Abstract: The present disclosure relates to a thermosetting resin composition for a semiconductor package including a modified phenylene ether oligomer or a modified poly(phenylene ether) having ethylenically unsaturated groups at both ends thereof; a thermosetting resin; a predetermined elastic (co)polymer; and an inorganic filler, and a prepreg and a metal clad laminate including the same.

Abstract: There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

Abstract: The present invention relates to a thermosetting resin composition for coating a metal film having excellent crack resistance and a metal laminate using the same.

Abstract: The present invention relates to a thermosetting resin composition for coating a metal film having high flowability and pattern-filling property and a metal laminate using the same.

Abstract: The present invention relates to a resin composition having a high flow property, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.

Abstract: A thermosetting resin composition having improved flowability and stiffness, and a prepreg using the same. Specifically, three kinds of fillers having different average particle diameters are combined with a binder resin system including an epoxy resin, a bismaleimide resin, a diaminodiphenylsulfone resin, and a benzoxazine resin.

Abstract: The present invention relates to a resin composition having high miscibility between internal components, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.

Abstract: The present disclosure relates to a thermosetting resin composition for a semiconductor package including a modified phenylene ether oligomer or a modified poly(phenylene ether) having ethylenically unsaturated groups at both ends thereof; a thermosetting resin; a predetermined elastic (co)polymer; and an inorganic filler, and a prepreg and a metal clad laminate including the same.

Abstract: The present invention relates to a thermosetting resin composition for coating a metal film having high flowability and pattern-filling property and a metal laminate using the same.

Abstract: A resin composition, optionally for a semiconductor package, and a prepreg and a metal clad laminate using the same are provided. The resin composition according to the present invention may exhibit excellent flowability although being packed with a high content of an inorganic filler, and may provide a prepreg and a metal clad laminate having excellent adhesive strength for a metal foil, and low relative permittivity and a low dissipation factor.

Abstract: The present disclosure relates to a thermosetting resin composite having a specific thermal stress factor, and capable of implementing a low glass transition temperature, low modulus, and a low coefficient of thermal expansion, and minimizing warpage, and having excellent flowability in a prepreg or semi-cured state, and a metal clad laminate using the same.

Abstract: The present disclosure relates to a thermosetting resin composition for a semiconductor package including an amine compound containing a specific functional group, a thermosetting resin, a thermoplastic resin, and an inorganic filler, and having a glass transition temperature of 230° C. or less after curing, a prepreg including the thermosetting resin composition, and a metal clad laminate including the prepreg.

Abstract: A resin composition, optionally for a semiconductor package, and a prepreg and a metal clad laminate using the same are provided. The resin composition according to the present invention may exhibit excellent flowability although being packed with a high content of an inorganic filler, and may provide a prepreg and a metal clad laminate having excellent adhesive strength for a metal foil, and low relative permittivity and a low dissipation factor.

Abstract: A thermosetting resin composition having improved flowability and stiffness, and a prepreg using the same. Specifically, three kinds of fillers having different average particle diameters are combined with a binder resin system including an epoxy resin, a bismaleimide resin, a diaminodiphenylsulfone resin, and a benzoxazine resin.

Abstract: The present invention relates to a thermosetting resin composition for coating a metal film having excellent crack resistance and a metal laminate using the same.

Abstract: The present invention relates to a resin composition having a high flow property, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.

Abstract: The present invention relates to a resin composition having high miscibility between internal components, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.

Abstract: The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.

Abstract: The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.

Abstract: There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.