Patents by Inventor Hee Song

Hee Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Illumination device
    Patent number: 8894240
    Abstract: An illumination device includes a main body unit, a light source module and a cover unit. The light source module is disposed in an upper space of the main body unit to be separated therefrom and includes a substrate and at least one light emitting device respectively disposed on both surfaces of the substrate. The cover unit is disposed on the main body unit to cover the light source module and allowing light emitted from the light source module to be emitted from a surface of the cover unit in a radial manner.
    Type: Grant
    Filed: January 17, 2013
    Date of Patent: November 25, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Cheol Jun Yoo, Young Hee Song
  • Light-emitting device package having a molding member with a low profile, and method of manufacturing the same
    Patent number: 8860069
    Abstract: A light-emitting device package. The light-emitting device package includes a lead frame comprising a plurality of separate leads; a molding member that fixes the plurality of leads and comprises an opening portion that exposes the lead frame; and a light-emitting device chip that is attached on the lead frame in the opening portion and emits light through an upper surface portion of the light-emitting device chip, wherein a height of the molding member is lower than a height of the light-emitting device chip with respect to the lead frame.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: October 14, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Cheol-jun Yoo, Young-hee Song
  • LIGHT EMITTING DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140299898
    Abstract: A light emitting device (LED) module, and manufacturing method of the same, which may be applied to various applications is provided. The LED module may be miniaturized by directly mounting an LED and a lens unit on a substrate, and price competitiveness may be enhanced by lowering a fraction defective and increasing yield of the LED module. In a method of manufacturing an LED module, an operation may be minimized and simplified by directly mounting LEDs and a plurality of lens units having various shapes, collectively forming the plurality of lens units, and by performing the operation on a wafer level. A heat radiation characteristic may be enhanced through use of a metallic material as a substrate and a bump.
    Type: Application
    Filed: June 20, 2014
    Publication date: October 9, 2014
    Inventors: Hak Hwan KIM, Kyung Mi MOON, Ho Sun PAEK, Young Hee SONG
  • Refrigerator having sub door
    Patent number: 8851590
    Abstract: A refrigerator includes a main body provided with storage chambers having doors, one of the doors being provided with an opening, the opening having at least one stepped plane; a rack installed in the storage chamber at a height corresponding to that of the lower end of the opening; a sub door to open and close the opening; and a connection member to prevent a height difference between a rear surface of the sub door and the opening. The connection member is configured to slide relative to the sub door to cover the at least one stepped plane, whereby the connection member closes the at least one stepped plane when the sub door is closed, and opens the at least one stepped plane when the sub door is opened so that the rear surface of the sub door and the connection member form substantially a level plane with the rack.
    Type: Grant
    Filed: November 18, 2013
    Date of Patent: October 7, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joo Hee Song, Jeong Wook Lee, Ha Jin Jeong
  • Illumination apparatus employing light-emitting device package
    Patent number: 8840265
    Abstract: An illumination apparatus includes a light source unit comprising at least one light source module comprising a plurality of light-emitting device chips and a lead frame on which the light-emitting device chips are mounted and which connects the mounted light-emitting device chips; a diffusion cover having an interior space in which the light source module is accommodated and diffusing light emitted from the light source module; and an installation portion formed adjacent to the diffusion cover to install the light source module.
    Type: Grant
    Filed: May 3, 2011
    Date of Patent: September 23, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyung-mi Moon, Young-hee Song, Ill-heung Choi, Jeong-wook Lee, Young-jin Lee
  • Light emitting device package and manufacturing method thereof
    Patent number: 8841693
    Abstract: There is provided a light emitting device package including: a substrate having a cavity formed therein; a heat sink provided on a bottom surface of the cavity to be adjacent to an inner wall of the cavity; a light emitting device mounted on the heat sink; and a phosphor layer provided within the cavity and covering the heat sink and the light emitting device.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: September 23, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae Sung You, Young Hee Song
  • REFRIGERATOR
    Publication number: 20140246970
    Abstract: Disclosed is a refrigerator including a main body provided with a storage chamber; a door to respectively open and close the storage chamber; a control unit installed the door to select an operation; a reception part provided in the door to receive the control unit; and an installation hole provided on a side end of the door to cause the control unit to be inserted into the reception part. The control unit is installed through the side end of the door, which is deviated from a user's line of sight.
