Patents by Inventor Hee Lim

Hee Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10800586
    Abstract: The present invention provides a method and apparatus for deterring pets or other animals from biting or chewing into medication containers. In some embodiments, the invention consists of two or more conductive metal sheets or strips in layers around the side of the container, which are wired to complete a circuit when pressed by the force of an animal's bite or touched by an animal's tongue. In some embodiments, the sheets or strips are spaced or held apart so that a normal human grip would not have sufficient force to complete the circuit. In some embodiments, the device slides onto the medication container with a friction fit, and is removable for use on future containers. In some embodiments, the circuit includes a battery-powered alarm to deter the animal. In other embodiments, the circuit delivers a mild electrical shock to the animal's mouth or tongue through the metal strips or sheets.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: October 13, 2020
    Inventors: Eric Jon Voth, Jason Andrew Voth, Joseph William Nelson, Christopher Ronald Nelson, Justin Yong Lim, Karis Yong Hee Lim, Andrew Nicholas Dillner, Norah Elizabeth Dillner, Scott Eric Simenson
  • Publication number: 20200321321
    Abstract: A displaying apparatus including: a panel substrate; a plurality of light emitting devices arranged on the panel substrate; and at least one connection tip disposed on one surface of each of the light emitting devices. Each of the light emitting devices includes a light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer interposed between the first and second conductivity type semiconductor layers; and first and second electrode pads disposed on the light emitting structure.
    Type: Application
    Filed: June 17, 2020
    Publication date: October 8, 2020
    Inventors: Motonobu TAKEYA, Seong Su SON, Jong IK LEE, Jae Hee LIM, Jong Hyeon CHAE, Seung Sik HONG
  • Patent number: 10797027
    Abstract: A displaying apparatus including: a panel substrate; a plurality of light emitting devices arranged on the panel substrate; and at least one connection tip disposed on one surface of each of the light emitting devices. Each of the light emitting devices includes a light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer interposed between the first and second conductivity type semiconductor layers; and first and second electrode pads disposed on the light emitting structure.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: October 6, 2020
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Motonobu Takeya, Seong Su Son, Jong Ik Lee, Jae Hee Lim, Jong Hyeon Chae, Seung Sik Hong
  • Publication number: 20200312878
    Abstract: In a method of manufacturing a vertical semiconductor device, an insulation layer and a sacrificial layer are alternatively and repeatedly formed on a substrate to define a structure. The structure is etched to form a hole therethrough that exposes the substrate. A first semiconductor pattern is formed in a lower portion of the hole, and a blocking pattern, a charge storage pattern, a tunnel insulation pattern and a first channel pattern are formed on a sidewall of the hole. A second channel pattern is formed on the first channel pattern and the semiconductor pattern, and a second semiconductor pattern is formed on a portion of the second channel pattern on the semiconductor pattern to define an upper channel pattern including the second channel pattern and the second semiconductor pattern. The sacrificial layers are replaced with a plurality of gates, respectively, including a conductive material.
    Type: Application
    Filed: June 16, 2020
    Publication date: October 1, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung-il CHANG, Jun-Hee Lim, Yong-Seok Kim, Tae-Young Kim, Jae-Sung Sim, Su-Jin Ahn, Ji-Yeong Hwang
  • Publication number: 20200299457
    Abstract: There are provided a polyester based copolymer resin capable of having an excellent shrinkage rate and being heat-shrunk at a low temperature, and a molded product comprising the same. The polyester based copolymer resin includes a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a predetermined residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate and a predetermined residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol.
    Type: Application
    Filed: June 10, 2020
    Publication date: September 24, 2020
    Inventors: Seol-Hee LIM, Sung-Gi KIM
  • Publication number: 20200303401
    Abstract: A semiconductor device includes a lower stack structure that includes a lower word line, an upper stack structure that is on the lower stack structure and includes an upper word line, a decoder that is adjacent to the lower stack structure and the upper stack structure, a signal interconnection that is connected to the decoder, a lower selector that is connected to the signal interconnection and further connected to the lower word line, and an upper selector that is connected to the signal interconnection, isolated from direct contact with the lower selector, and further connected to the upper word line.
