Abstract: A package-integrated EMI compartment shielding structure includes an encapsulating member disposed on a mounting surface of a substrate. The substrate has a ground pad exposedly arranged thereon. The encapsulating member, who defines a peripheral surface, covers the ground pad and encapsulates at least one electronic element. A compartment structure is disposed in the encapsulating member, electrically connecting the ground pad and substantially dividing the encapsulating member into at least two package compartments. The terminal portions of the compartment structure are arranged within the encapsulating member proximal to yet without compromising the peripheral surface. A notch is disposed into the encapsulating member from the peripheral surface corresponding to the location of the terminal portions of the compartment structure to expose the lateral surface thereof across the thickness of the encapsulating member.

Abstract: Selecting an array from among a plurality of arrays in a memory as a reference array. An exemplary method includes evaluating memory cells within the reference array to select a first reference cell associated with a first operation of the memory, and repeating the evaluating and the selecting to select a second reference cell from within the reference array, the second reference cell being associated with a second operation of the memory.

Abstract: An apparatus and a method for providing fluid communication between a process chamber and a dry pump without contamination problem are disclosed. The apparatus utilizes a conduit that has at least one gate valve installed therein for opening or closing the conduit and a T-shaped cold trap to collect large size contaminating particles. The present invention apparatus is effective in preventing particle contamination to the process chamber by a siphoning or backsteam effect when a dry pump failure occurs. While the present invention apparatus and method may be used in any deposition process which produces reaction by-products, or contaminating particles, it is particularly suitable for use in a TEOS oxide deposition process.