Patents by Inventor Hee-Yong Shim

Hee-Yong Shim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermosetting resin composition and prepreg and metal clad laminate using the same
    Patent number: 9278505
    Abstract: The present invention relates to a thermosetting resin composition used in a printed circuit board for a semiconductor package, and a prepreg and a metal clad laminate using the same. More particularly, the present invention provides a thermosetting resin composition that includes a mixture of a BT or cyanate resin and an epoxy resin and a specific content of a novolac resin as a curing agent so as to inhibit separation of the resin and an inorganic filler during a process of laminating a prepreg on a metal foil, thereby providing a printed circuit board having a uniform insulation layer, and a prepreg and a metal clad laminate for a double-sided or multilayer printed circuit board that are manufactured by using the same.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: March 8, 2016
    Assignee: LG CHEM, LTD.
    Inventors: Hee-Yong Shim, Jung-Jin Shim, Jeong-An Kang, Hyun-Sung Min
  • THERMOSETTING RESIN COMPOSITION AND PREPREG AND METAL CLAD LAMINATE USING THE SAME
    Publication number: 20130319609
    Abstract: The present invention relates to a thermosetting resin composition used in a printed circuit board for a semiconductor package, and a prepreg and a metal clad laminate using the same. More particularly, the present invention provides a thermosetting resin composition that includes a mixture of a BT or cyanate resin and an epoxy resin and a specific content of a novolac resin as a curing agent so as to inhibit separation of the resin and an inorganic filler during a process of laminating a prepreg on a metal foil, thereby providing a printed circuit board having a uniform insulation layer, and a prepreg and a metal clad laminate for a double-sided or multilayer printed circuit board that are manufactured by using the same.
    Type: Application
    Filed: July 20, 2012
    Publication date: December 5, 2013
    Applicant: LG CHEM, LTD.
    Inventors: Hee-Yong Shim, Jung-Jin Shim, Jeong-An Kang, Hyun-Sung Min