    Type: Application
    Filed: May 9, 2014
    Publication date: September 4, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young Gwi PARK, Joo Hee Song, Yong Seok Kim
  • Method and apparatus for managing quality of service
    Patent number: 8826314
    Abstract: A system that incorporates teachings of the present disclosure may include, for example, obtaining regression coefficients that quantify a relationship between premises feedback and first network and premises performance indicators, obtaining second network performance indicators for the network elements, obtaining second premises performance indicators for the customer premises equipment, and predicting customer complaints by applying the obtained regression coefficients to at least the second network performance indicators and the second premises performance indicators. Other embodiments are disclosed.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: September 2, 2014
    Assignees: AT&T Intellectual Property I, LP, Board of Regents, The University of Texas Systems
    Inventors: Jia Wang, Andrea Basso, Min-Hsuan Chen, Zihui Ge, Ajay Mahimkar, Han Hee Song, Jennifer Yates, Yin Zhang
  • Illumination apparatus employing light-emitting device package
    Patent number: 8807786
    Abstract: An illumination apparatus includes a light source unit comprising at least one light source module comprising a plurality of light-emitting device chips and a lead frame on which the light-emitting device chips are mounted and which connects the mounted light-emitting device chips; a diffusion cover having an interior space in which the light source module is accommodated and diffusing light emitted from the light source module; and an installation portion formed adjacent to the diffusion cover to install the light source module.
    Type: Grant
    Filed: May 3, 2011
    Date of Patent: August 19, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyung-mi Moon, Young-hee Song, Ill-heung Choi, Jeong-wook Lee, Young-jin Lee
  • Refrigerator
    Patent number: 8752919
    Abstract: Disclosed is a refrigerator including a main body provided with a storage chamber; a door to respectively open and close the storage chamber; a control unit installed the door to select an operation; a reception part provided in the door to receive the control unit; and an installation hole provided on a side end of the door to cause the control unit to be inserted into the reception part. The control unit is installed through the side end of the door, which is deviated from a user's line of sight.
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: June 17, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young Gwi Park, Joo Hee Song, Yong Seok Kim
  • Method of extracting butyric acid from a fermented liquid and chemically converting butyric acid into biofuel
    Patent number: 8728782
    Abstract: Disclosed is a method of converting butyric acid contained in a fermentation broth into biofuel. This chemical conversion method includes separating biohydrogen from gases generated in the course of production of butyric acid through fermentation of carbohydrate, extracting butyric acid from the broth using an insoluble solvent, esterifying butyric acid thus producing butylbutyrate, and hydrogenolyzing all or part of butylbutyrate, thus obtaining butanol. Thereby, biobutanol can be efficiently and economically produced, and butylbutyrate, which has oxidation stability superior to that of conventional biodiesel (fatty acid methyl ester) and is thus regarded as novel biofuel, can be produced together.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: May 20, 2014
    Assignees: SK Innovation Co., Ltd., Korea Institute of Science and Technology
    Inventors: Sin Young Kang, Cher Hee Park, Young Seek Yoon, In Ho Cho, Hyung Woong Ahn, Sam Ryong Park, Jong Hee Song, Seong Ho Lee, Byoung In Sang, Young Woong Suh, Young Soon Um, Sun Mi Lee
  • Light emitting device package and method of manufacturing the same
    Patent number: 8722435
    Abstract: Provided is a light emitting device package including: a plurality of lead frames disposed to be separated from one another; at least one light emitting device mounted on the lead frames and electrically connected to the lead frames through a bonding wire provided on a wire bonding pad, the wire bonding pad being disposed on the same surface as a light emission surface provided as an upper surface of the light emitting device; a body part formed to encapsulate and support the wire bonding pad, the bonding wire, the light emitting device and the lead frames, and having a reflective groove formed in an upper surface thereof to expose the light emission surface to the outside therethrough; and a lens part disposed on the body part, to cover the light emitting device.
    Type: Grant
    Filed: October 18, 2013
    Date of Patent: May 13, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Cheol Jun Yoo, Young Hee Song, Seong Deok Hwang, Sang Hyun Lee
  • Light-emitting device package and method of manufacturing the same
    Patent number: 8710513
    Abstract: A light-emitting device package and a method of manufacturing the light-emitting device package. The light-emitting device package includes a wiring substrate; a Zener diode mounted on a first region of the wiring substrate; a light-emitting device chip mounted on the first region and a second region of the wiring substrate; and a molding member for fixing at least a portion of the wiring substrate, wherein the Zener diode is embedded in the molding member.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: April 29, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Cheol-jun Yoo, Young-hee Song
  • LEAD FRAME FOR LIGHT EMITTING DEVICE PACKAGE, LIGHT EMITTING DEVICE PACKAGE, AND ILLUMINATION APPARATUS EMPLOYING THE LIGHT EMITTING DEVICE PACKAGE
    Publication number: 20140103371
    Abstract: Lead frames for light emitting device packages, light emitting device packages, and illumination apparatuses employing the light emitting device packages. The lead frame including a plurality of mounting portions on which a plurality of light emitting device chips are mounted; a plurality of connection portions for circuit connecting the plurality of light emitting device chips; a terminal portion extended from the plurality of connection portions. The light emitting device package is formed by directly mounting the plurality of light emitting device chips on the lead frame and packaging the mounted light emitting device chips on the lead frame. The lead frame includes a plurality of connection portions for circuit connecting the plurality of light emitting device chips and a terminal portion in which a part of a circuit thereof is exposed.
