Abstract: An apparatus and method for manufacturing semiconductor devices are disclosed. In accordance with the invention, a wafer transfer device for transferring wafers from wafer storage containers to wafer processing equipment includes a flow chamber designed to reduce the amount of contaminants that can enter the wafer container. The wafer transfer apparatus provide two gas inlets for allowing two gases to flow through the flow chamber of the transfer apparatus. This results in a reduced amount of contaminants able to enter the wafer container, which in turn results in manufacture of devices with more reliable performance characteristics as well as high manufacturing yield.

Abstract: A method for preventing process errors in a semiconductor fabricating process allows only a few authorized engineers to release interlocks of semiconductor fabricating equipment when a count of interlock occurrences exceeds a predetermined number within a predetermined period of time. By allowing a semiconductor fabricating equipment operator only limited ability to reset equipment interlocks, repeated interlock conditions caused by test specification failures may be over-ridden only a predetermined number of times before the semiconductor fabricating equipment is disabled completely. The disabled semiconductor fabricating equipment may only be re-enabled using an authorization code, which is only made available to selected personnel, thereby ensuring that necessary repairs and corrections have been implemented on the semiconductor fabricating equipment.

Abstract: A lot dispatching method and system for variably applying the most suitable processing equipment and/or processing condition in a succeeding process of a semiconductor manufacturing process, wherein the succeeding process is influenced by the result of a preceding process. A lot processed by the preceding process is dispatched to the succeeding processing equipment according to a systematic analysis result obtained from a relationship between a process result of the preceding process and an efficiency and the characteristics of a plurality of processing equipment in the succeeding process. A plurality of process conditions for the succeeding process corresponding to the performance of the preceding process is provided. A respective process condition has characteristics that minimize the difference in performance in the succeeding process from a desired or target performance.

Abstract: A method for preventing process errors in a semiconductor fabricating process allows only a few authorized engineers to release interlocks of semiconductor fabricating equipment when a count of interlock occurrences exceeds a predetermined number within a predetermined period of time. By allowing a semiconductor fabricating equipment operator only limited ability to reset equipment interlocks, repeated interlock conditions caused by test specification failures may be over-ridden only a predetermined number of times before the semiconductor fabricating equipment is disabled completely. The disabled semiconductor fabricating equipment may only be re-enabled using an authorization code, which is only made available to selected personnel, thereby ensuring that necessary repairs and corrections have been implemented on the semiconductor fabricating equipment.

Abstract: A lithography system includes a spinner, a first controller, a stepper and a second controller. The spinner coats a photoresist film on a semiconductor substrate. The first controller sets a first optimal process parameter according to external information regarding the semiconductor wafer and controls the spinner according to the first optimal process parameter, when the semiconductor wafer is loaded into the spinner. The stepper exposes the semiconductor wafer, which is coated with the photoresist film, to light of a predetermined wavelength. The second controller sets a second optimal process parameter according to the external information regarding the semiconductor wafer and controls the stepper according to the second optimal process parameter, when the semiconductor wafer coated with the photoresist film is loaded into the stepper.

Abstract: Apparatus for controlling the temperature of a wafer in a wafer pre-alignment stage has an air injection member for injecting cooling air towards a chucked wafer and an air guide for guiding a predetermined amount of the injected air towards a portion of the wafer adjacent the edge sensor to compensate for a relatively high temperature condition existing at the region of the edge sensor due to the operation thereof. The air injection member is connected with an air supplier and includes an air injection head having a bottom plate through which a plurality of injection holes extend. The air guide is a flow rate controlling plate which is disposed within the air injection head. The air introduced received by the air injection head is guided towards the region of the edge sensor by the flow rate controlling plate.

Abstract: A dry etching apparatus is capable of suppressing formation of reaction products (i.e., polymers) in an etching chamber. A gas supply is connected to the top of the etching chamber by a first gas duct, and a pump is connected to the bottom of the etching chamber by a second gas duct. An upper electrode is furnished in the etching chamber. At a location opposed to the upper electrode, a lower electrode is furnished. Insulation plates of the upper and the lower electrodes, or an insulation plate of either of the upper or the lower electrode, include a plurality of grooves. The etching chamber may include a plurality of grooves and projections on its sidewalls. The plurality of projections in the sidewalls has a semicircular or a rectangular cross-section, and may be formed as a single body or as individually detachable projection bodies.

Abstract: A method and apparatus for heating a chemical used in microelectronic device fabrication processes. The apparatus includes a chemical supply and chemical bath for containing a chemical. A temperature sensor senses the temperature of the chemical contained in the chemical bath. A first heater, powered by a first electric power source, heats the chemical while it is being supplied to the chemical bath. A second heater, powered by a second electric power source, heats the chemical contained in the chemical bath. First and second power controllers regulate the first electric power and the second electric power sources, respectively, through a plurality of electrodes having different intensity levels that are selected according to the temperature of the chemical sensed by the temperature sensor.

Abstract: The present invention relates to a semiconductor fabricating apparatus having an electrical system for transmitting a rotatory power through a belt of a motor to a pulley. The semiconductor fabricating apparatus having an electrical system of the present invention includes a sensor disposed in the vicinity of the belt for detecting a distance between the sensor and the belt and generating an electrical signal corresponding to a detected distance; an amplifier for amplifying the electrical signal to generate an amplified voltage; an analog-to-digital converter for converting the amplified voltage into a digital signal; and a controller for comparing the digital signal with a reference signal and determining whether the belt is loose on the pulley so as to generate a control signal.

Abstract: A vacuum controlling apparatus is provided. The vacuum level of a vacuum chamber can be accurately maintained by measuring and controlling the vacuum level of the vacuum chamber by using six parameters: desired pressure, predetermined time for reaching the desired pressure, predetermined temperature, actual pressure, actual time for reaching the desired pressure, and actual temperature.

Abstract: A central management system for wet chemical cleaning stations includes a number of wet chemical cleaning stations each having a liquid bath, filter, pump and multiple sensors for sensing the process variables thereof; and a main computer connected to the wet chemical cleaning stations to display, store and process data sensed by the sensors and totally manage the data, to thereby enable effective central management of the cleaning process via the main computer.