    Type: Application
    Filed: July 31, 2019
    Publication date: September 24, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kohji Kanamori, Yong Seok Kim, Kyung Hwan Lee, Jun Hee Lim, Jee Hoon Han
  • Patent number: 10776494
    Abstract: An image forming apparatus and method for verifying forgery or falsification of an execution file by using a trusted platform module configured to generate an encryption key are provided. The method includes generating the encryption key by using a hash value for an operating system (OS) kernel image, the generating being performed by the trusted platform module, and verifying forgery or falsification of the execution file based on the generated encryption key.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: September 15, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hyun-sook Rhee, Kang-hee Lim
  • Publication number: 20200279979
    Abstract: A light emitting device including a first light emitting cell, a second light emitting cell, and a third light emitting cell each including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, pads electrically connected to the first, second, and third light emitting cells, a first wavelength converter configured to convert a wavelength of light emitted from the first light emitting cell into a first wavelength, and a second wavelength converter configured to convert a wavelength of light emitted from the second light emitting cell into a second wavelength longer than the first wavelength, in which the first light emitting cell has a larger area than the third light emitting cell, and the second light emitting cell has a larger area than the first light emitting cell.
    Type: Application
    Filed: September 27, 2018
    Publication date: September 3, 2020
    Inventors: Chung Hoon LEE, Sung Su SON, Jong Ik LEE, Jae Hee LIM, Motonobu TAKEYA, Seung Sik HONG
  • Publication number: 20200277459
    Abstract: There is provided a heat shrinkable film comprising a polyester based copolymer capable of having an excellent shrinkage rate and being heat shrunk at a low temperature. The heat shrinkable film according to an exemplary embodiment of the present invention includes a polyester based copolymer, wherein the polyester based copolymer includes: a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate represented by the following Chemical Formula 1 and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol represented by the following Chemical Formula 2.
    Type: Application
    Filed: May 19, 2020
    Publication date: September 3, 2020
    Inventors: Seol-Hee LIM, Sung-Gi KIM, Ji Yea LEE
  • Patent number: 10763167
    Abstract: A vertical semiconductor device includes a conductive pattern structure in which insulation patterns and conductive patterns alternately and repeatedly stacked on the substrate. The conductive pattern structure includes an edge portion having a stair-stepped shape. Each of the conductive patterns includes a pad region corresponding to an upper surface of a stair in the edge portion. A pad conductive pattern is disposed to contact a portion of an upper surface of the pad region. A mask pattern is disposed on an upper surface of the pad conductive pattern. A contact plug penetrates the mask pattern to contact the pad conductive pattern.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: September 1, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung-Hwan Lee, Chang-Seok Kang, Yong-Seok Kim, Jun-Hee Lim, Kohji Kanamori
  • Patent number: 10749078
    Abstract: A light emitting diode including a side reflection layer. The light emitting diode includes: a semiconductor stack and a light exit surface having a roughened surface through which light generated from an active layer is emitted; side surfaces defining the light exit surface; and a side reflection layer covering at least part of the side surfaces. The light exit surface is disposed over a first conductivity type semiconductor layer opposite to the ohmic reflection layer, all layers from the active layer to the light exit surface are formed of gallium nitride-based semiconductors, and a distance from the active layer to the light exit surface is 50 ?m or more.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: August 18, 2020
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Jong Min Jang, Chae Hon Kim, Chang Youn Kim, Jae Hee Lim
  • Publication number: 20200255611
    Abstract: There is provided a composition for forming a heat shrinkable film capable of providing a heat shrinkable film capable of having an excellent shrinkage rate and being heat-shrunk at a low temperature. The composition for forming a heat shrinkable film includes a polyethylene terephthalate (PET) resin having an inherent viscosity of 0.50 to 1.2 dl/g, and a polyester based copolymer including a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate represented by the following Chemical Formula 1 and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol represented by the following Chemical Formula 2.
    Type: Application
    Filed: April 24, 2020
    Publication date: August 13, 2020
    Inventors: Seol-Hee LIM, Sung-Gi KIM
  • Patent number: 10723852
    Abstract: There is provided a composition for forming a heat shrinkable film capable of providing a heat shrinkable film capable of having an excellent shrinkage rate and being heat-shrunk at a low temperature. The composition for forming a heat shrinkable film includes a polyethylene terephthalate (PET) resin having an inherent viscosity of 0.50 to 1.2 dl/g, and a polyester based copolymer including a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate represented by the following Chemical Formula 1 and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol represented by the following Chemical Formula 2.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: July 28, 2020
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Seol-Hee Lim, Sung-Gi Kim
  • Patent number: 10717811
    Abstract: A polyester based copolymer resin which can be used a heat shrinkable film is disclosed. The polyester based copolymer resin includes a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid, and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol. The heat shrinkable film including polyester based copolymer resin has a shrinkage initiation temperature of 60° C. or less, the maximum heat shrinkage rate at 60° C. of 4% or more, and the maximum heat shrinkage rate at 90° C. of 80% or more.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: July 21, 2020
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Seol-Hee Lim, Sung-Gi Kim
  • Publication number: 20200223827
    Abstract: The present technology provides 3,3-difluoroallylamines or pharmaceutically acceptable salts thereof, preparation processes thereof, pharmaceutical compositions comprising the same, and uses thereof. The 3,3-difluoroallylamines or their pharmaceutically acceptable salts exhibit potent inhibitory activity on VAP-1 and therefore can be usefully applied, e.g., for the treatment and prophylaxis of nonalcoholic hepatosteatosis (NASH).
