Patents by Inventor Hee-Seok JUNG

Hee-Seok JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10622765
    Abstract: In one example, the present invention relates to a signal contact unit with ameliorated passive inter-modulation distortion (PIMD) characteristics, and a board mating connector including the same. The signal contact unit includes a housing which has a housing insertion hole of which one side is open; a contact portion which has a contact portion insertion hole of which the other side is open; and a signal spring which is inserted between the one side of the housing insertion hole and the other side of the contact portion insertion hole, wherein one side of the housing is partially inserted into the contact portion insertion hole, and in a state in which the signal spring is compressed, an inner side of the contact portion comes into contact with an outer side of the housing so that the housing and the contact portion are electrically connected.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: April 14, 2020
    Assignee: GigaLane Co., Ltd.
    Inventors: Hwa Yoon Song, Jin Uk Lee, Sun Hwa Cha, Chang Hyun Yang, Eun Jung Kim, Kyung Hun Jung, Hee seok Jung
  • Patent number: 10624209
    Abstract: A flexible printed circuit board is introduced. The flexible printed circuit board of the present invention has a first substrate part, comprising a first signal line, and a second substrate part, comprising a second signal line that is parallel to the first signal line, arranged on the same plane while having a shielding part interposed therebetween.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: April 14, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10566710
    Abstract: Disclosed is a coaxial cable connector which can be manufactured in an ultra-thin type. The coaxial cable connector of the present invention comprises: a signal pin; a dielectric coupled to the signal pin; a first body coupled to a connector electrically connected to one side of the signal pin; and a second body extending from the first body and coupled to a cable electrically connected to the other side of the signal pin, wherein the second body includes a fixing portion for fixing the dielectric, and the dielectric includes a to-be-fixed portion corresponding to the fixing portion.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: February 18, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Jin Uk Lee, Sang Min Seo, Jang Mook Lee, Sun Tae Kim, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10561015
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: February 11, 2020
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20200021049
    Abstract: The present invention relates to a board-mating connector with a reduced coupling height, and the board-mating connector includes a signal portion having one side in contact with a signal electrode of a board and to be electrically connected to the signal electrode; a ground portion having one side in contact with a ground electrode of the board to be electrically connected to the ground electrode and having a hollow inside; a housing portion in which a housing insertion hole is formed such that the signal portion and the ground portion are inserted thereinto and in which at least a part of a portion coming into contact with the ground portion is formed of metal; and a dielectric portion which is inserted into the housing insertion hole and is located between the signal portion and the housing portion such that the signal portion is spaced apart from the ground portion and the housing portion.
    Type: Application
    Filed: June 14, 2019
    Publication date: January 16, 2020
    Inventors: Hwa Yoon Song, Sang Min Seo, Eun Jung Kim, Jin Uk Lee, Kyung Hun Jung, Hee seok Jung
  • Patent number: 10530099
    Abstract: In one example, a board mating connection, which includes a ground unit in which a tapered portion is formed, includes: a signal contact unit which has one side in contact with a signal electrode of a board and is electrically connected to the signal electrode; a ground contact unit which has one side in contact with a ground electrode of the board and is electrically connected to the ground electrode; and a dielectric unit which is disposed between the signal contact unit and the ground contact unit, wherein the ground contact unit includes a first ground portion which has a first ground hollow portion and includes a second ground portion of which the other side is partially inserted into the first ground hollow portion and which has a second ground hollow portion, the first ground portion includes a first ground tapered portion formed on a wall thereof so as to have an inclined shape such that an inner diameter thereof is gradually decreased toward the other side thereof, and the second ground portion has t
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: January 7, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Hwa Yoon Song, Jin Uk Lee, Sun Hwa Cha, Chang Hyun Yang, Eun Jung Kim, Kyung Hun Jung, Hee seok Jung
  • Patent number: 10512158
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: December 17, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10477690
    Abstract: A flexible circuit board is disclosed. The flexible circuit board of the present invention comprises: a substrate part; and a transmission part formed to extend from the substrate part, and having two or more lines, which are aligned in parallel in a thickness direction, for transmitting a high frequency.
