Abstract: In one embodiment, a semiconductor package structure includes a heat dissipative element connected to an internal circuit. The semiconductor package includes a semiconductor chip, an interconnection substrate, and a heat dissipative element. The semiconductor chip includes an internal circuit and inner pads that connect the internal circuit. The interconnection substrate is disposed below the semiconductor chip and includes input/output terminals. At least one of the inner pads is electrically connected to at least one of the input/output terminals. The heat dissipative element is disposed on the semiconductor chip and is electrically connected to at least one of the inner pads.

Abstract: Provided is a semiconductor memory module allowing a filling member formed between a module substrate and memory chips mounted on the module substrate to completely fill the space between the module substrate and the memory chips. According to embodiments of the present invention, the semiconductor memory module includes a module substrate having at least one memory chip mounted on the substrate such that its edges are oblique to major and minor axes bisecting the module substrate. The oblique orientation allows for an improved opening between memory chips formed on the substrate so that the filling member may be properly formed between the module substrate and the memory chips to prevent voids where the filling member is not formed.

Abstract: A cooling apparatus for a circuit module having a substrate extending axially with an IC chip of a first type and IC chips of a second type mounted thereon, comprising: a first heat spreading element disposed to form a heat conduction path with the IC chip of the first type; and a second heat spreading element disposed to form a heat conduction path with the IC chips of the second type, wherein there is at least one IC chip of the second type mounted axially away from opposite sides of the IC chip of the first type, wherein the first type of IC chip is capable of generating a larger amount of heat than the second type of IC chips, and the first heat spreading element has a higher thermal conductivity than the second heat spreading element.

Abstract: In one embodiment, a heat-dissipating member includes a heat-dissipating body, a heat-transferring body and an attaching member. The heat-dissipating body externally dissipates heat originating in a heat source. The heat-transferring member is interposable between the heat-dissipating body and the heat source. The attaching member is placed on a surface of the heat-dissipating body and corresponds to the heat-transferring body so as to couple the heat-transferring member to the heat-dissipating body. Thus, heat generated from the heat source, such as a semiconductor element, rapidly dissipates through the heat-transferring member and externally through the heat-dissipating body.

Abstract: An apparatus and method are provided for setting a printing option using a preview image. Setting the printing option includes an image preview unit displaying a preview image corresponding to printing data and enabling the preview image to be manipulated for setting a printing setting, a control unit controlling printing of the preview image according to the printing setting of the manipulated preview image, and a printing option setting unit setting a printing option, wherein the control unit applies the printing setting of the preview image to the printing option of the printing option setting unit.

Abstract: A method for matching an upper protocol layer to a high speed serial bus is provided. The method includes the steps of (a) determining whether the length of the data packet transferred from an upper layer to a node of the high speed serial bus is no less than a predetermined length, (b) allocating a channel of the bus and transferring data by an isochronous transfer service when it is determined that the length of the data packet is no less than the predetermined length, and (c) transferring data by an asynchronous transfer service when it is determined that the length of the data packet is less than the predetermined length. According to the above method, it is possible to match an existing communications application where it is not specified which service of the high speed serial bus is to be used to the high speed serial bus, while maintaining transparency of communication protocol and to effectively use the channel resources of the bus.

Abstract: A data transfer method for matching an upper protocol layer to a high speed serial bus. In the data transfer method, it is determined whether transfer data to be transferred from the upper protocol layer to the high speed serial bus, is stream data that is transferred to a predetermined node which the bus can identify, and form data flow defined by a predetermined flow classifier. If the transfer data is determined to be stream data, a channel is allocated in the bus and the transfer data is transferred through the channel. However, if the transfer data is determined not to be stream data, the transfer data is transferred by an asynchronous transfer method according to the high speed serial bus standard, without allocating a channel. Due to a channel Matron of the high speed serial bus, an upper protocol layer of existing applications which do not specify a service to provide, can be effectively matched to the high speed serial bus.

Abstract: A method of transferring data between networks includes storing a connection path set between predetermined data from a first network and a predetermined address in a second network during initial connection between the first and second networks, and transferring the predetermined data from the first network along the stored path. Accordingly, data transmission speed is faster by pre-mapping a data path between networks, and hardware and software loads on the gateway for repeating data between networks can be reduced.

Abstract: A biosensor for measuring gas-phase organic chemicals rapidly and accurately. The biosensor includes a thick film electrochemical device having an insulating substrate, electrodes formed on the substrate, connecting pads for the electrodes and an insulating layer, and a responsive membrane formed on the electrode portion of the electrochemical device. The responsive membrane is provided with a moisture-absorbing gel layer in which an enzyme for reacting with the gas-phase organic chemical is immobilized.

Abstract: A biosensor for measuring alcohol concentration includes an insulating substrate and an amperometric device formed on the insulation substrate, having a plurality of conductive lines and connective pads and a plurality of electrodes. An enzyme immobilized layer is formed on one of the plurality of electrodes of the amperometric device and an enzyme paste is printed on the amperometric device. An outer membrane is formed on the substrate having the plurality of electrodes for forming an electrode system and an insulating membrane is formed on the substrate, except on the outer membrane.