Abstract: A semiconductor structure and a manufacturing method thereof are provided. The method includes the following steps. A plurality of conductive balls is placed over a circuit substrate, where each of the conductive balls is placed over a contact area of one of a plurality of contact pads that is accessibly revealed by a patterned mask layer. The conductive balls are reflowed to form a plurality of external terminals with varying heights connected to the contact pads of the circuit substrate, where a first external terminal of the external terminals formed in a first region of the circuit substrate and a second external terminal of the external terminals formed in a second region of the circuit substrate are non-coplanar.

Abstract: A semiconductor structure includes a solder resist layer disposed on a circuit substrate and partially covering contact pads of the circuit substrate, and external terminals disposed on the solder resist layer and extending through the solder resist layer to land on the contact pads. The external terminals include a first external terminal and a second external terminal which have different heights. A first interface between the first external terminal and corresponding one of the contact pads underlying the first external terminal is less than a second interface between the second external terminal and another corresponding one of the contact pads underlying the second external terminal.

Abstract: Implementations of the present application provide a semiconductor device, a fabrication method and a memory system. The semiconductor device includes a plurality of semiconductor pillars arranged in an array and a word line structure. The plurality of semiconductor pillars extend along a first direction and include at least one side face, wherein the plurality of semiconductor pillars are arranged in rows along a second direction perpendicular to the first direction. The word line structure is located between a first row and a second row of semiconductor pillars that are adjacent, and includes a first word line structure and a second word line structure spaced apart from the first word line structure, wherein the first word line structure is connected with a side face of the first row of semiconductor pillars, and the second word line structure is connected with a side face of the second row of semiconductor pillars.

Abstract: An elbow cable connector includes: a cable assembly comprising a head, an outer conductor extending forwards, an insulator received in the outer conductor, an inner conductor received in the insulator, a cable mechanically connected with the inner conductor and extending downwards, and a rear cover; and an outer shell surrounding the outer conductor, the head, and an upper end of the cable; wherein the head is of a die casting and has a fixing hole running forwards and a receiving groove opening rearwards and downwards, the outer conductor has a rear flange on a rear end thereof, the outer conductor goes across the fixing hole and the rear flange presses against a front face of the receiving groove, a rear part of the insulator and the upper end of the cable are received in the receiving groove, and the rear cover presses forward and seal the receiving groove.

Abstract: A method for maintaining lamellar structure of cell, configured to manufacture a lamellar cell product, comprises the following steps of: seeding a predetermined number of cells in a culture device containing a first culture medium and culturing the predetermined number of cells for a predetermined time to form a cell planar structure; placing a mold in the culture device to cover at least an outer portion of the cell planar structure; adding a gel into the culture device with the mold to envelop the cell planar structure; and separating the gel and the cell planar structure enveloped therein from the culture device and the mold to form the lamellar cell product.

Abstract: Disclosed are a method and an apparatus for optimizing and testing a harness layout of a battery swapping electrical interface. The method includes: obtaining a first distance, a second distance and initial floating data of the battery swapping electrical interface; adjusting the first distance and the second distance to obtain first floating data of the battery swapping electrical interface again; repeatedly inserting or pulling the plug into or out of the socket of the battery swapping electrical interface; obtaining second floating data of the battery swapping electrical interface after repeatedly inserting or pulling the plug into or out of the socket for a preset number of times; and determining the current first distance and second distance as optimal distances if it is judged that the second floating data is in the second index interval.

Abstract: Provided is an X ray image processing method including the following. One of computing modules stored in an X ray device is activated, in which the one of the computing modules corresponds to a measurement area. The measurement area corresponding to the one of the computing modules is measured by an image measurement module, and a measurement signal is produced. The measurement signal is transmitted to a computing unit by the image measurement module. A measurement image is computed by the computing unit according to the measurement signal, and is stored in a first storage unit in the X ray device. The one of the computing modules is written to the computing unit. The measurement image is transmitted to the computing unit by the first storage unit. The measurement image is analyzed by the computing unit using the one of the computing modules, and an analysis image is generated.

Abstract: Disclosed are three-dimensional (3D) memory devices and fabricating methods thereof. In some embodiments, a disclosed memory device comprises a wafer structure having a sealing region and a chip region. The wafer structure comprises a substrate, a memory string array on a first side of the substrate in the chip region, a first protection structure and a second protection structure on the first side of the substrate in the sealing region, and a first contact and a second contact extending through the substrate in the sealing region. The first contact is in contact with the first protection structure, and the second contact is in contact with the second protection structure.

Abstract: Disclosed are three-dimensional (3D) memory devices and fabricating methods thereof. In some embodiments, a disclosed memory device comprises a wafer structure having a sealing region and a chip region. The wafer structure comprises a substrate, a memory string array on a first side of the substrate in the chip region, a first protection structure and a second protection structure on the first side of the substrate in the sealing region, and a first contact and a second contact extending through the substrate in the sealing region. The first contact is in contact with the first protection structure, and the second contact is in contact with the second protection structure.