    Type: Application
    Filed: December 20, 2013
    Publication date: April 17, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung-mi MOON, Young-hee SONG, Ill-heung CHOI, Jeong-wook LEE, Young-jin LEE
  • Light emitting device package and manufacturing method thereof
    Patent number: 8679872
    Abstract: There is provided a light emitting device package including: a substrate having a circuit pattern formed on at least one surface thereof and including an opening; a wavelength conversion layer formed by filling at least a portion of the opening with a wavelength conversion material; and at least one light emitting device disposed on a surface of the wavelength conversion layer and electrically connected to the circuit pattern.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: March 25, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Cheol Jun Yoo, Young Hee Song, Seong Deok Hwang, Sang Hyun Lee
  • REFRIGERATOR HAVING SUB DOOR
    Publication number: 20140070688
    Abstract: A refrigerator includes a main body provided with storage chambers having doors, one of the doors being provided with an opening, the opening having at least one stepped plane; a rack installed in the storage chamber at a height corresponding to that of the lower end of the opening; a sub door to open and close the opening; and a connection member to prevent a height difference between a rear surface of the sub door and the opening. The connection member is configured to slide relative to the sub door to cover the at least one stepped plane, whereby the connection member closes the at least one stepped plane when the sub door is closed, and opens the at least one stepped plane when the sub door is opened so that the rear surface of the sub door and the connection member form substantially a level plane with the rack.
    Type: Application
    Filed: November 18, 2013
    Publication date: March 13, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joo Hee SONG, Jeong Wook Lee, Ha Jin Jeong
  • LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140045286
    Abstract: Provided is a light emitting device package including: a plurality of lead frames disposed to be separated from one another; at least one light emitting device mounted on the lead frames and electrically connected to the lead frames through a bonding wire provided on a wire bonding pad, the wire bonding pad being disposed on the same surface as a light emission surface provided as an upper surface of the light emitting device; a body part formed to encapsulate and support the wire bonding pad, the bonding wire, the light emitting device and the lead frames, and having a reflective groove formed in an upper surface thereof to expose the light emission surface to the outside therethrough; and a lens part disposed on the body part, to cover the light emitting device.
    Type: Application
    Filed: October 18, 2013
    Publication date: February 13, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Cheol Jun YOO, Young Hee SONG, Seong Deok HWANG, Sang Hyun LEE
  • Solar cell and method of fabricating the same
    Patent number: 8647914
    Abstract: A method of fabricating a solar cell includes forming an emitter layer of a second conductive type on a front surface and a back surface of a substrate of a first conductive type opposite to the second conductive type, forming an anti-reflection layer on the front surface of the substrate, partially removing the anti-reflection layer and the emitter layer to form an isolation groove dividing the emitter layer into a plurality of regions, removing a portion of the emitter layer formed on the back surface of the substrate, and forming a passivation layer covering the isolation groove and the back surface of the substrate.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: February 11, 2014
    Assignees: Samsung SDI Co., Ltd., Samsung Display Co., Ltd.
    Inventors: Kyoung-Jin Seo, Yoon-Mook Kang, Min-Chul Song, Dong-Chul Suh, Ju-Hee Song
  • Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package
    Patent number: 8638037
    Abstract: Lead frames for light emitting device packages, light emitting device packages, and illumination apparatuses employing the light emitting device packages. The lead frame including a plurality of mounting portions on which a plurality of light emitting device chips are mounted; a plurality of connection portions for circuit connecting the plurality of light emitting device chips; a terminal portion extended from the plurality of connection portions. The light emitting device package is formed by directly mounting the plurality of light emitting device chips on the lead frame and packaging the mounted light emitting device chips on the lead frame. The lead frame includes a plurality of connection portions for circuit connecting the plurality of light emitting device chips and a terminal portion in which a part of a circuit thereof is exposed.
    Type: Grant
    Filed: April 22, 2011
    Date of Patent: January 28, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyung-mi Moon, Young-hee Song, Ill-heung Choi, Jeong-wook Lee, Young-jin Lee
  • Refrigerator having sub door and manufacturing method of sub door
    Patent number: 8607584
    Abstract: A refrigerator having a sub door which reduces energy loss and a method of manufacturing method the sub door. The refrigerator includes a main body provided with storage chambers formed therein, doors opening and closing the storage chambers, and provided with an opening, a sub door to open and close the opening, and a cooling unit provided on the rear surface of the sub door. When the sub door is opened, cool air of the cooling unit is transmitted to a stored article put on the rear surface of the sub door, and when the sub door is closed, relatively uniform temperature distribution in the storage chamber is achieved and thus storage performance of the refrigerator is improved.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: December 17, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joo Hee Song, Jeong Wook Lee, Ha Jin Jeong