Abstract: In a nonvolatile memory device and a method of fabricating the same, the nonvolatile memory device may include a semiconductor substrate having a device isolation layer defining an active region, a pair of nonvolatile memory transistors on the active region, a select transistor disposed between the pair of nonvolatile memory transistors, and floating diffusion regions on the active region between each of the nonvolatile memory transistors and the select transistor. The select transistor may include a gate insulation layer having a thickness and a material that are the same as those of gate insulation layers of the nonvolatile memory transistors. The resulting nonvolatile memory device may include a memory cell unit that includes the pair of nonvolatile memory transistors and the select transistor.

Abstract: A nonvolatile memory cell includes a source region and a drain region which are disposed in a semiconductor substrate and spaced apart from each other, a source selection line and a drain selection line disposed over the semiconductor substrate between the source region and the drain region. The source selection line and the drain selection line are disposed adjacent to the source region and the drain region, respectively. The nonvolatile memory cell further includes a cell gate pattern disposed over the semiconductor substrate between the source selection line and the drain selection line, a first floating impurity region provided in the semiconductor substrate under a gap region between the source selection line and the cell gate pattern and a second floating impurity region provided in the semiconductor substrate under a gap region between the drain selection line and the cell gate pattern. Distances between the cell gate pattern and the selection lines are less than widths of the selection lines.

Abstract: A non-volatile memory device includes a floating gate formed on a substrate with a gate insulation layer interposed therebetween, a tunnel insulation layer formed on the floating gate, a select gate electrode inducing charge introduction through the gate insulation layer, and a control gate electrode inducing charge tunneling occurring through the tunnel insulation layer. The select gate electrode is insulated from the control gate electrode. According to the non-volatile memory device, a select gate electrode and a control gate electrode are formed on a floating gate, and thus a voltage is applied to the respective gate electrodes to write and erase data.

Abstract: A semiconductor flash memory device. The flash memory device includes a floating gate electrode disposed in a recess having slanted sides in a semiconductor substrate. A gate insulation film is interposed between the floating gate electrode and the semiconductor substrate. A control gate electrode is disposed over the floating gate electrode. The floating gate electrode includes projections adjacent to the slanted sides of the recess.

Abstract: A nonvolatile semiconductor device includes a pair of multi-bit nonvolatile memory unit cells. Each unit cell includes a grid type semiconductor body in which a plurality of parallel semiconductor bodies extend in a first direction and a plurality of parallel semiconductor bodies extend in a second direction perpendicular to the first direction, a channel region formed in a partial region of the semiconductor body along circumferences of the semiconductor bodies that extend in the first direction, a charge storage region formed on the channel region, a plurality of control gates, which are formed on the charge storage region and wherein each of the plurality of control gates is adapted to receive separate control voltages. Each unit cell further includes source and drain regions aligned on both sides of the plurality of control gates and formed in the semiconductor bodies, wherein the pair of unit cells share the source region, and the source region is formed at a cross point of the grid.

Abstract: A nonvolatile memory device includes a memory cell unit including a pair of memory transistors and one select transistor. The select transistor is disposed between the pair of memory transistors formed in an active region in a semiconductor substrate. Two bit lines are provided, one bit line being connected to a corresponding one of the pair of memory transistors, and the other bit line being connected to a corresponding other of the pair of memory transistors.

Abstract: A non-volatile memory device includes a memory cell block, a first switching block, and a second switching block. A plurality of memory cells are arranged in the memory cell block and each of the memory cells includes a memory transistor having a floating gate and a control gate and is connected to a local bit line and includes a selection transistor connected to the memory transistor in series that is connected to a source line. The first switching block selectively connects a global bit line to the local bit line and the second switching block controls the memory cells in the memory cell block in units of a predetermined number of bits. The first switching block includes at least two switching devices connected in parallel between the global bit line and the local bit line.

Abstract: Provided are an embedded semiconductor device and a method of manufacturing an embedded semiconductor device. In a method of manufacturing the embedded semiconductor device, layers of at least one cell gate stack may be formed in a cell area of a substrate. A logic gate structure may be formed in a logic area of the substrate. First source/drain regions may be formed adjacent to the logic gate structure, and metal silicide patterns may be formed on the logic gate structure and the first source/drain regions. At least one hard mask may be formed on the layers of the at least one cell gate stack, and a blocking pattern may be formed to cover the logic gate structure and the first source/drain regions. The at least one cell gate stack may be formed in the cell area by etching the layers of the at least one cell gate stack using the at least one hard mask as an etching mask.

Abstract: In a method of reading data in an EEPROM cell, a bit line voltage for reading is applied to the EEPROM cell including a memory transistor and a selection transistor. A first voltage is applied to a sense line of the memory transistor. A second voltage greater than the first voltage is applied to a word line of the selection transistor. A current passing through the EEPROM cell is compared with a predetermined reference current to read the data stored in the EEPROM cell. An on-cell current of the EEPROM cell may be increased in an erased state and the data in the cell may be readily discriminated.

Abstract: A non-volatile memory device includes a floating gate formed on a substrate with a gate insulation layer interposed therebetween, a tunnel insulation layer formed on the floating gate, a select gate electrode inducing charge introduction through the gate insulation layer, and a control gate electrode inducing charge tunneling occurring through the tunnel insulation layer. The select gate electrode is insulated from the control gate electrode. According to the non-volatile memory device, a select gate electrode and a control gate electrode are formed on a floating gate, and thus a voltage is applied to the respective gate electrodes to write and erase data.