Abstract: Examples of the present application provide a semiconductor device, a memory system and a fabrication method of a semiconductor device. The semiconductor device includes: a silicon contact structure; a metal silicide layer on one side of the silicon contact structure; a bit line structure located on the side of the metal silicide layer away from the silicon contact structure and extending in a first direction; and a sidewall structure covering the opposite sides of the bit line structure and the opposite sides of the metal silicide layer in the first direction and extending further to cover the opposite sides, in the first direction, of the first end of the silicon contact structure proximate to the metal silicide layer.

Abstract: A board connector includes: a metal housing having a base portion, four mating tubes opening forward, and four receiving grooves opening through a rear face and a bottom face of the base portion and communicating with corresponding mating tubes; four terminal assemblies received and retained in corresponding receiving grooves; and a rear plate, wherein the base portion of the metal housing has a rear guiding slot and a supporting portion at each side wall thereof, the supporting portions extend horizontally, the rear plate slides into the rear guiding slots from the bottom face, and the supporting portions block a bottom face of the rear plate from moving downwardly.

Abstract: An image analysis method and an image analysis system are provided. The image analysis system includes an X-ray sensor, a computing device and a display device. The computing device is coupled to the X-ray sensor. The computing device includes a processing module and a memory module. The display device is coupled to the computing device. The processing module executes an image processing unit and an image analysis unit stored in the memory module to perform an image analysis according to dual-energy image data generated by the X-ray sensor, and outputs a lesion judgment result to the display device.

Abstract: A board coaxial connector includes: a first insulator, a first inner conductor retained in the first insulator and having a mating portion and a first connecting portion extending out of the first insulator, a first outer conductor having a third connecting portion and retaining the first insulator, a second outer conductor mounted on the circuit board and having a fourth connecting portion, and a second inner conductor having a second connecting portion and a tail portion mounting on the circuit board, wherein the first connecting portion is connected with the second connecting portion, the third connecting portion is connected with the fourth connecting portion, and the first connecting portion of the first inner conductor is movable to slightly deviate from an axis of the second inner conductor.

Abstract: A farmland reference crop evapotranspiration prediction method based on uncertainty of meteorological factors, includes: S1. acquiring a set number of groups of weather forecast data of a prediction region within a preset time period; S2. inputting each group of weather forecast data into a Bayesian probability forecast system to obtain corrected weather forecast data; and S3. inputting each group of the corrected weather forecast data into a trained RBF neural network, and predicting to obtain a farmland reference crop evapotranspiration. In the present invention, the Bayesian probability forecast system is configured to correct the weather forecast data and eliminate uncertainty of weather forecast data to obtain the accurate reference crop evapotranspiration forecasted by the RBF neural network using these data.

Abstract: An electronic device configured to detect an object to be detected includes at least one light source and a plurality of sensors. The at least one light source is arranged on a first plane and illuminates the object to be detected. The plurality of sensors are arranged on a second plane and surround the object to be detected. The plurality of sensors are stitched together. The first plane is different from the second plane.

Abstract: A generation system and a generation method for a perspective image are disclosed. The present disclosure acquires a tomographic data set of a target object, determines a rotation information corresponding to a designated perspective of the target object, makes the perspective face a projection plane by rotating the tomographic data set or moving the projection plane based on the rotation information, and merges multiple slice images of the tomographic data set toward the projection plane to obtain a 2D image of the perspective of the target object. The present disclosure can effectively generate the 2D image of the designated perspective of the target object.

Abstract: A three-dimensional (3D) semiconductor device includes a first semiconductor structure including a first device layer, a doped semiconductor layer, and an insulating layer. The doped semiconductor layer is located between the first device layer and the insulating layer. The insulating layer includes oxygen or carbon.

Abstract: A control method for a detection system. The detection system includes a detection device. The detection device includes multiple scanning lines. The control method includes the following steps: first image data is generated through the detection device, and at least a part in the first image data corresponds to a key area; a first part corresponding to the key area in the scanning lines is controlled by the detection device in a first scanning manner; a second part corresponding to an area other than the key area in the scanning lines is controlled by the detection device in a second scanning manner. Second image data is generated by the detection device. A scanning frequency of the first scanning manner is lower than a scanning frequency of the second scanning manner.

Abstract: A coaxial connector includes: a shell integrally formed as a unitary piece; and an insulator and a conductive contact retained to the insulator, the contact having an upper contacting portion and a lower contacting portion extending out of the insulator, wherein the shell includes a first mating tube opening upwards, a second mating tube opening upward and disposed in the first mating tube, a receiving cavity opening downward, and a third mating tube disposed in the receiving space, the insulator is assembled and fixed in the shell, and the upper contacting portion is exposed to the second mating tube and the lower contacting portion is exposed to the third mating tube.

Abstract: Three-dimensional (3D) NAND memory devices and methods are provided. In one aspect, a fabrication method includes preparing a stacked device having a first array device and a second array device, forming an opening on a back side of the second array device, and forming one or more contact pads in the opening. The first array device includes first front pads on a face side of the first array device and first back pads on a back side of the first array device. The second array device includes second front pads on a face side of the second array device and bonded with the first back pads. The one or more contact pads are disposed at a level proximate to the second front pads with respect to the first array device.