    Type: Grant
    Filed: February 8, 2017
    Date of Patent: November 12, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10448499
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and via holes formed by filling a plurality of holes, which are formed in a vertical direction such that the first ground and the second ground are electrically connected, with conductors, wherein the signal line is laterally bent so as to be spaced apart from positions where the via holes are formed.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: October 15, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10440816
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: October 8, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10440815
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: October 8, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Publication number: 20190305484
    Abstract: In one example, the present invention relates to a signal contact unit with ameliorated passive inter-modulation distortion (PIMD) characteristics, and a board mating connector including the same. The signal contact unit includes a housing which has a housing insertion hole of which one side is open; a contact portion which has a contact portion insertion hole of which the other side is open; and a signal spring which is inserted between the one side of the housing insertion hole and the other side of the contact portion insertion hole, wherein one side of the housing is partially inserted into the contact portion insertion hole, and in a state in which the signal spring is compressed, an inner side of the contact portion comes into contact with an outer side of the housing so that the housing and the contact portion are electrically connected.
    Type: Application
    Filed: March 22, 2019
    Publication date: October 3, 2019
    Inventors: Hwa Yoon Song, Jin Uk Lee, Sun Hwa Cha, Chang Hyun Yang, Eun Jung Kim, Kyung Hun Jung, Hee seok Jung
  • Publication number: 20190305485
    Abstract: In one example, a board mating connection, which includes a ground unit in which a tapered portion is formed, includes: a signal contact unit which has one side in contact with a signal electrode of a board and is electrically connected to the signal electrode; a ground contact unit which has one side in contact with a ground electrode of the board and is electrically connected to the ground electrode; and a dielectric unit which is disposed between the signal contact unit and the ground contact unit, wherein the ground contact unit includes a first ground portion which has a first ground hollow portion and includes a second ground portion of which the other side is partially inserted into the first ground hollow portion and which has a second ground hollow portion, the first ground portion includes a first ground tapered portion formed on a wall thereof so as to have an inclined shape such that an inner diameter thereof is gradually decreased toward the other side thereof, and the second ground portion has t
    Type: Application
    Filed: March 22, 2019
    Publication date: October 3, 2019
    Inventors: Hwa Yoon Song, Jin Uk Lee, Sun Hwa Cha, Chang Hyun Yang, Eun Jung Kim, Kyung Hun Jung, Hee seok Jung
  • Publication number: 20190305457
    Abstract: In one example, a board mating connector, in which a signal contact unit and a ground contact unit are interlocked, includes: a signal contact unit which has one side in contact with a signal electrode of a board and is electrically connected to the signal electrode; a ground contact unit which has one side in contact with a ground electrode of the board and is electrically connected to the ground electrode; and a dielectric unit which is disposed between the signal contact unit and the ground contact unit, wherein the ground contact unit includes a ground portion and another ground portion which is relatively moved in contact with the ground portion so as to be coupled to and interlocked with a connection portion through the dielectric unit.
    Type: Application
    Filed: March 22, 2019
    Publication date: October 3, 2019
    Inventors: Hwa Yoon Song, Jin Uk Lee, Sun Hwa Cha, Chang Hyun Yang, Eun Jung Kim, Kyung Hun Jung, Hee seok Jung
  • Publication number: 20190295962
    Abstract: The present invention relates to a nitride-based electronic device and a method for manufacturing same, the nitride-based electronic device comprising a substrate, a metal electrode and a plurality of protection layers, wherein, among the protection layers, at least two protection layers covering one portion of the electrode so that one portion of the upper part of the electrode is exposed are configured so that the upper protection layer covers the end part of the lower protection layer so as to prevent the end part of the lower protection layer from being exposed.
    Type: Application
    Filed: November 3, 2017
    Publication date: September 26, 2019
    Inventors: Sang Min Lee, Hwang Sub Koo, Hyun Je Kim, Hee seok Jung
  • Publication number: 20190281695
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Application
    Filed: May 29, 2019
    Publication date: September 12, 2019
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Publication number: 20190281696
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Application
    Filed: May 29, 2019
    Publication date: September 12, 2019
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Publication number: 20190274222
    Abstract: An electronic device is provided. The electronic device includes a display including a display area and a connecting area extending from one side of the display area, a flexible printed circuit board (FPCB) connected with the connecting area, and a first module mounted on a first surface of the FPCB, where the connecting area is bent such that the first module is apart from the display to face the display.
    Type: Application
    Filed: May 16, 2019
    Publication date: September 5, 2019
    Inventors: Hyung Dal KIM, Oh Hyuck Kwon, Han Vit Kang, Jun Young Kim, Moon Kyeong Kim, Sang Seob Kim, Jung Sik Park, Hee Seok Jung, Sung Cho, Heung Sik Shin, Ji Woong Oh
  • Publication number: 20190239343
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Application
    Filed: April 5, 2019
    Publication date: August 1, 2019
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20190239344
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Application
    Filed: April 5, 2019
    Publication date: August 1, 2019
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung