Abstract: Provided are a curved semiconductor package, and a device including the semiconductor package. The semiconductor package includes: a flexible printed circuit board (PCB) including a fixed bent portion formed as an arch-shape and including a first surface facing a first direction and a second surface opposite to the first surface; at least one semiconductor chip attached to the second surface of the fixed bent portion of the flexible PCB; and a mold layer having rigidity and formed on the second surface of the fixed bending portion of the flexible PCB while surrounding the at least one semiconductor chip.

Abstract: An ultrasound diagnostic apparatus to improve picture quality of images by automatically adjusting image parameters, and a control method thereof are provided. The ultrasound diagnostic apparatus includes an image signal processor to perform envelope detection processing on ultrasound image data, and an image parameter processor to calculate a Time Gain Compensation (TGC) parameter from the envelope detection processed ultrasound image data, adjust the envelope detection processed ultrasound image data based on the TGC parameter, and calculate a Dynamic Range (DR) parameter from the envelope detection processed ultrasound image data adjusted based on the TGC parameter to apply the DR parameter to the envelope detection processed ultrasound image data.

Abstract: Provided are a curved semiconductor package, and a device including the semiconductor package. The semiconductor package includes: a flexible printed circuit board (PCB) including a fixed bent portion formed as an arch-shape and including a first surface facing a first direction and a second surface opposite to the first surface; at least one semiconductor chip attached to the second surface of the fixed bent portion of the flexible PCB; and a mold layer having rigidity and formed on the second surface of the fixed bending portion of the flexible PCB while surrounding the at least one semiconductor chip.

Abstract: Disclosed is a method and apparatus for manufacturing a melt-blown fabric web, by which a melt-blown fabric web having improved filament cohesion and excellent bulky characteristics and sound-absorbing performance is manufactured. The apparatus includes a heat extruder for heating a thermoplastic resin composition and extruding the melted thermoplastic resin, a melt-blown fiber spinner for spinning the extruded thermoplastic resin as a melt-blown fiber in a filament form, a variable gas injector for injecting gas whose injection speed and injection quantity are continuously changed at random to the melt-blown fiber spun from the melt-blown fiber spinner to cause the injected gas to collide with the spun melt-blown fiber, and a collector for collecting the melt-blown fiber, which is spun from the melt-blown fiber spinner and collides with the gas, to form a melt-blown fabric web.

Abstract: A display device includes a curvature-variable display panel including a plurality of pixels; a controller configured to correct and output an image signal supplied from the outside according to a radius of curvature of the display panel; a data driver configured to supply a data signal corresponding to the corrected image signal to a data line connected to the pixel; and a scan driver configured to supply a scan signal synchronized with the data signal to a scan line connected to the pixel. The controller may include a curvature detector configured to detect the radius of curvature of the display panel and a lookup table generator configured to generate a correction lookup table according to the radius of curvature of the display panel.

Abstract: Embodiments of the invention provide a semiconductor light emitting diode having an ohmic electrode structure, and a method of manufacturing the same. The semiconductor light emitting diode includes a light emitting structure having an upper surface constituting an N-face; and an ohmic electrode structure located on the light emitting structure. Here, the ohmic electrode structure includes a lower diffusion preventing layer, a contact layer, an upper diffusion preventing layer, and an Al protective layer from the N-face of the light emitting structure.

Abstract: The present invention provides a composition for preventing or treating kidney disease, the composition comprising a pyrazole derivative compound or a pharmaceutically acceptable salt thereof; and the composition of the present invention is effective in reducing proteinuria, reducing cell formation between glomerular blood vessels and suppressing kidney fibrosis.

Abstract: Lead frames for light emitting device packages, light emitting device packages, and illumination apparatuses employing the light emitting device packages. The lead frame including a plurality of mounting portions on which a plurality of light emitting device chips are mounted; a plurality of connection portions for circuit connecting the plurality of light emitting device chips; a terminal portion extended from the plurality of connection portions. The light emitting device package is formed by directly mounting the plurality of light emitting device chips on the lead frame and packaging the mounted light emitting device chips on the lead frame. The lead frame includes a plurality of connection portions for circuit connecting the plurality of light emitting device chips and a terminal portion in which a part of a circuit thereof is exposed.

Abstract: A backlight assembly and a display device including the same are provided. A backlight assembly includes a light source portion including a plurality of light sources having a first light source and a second light source, the second light source emits light of a color that is different from a color of light emitted from the first light source, and a reflective member that is adjacent to an edge portion of the light source portion, wherein the reflective member includes a base layer including a first region that faces the first light source and a second region that faces the second light source, and a plurality of color patterns including a plurality of first color patterns that are positioned on the first region of the base layer and a plurality of second color patterns that are positioned on the second region of the base layer, wherein the plurality of first color patterns and the plurality of second color patterns have different colors.

Abstract: A light source module including: a cover unit having a pipe structure with one open end or two open ends; a cap unit coupled to the one open end or two open ends of the cover unit; a light source unit including a light emitting device, the light source unit mounted on the cap unit and covered by the cover unit; and a wavelength conversion unit disposed in an internal space of the cover unit and coupled to the light source unit while covering the light emitting device, the wavelength conversion unit converting a wavelength of light emitted from the light emitting device to allow the wavelength-converted light to be emitted through the cover unit.