    Type: Application
    Filed: December 12, 2019
    Publication date: July 16, 2020
    Inventors: Tae Dong HAN, Hee Jae TAK, Eun Kyung KIM, Eui Chul LEE, Sol PARK, Hyok Jun CHO, Cheol Hee LIM, So Young KIM, Hyun Ho CHOI, Da Na JEONG, Na Yeon YANG, Na Ry HA
  • Publication number: 20200215301
    Abstract: A cannula includes a first segment configured to reside entirely within a vessel. The first segment includes a proximal exit opening disposed nearer to the heart, and multiple fenestrations disposed distally away from the proximal exit opening near a cannulation site. The fenestrations in combination with the proximal exit opening enable simultaneous perfusion of blood into the cannulated vessel along proximal and distal directions. During a medical procedure, blood introduced into a vessel (e.g., the femoral artery) by way of the cannula can exit the cannula in a manner that provides concurrent blood flow in a first set of directions proximally towards the heart and a second set of directions distally away from the heart. Radially displaceable anchoring elements positionable adjacent to the vessel's superficial wall aid retention of the first segment in the vessel. The fenestrations and/or anchoring elements can be arranged obliquely around portions of the cannula's circumference.
    Type: Application
    Filed: October 3, 2019
    Publication date: July 9, 2020
    Inventors: Tar Toong Victor CHAO, Chong Hee LIM, Hock Heng Daniel TAN, Tze Kiat NG
  • Publication number: 20200219709
    Abstract: The present invention provides a method enabling a quantitative analysis of a polymer by MALDI mass spectrometry, and a method for manufacturing a sample for MALDI mass spectrometry for a quantitative analysis of a polymer. To that end, the methods can increase reproducibility of a MALDI spectrum by making uniform the thickness of a sample affecting the pattern in a polymer MALDI spectrum. The sample according to the present invention is applicable also to a commercial MALDI-TOF instrument, and, thus, can quantitatively analyze a polymer in a more efficient and faster manner.
    Type: Application
    Filed: September 11, 2018
    Publication date: July 9, 2020
    Applicant: LG Chem, Ltd.
    Inventors: Yongjin Bae, Jong Chan Kim, Yeu Young Youn, Young Hee Lim, Hye Sung Cho
  • Patent number: 10696806
    Abstract: A heat shrinkable film comprising a polyester based copolymer is provided.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: June 30, 2020
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Seol-Hee Lim, Sung-Gi Kim, Ji Yea Lee
  • Patent number: 10700092
    Abstract: In a method of manufacturing a vertical semiconductor device, an insulation layer and a sacrificial layer are alternatively and repeatedly formed on a substrate to define a structure. The structure is etched to form a hole therethrough that exposes the substrate. A first semiconductor pattern is formed in a lower portion of the hole, and a blocking pattern, a charge storage pattern, a tunnel insulation pattern and a first channel pattern are formed on a sidewall of the hole. A second channel pattern is formed on the first channel pattern and the semiconductor pattern, and a second semiconductor pattern is formed on a portion of the second channel pattern on the semiconductor pattern to define an upper channel pattern including the second channel pattern and the second semiconductor pattern. The sacrificial layers are replaced with a plurality of gates, respectively, including a conductive material.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: June 30, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung-Il Chang, Jun-Hee Lim, Yong-Seok Kim, Tae-Young Kim, Jae-Sung Sim, Su-Jin Ahn, Ji-Yeong Hwang
  • Publication number: 20200202916
    Abstract: A memory device includes memory cells, the memory cells each including a first gate, a second gate electrically isolated from the first gate, a first gate insulating layer including a data storage layer having a ferroelectric material and disposed between the first gate and a channel region, a second gate insulating layer disposed between the second gate and the channel region, a first switching cell connected between the memory cells and a source line, and a second switching cell connected between the memory cells and a bit line. The second switching cell includes a third gate, a fourth gate, a third gate insulating layer not including a data storage layer having the ferroelectric material and the third gate disposed between the third gate and the channel region, and a fourth gate insulating layer disposed between the fourth gate and the channel region.
    Type: Application
    Filed: July 25, 2019
    Publication date: June 25, 2020
    Inventors: Kyung Hwan LEE, Seung Hyun KIM, Yong Seok KIM, Jun Hee LIM, Kohji KANAMORI