Abstract: In a described example, an apparatus includes: a first semiconductor die with a component on a first surface; a second semiconductor die mounted on a package substrate and having a third surface facing away from the package substrate; a solder seal bonded to and extending from the first surface of the first semiconductor die flip chip mounted to the third surface of the second semiconductor die, the solder seal at least partially surrounding the stress sensitive component; a first solder joint formed between the solder seal and the third surface of the second semiconductor die; a second solder joint formed between solder at an end of the post connect and the third surface of the second semiconductor die; and a mold compound covering the second surface of the first semiconductor die, a portion of the second semiconductor die, and an outside periphery of the solder seal.

Abstract: In a described example, an apparatus includes: a first package substrate having a die mount surface; a semiconductor die flip chip mounted to the first package substrate on the die mount surface, the semiconductor die having post connects having proximate ends on bond pads on an active surface of the semiconductor die, and extending to distal ends away from the semiconductor die having solder bumps, wherein the solder bumps form solder joints to the package substrate; a second package substrate having a thermal pad positioned with the thermal pad over a backside surface of the semiconductor die, the thermal pad comprising a thermally conductive material; and a mold compound covering a portion of the first package substrate, a portion of the second package substrate, the semiconductor die, and the post connects, thermal pad having a surface exposed from the mold compound.

Abstract: A substantially continuous stream of aqueous fluid and a substantially continuous stream of gel having a first concentration are combined to form a substantially continuous stream of gel having a second concentration. The second concentration is substantially lower than the first concentration. The gel having the second concentration may thereafter be utilized in conjunction with a well fracturing operation.

Abstract: A microelectronic device has a pillar connected to an external terminal by an intermetallic joint. Either the pillar or the external terminal, or both, include copper in direct contact with the intermetallic joint. The intermetallic joint includes at least 90 weight percent of at least one copper-tin intermetallic compound. The intermetallic joint is free of voids having a combined volume greater than 10 percent of a volume of the intermetallic joint; and free of a void having a volume greater than 5 percent of the volume of the intermetallic joint. The microelectronic device may be formed using solder which includes at least 93 weight percent tin, 0.5 weight percent to 5.0 weight percent silver, and 0.4 weight percent to 1.0 weight percent copper, to form a solder joint between the pillar and the external terminal, followed by thermal aging to convert the solder joint to the intermetallic joint.

Abstract: An articulation mechanism for large scale mobile aggregate system equipment. The mechanism includes a screw device that is pivotally secured to an elongated portion of the equipment to drive its movement to and from a collapsed position. The screw device is driven by a screw jack and moved within a housing while the housing itself is pivotally secured to another portion of the equipment. Rollers within the housing may be used to stabilize the lateral movement of the screw device during the opening, closing or self-locking of the elongated portion by the mechanism.

Abstract: A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line.

Abstract: In examples, a device comprises a semiconductor die, a thin-film layer, and an air cavity positioned between the semiconductor die and the thin-film layer. The air cavity comprises a resonator positioned on the semiconductor die. A rib couples to a surface of the thin-film layer opposite the air cavity.

Abstract: A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line.

Abstract: A system and methodology facilitates the handling of oilfield materials in a space efficient manner. The oilfield materials are delivered without blowers to at least one modular silo. Each modular silo comprises an outer housing defining an enclosed interior. A vertical conveyor is positioned within the enclosed interior and is used to lift the oilfield material from a silo inlet to an upper portion of the modular silo without utilizing airflow to carry the oilfield materials. Once the oilfield materials are disposed within the upright modular silo, the outflow of oilfield materials through a silo outlet may be controlled so as to selectively release the desired amount of material into a blender or other suitable equipment.

Abstract: A microelectronic device has a pillar connected to an external terminal by an intermetallic joint. Either the pillar or the external terminal, or both, include copper in direct contact with the intermetallic joint. The intermetallic joint includes at least 90 weight percent of at least one copper-tin intermetallic compound. The intermetallic joint is free of voids having a combined volume greater than 10 percent of a volume of the intermetallic joint; and free of a void having a volume greater than 5 percent of the volume of the intermetallic joint. The microelectronic device may be formed using solder which includes at least 93 weight percent tin, 0.5 weight percent to 5.0 weight percent silver, and 0.4 weight percent to 1.0 weight percent copper, to form a solder joint between the pillar and the external terminal, followed by thermal aging to convert the solder joint to the intermetallic joint.