Abstract: Provided are non-volatile split-gate memory cells having self-aligned floating gate and the control gate structures and exemplary processes for manufacturing such memory cells that provide improved dimensional control over the relative lengths and separation of the split-gate elements. Each control gate includes a projecting portion that extends over at least a portion of the associated floating gate with the size of the projecting portion being determined by a first sacrificial polysilicon spacer that, when removed, produces a concave region in an intermediate insulating structure. The control gate is then formed as a polysilicon spacer adjacent the intermediate insulating structure, the portion of the spacer extending into the concave region determining the dimension and spacing of the projecting portion and the thickness of the interpoly oxide (IPO) separating the upper portions of the split-gate electrodes thereby providing improved performance and manufacturability.

Abstract: A method of manufacturing a split gate type nonvolatile semiconductor memory device in which control gates are formed by a self aligning process.

Abstract: In a split gate type nonvolatile memory device and a method of fabricating the same. A supplementary layer pattern is disposed on a source region of a semiconductor substrate. Since the source region is vertically extended by virtue of the presence of the supplementary layer pattern, it is therefore possible to increase an area of a region where a floating gate overlaps the source region and the supplementary layer pattern. Accordingly, the capacitance of a capacitor formed between the source and the floating gate increases so that it is possible for the nonvolatile memory device to perform program/erase operations at a low voltage level.

Abstract: A mask read-only memory (ROM) device, which can stably output data, includes an on-cell and an off-cell. The on-cell includes an on-cell gate structure on a substrate and an on-cell junction structure within the substrate. The off-cell includes an off-cell gate structure on the substrate and an off -cell junction structure within the substrate. The on-cell gate structure includes an on-cell gate insulating film, an on-cell gate electrode and an on-cell gate spacer. The on-cell junction structure includes first and second on-cell ion implantation regions of a first polarity and third and fourth on-cell ion implantation regions of a second polarity. The off-cell gate structure includes an off-cell gate insulating film, an off-cell gate electrode and an off-cell gate spacer. The off-cell junction structure includes first and second off-cell ion implantation regions of the first polarity and a third off-cell ion implantation region of the second polarity.

Abstract: A method for fabricating a memory cell includes forming a stacked insulating layer, and a lower conductive layer on a semiconductor substrate, patterning the lower conductive layer and the insulating layer to form a gap region, forming a gate insulating layer on exposed surfaces of the semiconductor substrate and the lower conductive layer in the gap region, forming a gate pattern on the gate insulating layer for filling the gap region, the gate pattern protruded upward to have sidewall portions exposed above the lower conductive layer, forming an upper sidewall pattern on each exposed sidewall portion of the gate pattern, patterning the lower conductive layer and the insulating layer to form a lower sidewall pattern and a charge storage layer under each upper sidewall pattern, wherein the gate pattern and each upper sidewall pattern are used as an etching mask.

Abstract: The present invention is directed to a non-volatile memory device and a method of operating the same. The non-volatile memory device includes a first transistor connected to an nth bitline and a second transistor connected to an (n+1)th bitline. The first transistor and the second transistor are serially coupled between the nth bitline and the (n+1)th bitline. The non-volatile memory device may include a 2-transistor 1-bit unit cell where a drain region and a source region of a memory cell have the same or similar structure. Since a cell array of a non-volatile memory device according to the invention may include a 2-transistor 2-bit unit cell, storage capacity of the non-volatile memory device may be doubled.

Abstract: In a split gate type nonvolatile memory device, a supplementary layer pattern is disposed on a source region of a semiconductor substrate. Since the source region is vertically extended by virtue of the presence of the supplementary layer pattern, it is therefore possible to increase an area of a region where a floating gate overlaps the source region and the supplementary layer pattern. Accordingly, the capacitance of a capacitor formed between the source and the floating gate increases so that it is possible for the nonvolatile memory device to perform program/erase operations at a low voltage level.

Abstract: The present invention relates to a high voltage transistor and method of manufacturing the same.

Abstract: A mask read only memory (MROM) device includes first and second gate electrodes formed at on-cell and off-cell regions of a substrate, respectively. A first impurity region is formed at the on-cell region of the substrate so as to be adjacent the first gate electrode. A second impurity region including the same conductivity type as that of the first impurity region is formed at the off-cell region of the substrate so as to be spaced apart from a sidewall of the second gate electrode. A fourth impurity region is formed at the off-cell region to extend from the second impurity region and to overlap with the sidewall of the second gate electrode. The fourth impurity region has a conductivity type opposite to that of the second impurity region and a depth greater than that of the second impurity region.

Abstract: A semiconductor device having a multi-bit nonvolatile memory cell is provided. The semiconductor device comprises a multi-bit nonvolatile memory unit cell sharing a source and a drain region and having a plurality of transistors. The plurality of transistors each comprise at least one control gate and at least one charge storage region. The charge storage regions are for accumulating charges within each of the plurality of transistors of the memory unit cell. Each of the control gatesare connected to at least one control voltage to shift a threshold voltage in each of the plurality of transistors for storing multi-bit per unit cell.