    Filed: October 11, 2023
    Publication date: February 1, 2024
    Inventors: Rajesh Luharuka, Gocha Chochua, Hau Nguyen-Phuc Pham, Mark Ayyad
  • Publication number: 20230400452
    Abstract: The present invention provides a chip for sample assay and a sample assay method using same, the chip being capable of assaying a target analyte included in a sample, even with a trace amount of the sample, due to improved efficiency in capture of the target analyte included in the sample.
    Type: Application
    Filed: February 20, 2023
    Publication date: December 14, 2023
    Applicant: TOTAL BIOSENSE INC.
    Inventors: Tae Seok SEO, Van Hau NGUYEN
  • Publication number: 20230396230
    Abstract: In examples, a device comprises a semiconductor die, a thin-film layer, and an air cavity positioned between the semiconductor die and the thin-film layer. The air cavity comprises a resonator positioned on the semiconductor die. A rib couples to a surface of the thin-film layer opposite the air cavity.
    Type: Application
    Filed: August 22, 2023
    Publication date: December 7, 2023
    Inventors: Anindya PODDAR, Hau NGUYEN, Masamitsu MATSUURA
  • Patent number: 11819810
    Abstract: A mixer and method for mixing are provided. The mixer includes a housing including a fluid inlet, an additive inlet, and an outlet. The housing defines a mixing chamber in fluid communication with the fluid inlet, the additive inlet, and the outlet. The mixer also includes an impeller disposed in the mixing chamber. When rotated, the impeller pumps fluid through the fluid inlet. The mixer also includes a slinger disposed in the mixing chamber and configured to receive the fluid from the impeller and to receive an additive from the additive inlet. When rotated, the slinger slings the fluid and the additive radially outwards. The mixer further includes a flush line extending between the mixing chamber and the additive inlet. The flush line is receives, from the mixing chamber, a portion of the fluid pumped by the impeller and to deliver the portion of the fluid to the additive inlet.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: November 21, 2023
    Assignee: Schlumberger Technology Corporation
    Inventors: Rajesh Luharuka, Gocha Chochua, Hau Nguyen-Phuc Pham, Mark Ayyad
  • Publication number: 20230317568
    Abstract: An integrated circuit package includes a die attach pad (DAP) having a top surface and a layer of insulating material applied to the top surface of the DAP. A silicon-on-insulator (SOI) device is mounted on the insulating material using a die attach paste or film. A plurality of leads are coupled to the SOI device using bond wires. A mold compound covers at least a portion of the DAP and the SOI device. The insulating material may be polyimide or polyamide-imide that has been inkjet printed or screen printed on the DAP. The insulating material may be a parylene material that is applied to the top surface of the DAP using chemical vapor deposition. The insulating material has a thickness of 1-25 um and has a breakdown voltage of approximately 250V/um.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 5, 2023
    Inventors: Daiki Komatsu, Anindya Poddar, Hau Nguyen
  • Patent number: 11773843
    Abstract: A reciprocating pump having a power end, a fluid end, and a spacer section interposing the power and fluid ends. The power end includes a structural support frame having structural members that are each a discrete, unitary member. Each structural member forms a portion of a crankcase frame, a portion of a crosshead support frame, and a portion of a support base. The support base portion extends beneath the crosshead support frame and the spacer section.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: October 3, 2023
    Assignee: Schlumberger Technology Corporation
    Inventors: Hau Nguyen-Phuc Pham, Rod Shampine
  • Patent number: 11773844
    Abstract: A crosshead assembly for a reciprocating pump. The crosshead assembly has a crosshead and a connecting rod configured to connect with a crankshaft of the reciprocating pump. Trunnions detachably connect with the connecting rod and facilitate pivotable connection of the connecting rod and the crosshead.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: October 3, 2023
    Assignee: Schlumberger Technology Corporation
    Inventors: Hau Nguyen-Phuc Pham, Rod Shampine
  • Publication number: 20230274993
    Abstract: One example includes a method for fabricating an integrated circuit (IC) device. The method includes fabricating a semiconductor die comprising an IC. The method also includes patterning a film over a portion of the first surface of the semiconductor die. The method also includes attaching a second surface of the semiconductor die opposite the first surface to a substrate. The method further includes depositing molding material over the semiconductor die to cover at least the first surface of the semiconductor die.
    Type: Application
    Filed: February 28, 2022
    Publication date: August 31, 2023
    Inventors: Anindya PODDAR, Amin SIJELMASSI, Hau NGUYEN, Kashyap MOHAN
  • Patent number: 11736085
    Abstract: In examples, a device comprises a semiconductor die, a thin-film layer, and an air cavity positioned between the semiconductor die and the thin-film layer. The air cavity comprises a resonator positioned on the semiconductor die. A rib couples to a surface of the thin-film layer opposite the air cavity.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: August 22, 2023
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Anindya Poddar, Hau Nguyen, Masamitsu Matsuura
  • Publication number: 20230213032
    Abstract: Systems and methods presented herein are directed toward a reciprocating pump. The reciprocating pump includes a fluid section including a plurality of fluid-displacing members. Each fluid-displacing member is configured to displace fluid through the reciprocating pump. The reciprocating pump also includes a power section including a plurality of crossheads. Each crosshead is coupled to a respective fluid-displacing member. The power section is configured to actuate the fluid section by actuating the plurality of crossheads through respective crosshead bores formed through the power section. The power section includes a plurality of structural members. The power section also includes a plurality of pairs of support plates. Each pair of support plates is permanently joined to two structural members of the plurality of structural members. Each support plate comprises a precision interior surface. The power section further includes a plurality of pairs of arcuate crosshead guide sections.
    Type: Application
    Filed: June 15, 2021
    Publication date: July 6, 2023
    Inventors: Rod SHAMPINE, Hau Nguyen-Phuc PHAM
  • Publication number: 20230136784
    Abstract: A described example includes: a package substrate having a die pad with a die side surface and having an opposite backside surface, having leads arranged along two opposite sides and having die pad straps extending from two opposing ends of the die pad. The leads lie in a first plane, a portion of the die pad straps lie in a second plane that is spaced from the first plane and located closer to the die pad, and the die pad lies in a third plane that is spaced from and parallel to the second plane in a direction away from the first plane. A semiconductor die is mounted to the die side surface and mold compound covers the semiconductor die, a portion of the leads, and the die side surface of the die pad, and the backside surface of the die pad exposed from the mold compound.
    Type: Application
    Filed: October 29, 2021
    Publication date: May 4, 2023
    Inventors: Anindya Poddar, Ashok Surendra Prabhu, Edgar Dorotyao Balidoy, Hau Nguyen, Makoto Yoshino, MING LI
  • Publication number: 20230092132
    Abstract: A described example includes: a MEMS component on a device side surface of a first semiconductor substrate; a second semiconductor substrate bonded to the device side surface of the first semiconductor substrate by a first seal patterned to form sidewalls that surround the MEMS component; a third semiconductor substrate having a second seal extending from a surface and bonded to the backside surface of the first semiconductor substrate by the second seal, the second seal forming sidewalls of a gap beneath the MEMS component. A trench extends through the first semiconductor substrate and at least partially surrounds the MEMS component. The third semiconductor substrate is mounted on a package substrate. A bond wire or ribbon bond couples the bond pad to a conductive lead on the package substrate; and mold compound covers the MEMS component, the bond wire, and a portion of the package substrate.
    Type: Application
    Filed: September 21, 2022
    Publication date: March 23, 2023
    Inventors: Hau Nguyen, Anindya Poddar
  • Publication number: 20230086438
    Abstract: A substantially continuous stream of aqueous fluid and a substantially continuous stream of gel having a first concentration are combined to form a substantially continuous stream of gel having a second concentration. The second concentration is substantially lower than the first concentration. The gel having the second concentration may thereafter be utilized in conjunction with a well fracturing operation.