Abstract: In described examples, a method of printing repassivation onto a substrate includes depositing an ink comprising particles of a repassivation material onto specified locations on a surface of the substrate using an inkjet printer, and curing the repassivation material.

Abstract: A reciprocating pump having a power end, a fluid end, and a spacer section interposing the power and fluid ends. The power end includes a structural support frame having structural members that are each a discrete, unitary member. Each structural member forms a portion of a crankcase frame, a portion of a crosshead support frame, and a portion of a support base. The support base portion extends beneath the crosshead support frame and the spacer section.

Abstract: A crosshead assembly for a reciprocating pump. The crosshead assembly has a crosshead and a connecting rod configured to connect with a crankshaft of the reciprocating pump. Trunnions detachably connect with the connecting rod and facilitate pivotable connection of the connecting rod and the crosshead.

Abstract: A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line.

Abstract: A microelectronic device has a pillar connected to an external terminal by an intermetallic joint. Either the pillar or the external terminal, or both, include copper in direct contact with the intermetallic joint. The intermetallic joint includes at least 90 weight percent of at least one copper-tin intermetallic compound. The intermetallic joint is free of voids having a combined volume greater than 10 percent of a volume of the intermetallic joint; and free of a void having a volume greater than 5 percent of the volume of the intermetallic joint. The microelectronic device may be formed using solder which includes at least 93 weight percent tin, 0.5 weight percent to 5.0 weight percent silver, and 0.4 weight percent to 1.0 weight percent copper, to form a solder joint between the pillar and the external terminal, followed by thermal aging to convert the solder joint to the intermetallic joint.

Abstract: A mobile oilfield material transfer unit includes a chassis having a gooseneck and support base, the support base including a first portion and second portion, and the chassis further comprising a rear axle suspension system coupled with at least two wheels for movably supporting the chassis. The mobile oilfield material transfer unit further includes an erecting mast assembly having a mast movably connected with the chassis proximate to the second portion, and an actuator system coupled with the mast and with the chassis for moving the mast between a horizontal position and a vertical position. At least two vertical conveyor assemblies may be coupled with the erecting mast and moveable between the horizontal position and the vertical position, and at least two horizontal conveyor systems may be coupled with the support frame and engageable with the at least two vertical conveyor assemblies.

Abstract: A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line.

Abstract: An articulation mechanism for large scale mobile aggregate system equipment. The mechanism includes a screw device that is pivotally secured to an elongated portion of the equipment to drive its movement to and from a collapsed position. The screw device is driven by a screw jack and moved within a housing while the housing itself is pivotally secured to another portion of the equipment. Rollers within the housing may be used to stabilize the lateral movement of the screw device during the opening, closing or self-locking of the elongated portion by the mechanism.

Abstract: A system is disclosed. The system is provided with an oilfield material reservoir, a fluid nozzle, and a fluid supplier. The oilfield material reservoir is provided with an opening for receiving an oilfield material and an orifice for discharging the oilfield material. The fluid nozzle is positioned adjacent to the orifice to direct a fluid flow through the orifice, and the fluid supplier is connected to the fluid nozzle.

Abstract: A mobile oilfield material transfer unit includes a chassis having a gooseneck and support base, the support base including a first portion and second portion, and the chassis further comprising a rear axle suspension system coupled with at least two wheels for movably supporting the chassis. The mobile oilfield material transfer unit further includes an erecting mast assembly having a mast movably connected with the chassis proximate to the second portion, and an actuator system coupled with the mast and with the chassis for moving the mast between a horizontal position and a vertical position. At least two vertical conveyor assemblies may be coupled with the erecting mast and moveable between the horizontal position and the vertical position, and at least two horizontal conveyor systems may be coupled with the support frame and engageable with the at least two vertical conveyor assemblies.