Abstract: Light-emitting device packages which may be manufactured using post-molding and with improved heat emission performance and optical quality, and methods of manufacturing the light-emitting device packages. The light-emitting device package includes: a heat dissipation pad; a light-emitting device formed on the heat dissipation pad; a pair of lead frames disposed to be spaced apart from each other at both sides of the light-emitting device and the heat dissipation pad; a molding member surrounding the side of the light-emitting device except for an emission surface of the light-emitting device; and bonding wires for electrically connecting the lead frames to the light-emitting device.

Abstract: An arrow shaft includes a straightness marking that indicates a position of straightness of an arrow shaft. Accordingly, a user can shoot in consideration of the error in the straightness, thereby facilitating the adjustment of a zero point and formation of a shot group, and also improving the flight stability of the arrow.

Abstract: A method of manufacturing a light emitting diode, includes a process of forming an n-type nitride semiconductor layer, a light emitting layer, and a p-type nitride semiconductor layer on a temporary substrate, a process of forming a p-type electrode on the p-type nitride semiconductor layer, a process of forming a conductive substrate on the p-type electrode, a process of removing the temporary substrate to expose the n-type nitride semiconductor layer, a process of forming a nanoimprint resist layer on the n-type nitride semiconductor layer, a process of pressing the nanoimprint mold on the nanoimprint resist layer to transfer the nano-pattern onto the nanoimprint resist layer, and a process of separating the nanoimprint mold from the nanoimprint resist layer having the nano-pattern and etching a portion of the nanoimprint resist layer having the nano-pattern to form an n-type electrode.

Abstract: A light-emitting device package having improved connection reliability of a bonding wire, heat dissipation properties, and light quality due to post-molding and a method of manufacturing the light-emitting device package. The light-emitting device package includes, for example, a wiring substrate having an opening; a light-emitting device that is disposed on the wiring substrate and covers the opening; a bonding wire electrically connecting a bottom surface of the wiring substrate to a bottom surface of the light-emitting device via the opening; a molding member that surrounds a side surface of the light-emitting device and not a top surface of the light-emitting device, which is an emission surface, is formed on a portion of a top surface of the wiring substrate, and is formed in the opening of the wiring substrate to cover the bonding wire; and a solder resist and a bump formed on the bottom surface of the wiring substrate.

Abstract: A method of manufacturing a light emitting diode, includes a process of forming an n-type nitride semiconductor layer, a light emitting layer, and a p-type nitride semiconductor layer on a temporary substrate, a process of forming a p-type electrode on the p-type nitride semiconductor layer, a process of forming a conductive substrate on the p-type electrode, a process of removing the temporary substrate to expose the n-type nitride semiconductor layer, a process of forming a nanoimprint resist layer on the n-type nitride semiconductor layer, a process of pressing the nanoimprint mold on the nanoimprint resist layer to transfer the nano-pattern onto the nanoimprint resist layer, and a process of separating the nanoimprint mold from the nanoimprint resist layer having the nano-pattern and etching a portion of the nanoimprint resist layer having the nano-pattern to form an n-type electrode.

Abstract: A light emitting diode (LED) package and a manufacturing method thereof are provided. The LED package includes a substrate including a circuit layer, an LED mounted on the substrate, and a plurality of protruded reflection units disposed in a region excluding an LED mounting region on the substrate and configured to reflect light generated from the LED.

Abstract: A semiconductor module may include a circuit substrate with a first die on the circuit substrate and a second die on the first die. The first die may include at least one first data input/output pad on a first peripheral portion of the first die and at least one first control/address pad on a third peripheral portion, the third peripheral portion being separate from the first peripheral portion of the first die. The second die may include at least one second data input/output pad on a second peripheral portion and at least one second control/address pad on a fourth peripheral portion. The second peripheral portion of the second die is not overlapped with the first peripheral portion of the first die in plan view. The fourth peripheral portion of the second die overlaps at least a portion of the third peripheral portion of the first die.

Abstract: The present invention relates to a surface-modified biomass which is crosslinked with an amine group-containing cationic polymer on the surface of a cell biomass, its preparation method, and a method for recovering valuable metals using the same. The surface-modified biomass of the present invention has an advantage of improving adsorption of and affinity with anionic pollutants as a result of further introducing a cationic functional group by crosslinking of the amine group-containing cationic polymer on the surface of the biomass. In addition, the method for recovering valuable metals with the present invention is environment-friendly, economical, and harmless to the human body.

Abstract: Embodiments of the invention provide a gallium nitride-based light emitting diode including a transparent electrode, which includes a metal layer and a metal oxide layer. The light emitting diode includes a substrate, an n-type gallium nitride-based semiconductor layer disposed on the substrate, a p-type gallium nitride-based semiconductor layer disposed on the n-type gallium nitride-based semiconductor layer, an active layer interposed between the n-type gallium nitride-based semiconductor layer and the p-type gallium nitride-based semiconductor layer, and a transparent electrode disposed on the p-type gallium nitride-based semiconductor layer. Here, the transparent electrode has a multilayer structure including a first metal layer and a metal oxide layer sequentially stacked one above another, and impedance of the metal oxide layer matches impedance of an external environment at an interface between the metal oxide layer and the external environment.