    Type: Application
    Filed: September 26, 2022
    Publication date: March 23, 2023
    Inventors: Rajesh Luharuka, Hau Nguyen-Phuc Pham, Jonathan Wun Shiung Chong, Miguel Angel Lopez, Rod William Shampine, Gocha G. Chochua, Mark Maher Hakim Ayyad
  • Publication number: 20230005880
    Abstract: In a described example, an apparatus includes: a first package substrate having a die mount surface; a semiconductor die flip chip mounted to the first package substrate on the die mount surface, the semiconductor die having post connects having proximate ends on bond pads on an active surface of the semiconductor die, and extending to distal ends away from the semiconductor die having solder bumps, wherein the solder bumps form solder joints to the package substrate; a second package substrate having a thermal pad positioned with the thermal pad over a backside surface of the semiconductor die, the thermal pad comprising a thermally conductive material; and a mold compound covering a portion of the first package substrate, a portion of the second package substrate, the semiconductor die, and the post connects, thermal pad having a surface exposed from the mold compound.
    Type: Application
    Filed: June 30, 2021
    Publication date: January 5, 2023
    Inventors: Anindya Poddar, Ashok Surendra Prabhu, Hau Nguyen, Kurt Edward Sincerbox, Makoto Shibuya
  • Publication number: 20230005881
    Abstract: In a described example, an apparatus includes: a first semiconductor die with a component on a first surface; a second semiconductor die mounted on a package substrate and having a third surface facing away from the package substrate; a solder seal bonded to and extending from the first surface of the first semiconductor die flip chip mounted to the third surface of the second semiconductor die, the solder seal at least partially surrounding the stress sensitive component; a first solder joint formed between the solder seal and the third surface of the second semiconductor die; a second solder joint formed between solder at an end of the post connect and the third surface of the second semiconductor die; and a mold compound covering the second surface of the first semiconductor die, a portion of the second semiconductor die, and an outside periphery of the solder seal.
    Type: Application
    Filed: June 30, 2021
    Publication date: January 5, 2023
    Inventors: Anindya Poddar, Mahmud Chowdhury, Hau Nguyen, Masamitsu Matsuura, Ting-Ta Yen
  • Patent number: 11453146
    Abstract: A substantially continuous stream of aqueous fluid and a substantially continuous stream of gel having a first concentration are combined to form a substantially continuous stream of gel having a second concentration. The second concentration is substantially lower than the first concentration. The gel having the second concentration may thereafter be utilized in conjunction with a well fracturing operation.
    Type: Grant
    Filed: May 12, 2015
    Date of Patent: September 27, 2022
    Assignee: Schlumberger Technology Corporation
    Inventors: Rajesh Luharuka, Hau Nguyen-Phuc Pham, Jonathan Wun Shiung Chong, Miguel Angel Lopez, Rod William Shampine, Gocha G. Chochua, Mark Maher Hakim Ayyad
  • Patent number: 11450638
    Abstract: A microelectronic device has a pillar connected to an external terminal by an intermetallic joint. Either the pillar or the external terminal, or both, include copper in direct contact with the intermetallic joint. The intermetallic joint includes at least 90 weight percent of at least one copper-tin intermetallic compound. The intermetallic joint is free of voids having a combined volume greater than 10 percent of a volume of the intermetallic joint; and free of a void having a volume greater than 5 percent of the volume of the intermetallic joint. The microelectronic device may be formed using solder which includes at least 93 weight percent tin, 0.5 weight percent to 5.0 weight percent silver, and 0.4 weight percent to 1.0 weight percent copper, to form a solder joint between the pillar and the external terminal, followed by thermal aging to convert the solder joint to the intermetallic joint.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: September 20, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Dibyajat Mishra, Ashok Prabhu, Tomoko Noguchi, Luu Thanh Nguyen, Anindya Poddar, Makoto Yoshino, Hau Nguyen
  • Patent number: 11415202
    Abstract: An articulation mechanism for large scale mobile aggregate system equipment. The mechanism includes a screw device that is pivotally secured to an elongated portion of the equipment to drive its movement to and from a collapsed position. The screw device is driven by a screw jack and moved within a housing while the housing itself is pivotally secured to another portion of the equipment. Rollers within the housing may be used to stabilize the lateral movement of the screw device during the opening, closing or self-locking of the elongated portion by the mechanism.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: August 16, 2022
    Assignee: LIBERTY OILFIELD SERVICES LLC
    Inventor: Hau Nguyen-Phuc Pham
  • Patent number: 11367699
    Abstract: A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: June 21, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Hiroyuki Sada, Shoichi Iriguchi, Genki Yano, Luu Thanh Nguyen, Ashok Prabhu, Anindya Poddar, Yi Yan, Hau Nguyen