Patents by Inventor Heewon Jeong

Heewon Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10324107
    Abstract: Provided is a highly reliable acceleration sensor having little 0-point drift. For example, an acceleration sensor having a support substrate having a first direction and a second direction orthogonal thereto in a single surface, a device layer disposed on the support substrate with a space interposed therebetween and having a weight that deforms according to the application of acceleration, and a cap layer disposed on the device layer with a space interposed therebetween, wherein a fixed part fixed to the support substrate is provided in the center of the weight, a beam is provided that extends from the fixed part and makes the weight mobile by being connected thereto, a plurality of posts for coupling the support substrate and the cap layer are disposed on the fixed part, and electric signals are applied to and received from the weight via the posts.
    Type: Grant
    Filed: April 8, 2015
    Date of Patent: June 18, 2019
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Heewon Jeong, Masahide Hayashi, Kiyoko Yamanaka, Daisuke Maeda
  • Publication number: 20190008034
    Abstract: A printed circuit board comprises a board main body, a sensor, an external connection pad, and a hollow-structured electrical conductor. The board main body has a top face and a bottom face opposite the top face. The sensor is mounted on one of the top face and the bottom face of the board main body. The external connection pad is provided on the top face or the bottom face of the board main body opposite the sensor. The hollow-structured electrical conductor extends through the board main body and electrically connects the sensor to the external connection pad.
    Type: Application
    Filed: June 29, 2018
    Publication date: January 3, 2019
    Applicant: Tyco Electronics Japan G.K.
    Inventors: Kenta Sato, Heewon Jeong
  • Patent number: 10145686
    Abstract: In order to provide a technology capable of suppressing degradation of measurement accuracy due to fluctuation of detection sensitivity of an MEMS by suppressing fluctuation in natural frequency of the MEMS caused by a stress, first, fixed portions 3a to 3d are displaced outward in a y-direction of a semiconductor substrate 2 by deformation of the semiconductor substrate 2. Since a movable body 5 is disposed in a state of floating above the semiconductor substrate 2, it is not affected and displaced by the deformation of the semiconductor substrate 2. Therefore, a tensile stress (+?1) occurs in the beam 4a and a compressive stress (??2) occurs in the beam 4b. At this time, in terms of a spring system made by combining the beam 4a and the beam 4b, increase in spring constant due to the tensile stress acting on the beam 4a and decrease in spring constant due to the compressive stress acting on the beam 4b are offset against each other.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: December 4, 2018
    Assignee: HITACHI, LTD
    Inventors: Munenori Degawa, Heewon Jeong
  • Patent number: 9995762
    Abstract: Provided is a highly reliable acceleration sensor that keeps production costs low and has low zero point drift initially and over time even when used in a poor installation environment. In this acceleration sensor, a weight that rotates when acceleration is applied in the z-direction is disposed in a cavity surrounded by a support substrate and a cap layer. The cap layer is formed such that both sides thereof across the axis of rotation of the weight have different masses per unit area.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: June 12, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Masahide Hayashi, Heewon Jeong
  • Patent number: 9970956
    Abstract: A movable part rotates about a rotation axis, which passes through a support, when an inertial force in a detecting direction is applied to an inertial sensor. The movable part includes a first region and a second region displaced in a direction opposite to a direction of the first region when the inertial force is applied. A second substrate includes first and second detection electrodes opposed to the first and second regions, respectively. The first detection electrode and the second detection electrode are provided symmetrically with respect to the rotation axis. A cavity is provided symmetrically with respect to the rotation axis. In a direction perpendicular to the detecting direction and a direction in which the rotation axis extends, a length from the rotation axis to an end of the first region and a length from the rotation axis to an end of the second region are different.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: May 15, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Yuhua Zhang, Heewon Jeong, Kiyoko Yamanaka, Masahide Hayashi
  • Patent number: 9939267
    Abstract: The purpose of the present invention is to provide an inertial force detection device that can more accurately detect faults in a temperature sensor. Provided is an inertial force detection device configured so that in a state where an oscillating body is made to oscillate in a first direction, the amount of displacement when the oscillating body is displaced in a second direction due to the generation of angular velocity is detected as angular velocity, wherein the inertial force detection device has a means for performing control so that the oscillating body enters a state of resonance in the first direction, a temperature detection means for detecting temperature, and a means for detecting faults in the temperature detection means, and outputs a plurality of signals, which indicate the fault detection results of the three means, continuously from a single signal wire.
    Type: Grant
    Filed: April 8, 2015
    Date of Patent: April 10, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Toshiaki Nakamura, Heewon Jeong, Masahide Hayashi
  • Patent number: 9890037
    Abstract: For a small sensor produced through a MEMS process, when an electrode pad, wiring, or a shield layer is formed in a final step, it is difficult to nondestructively investigate whether a structure for sensing a physical quantity has been processed satisfactorily. In the present invention, in a physical quantity sensor formed from an MEMS structure, in a structure in which a surface electrode having through wiring is formed on the surface of an electrode substrate and the periphery thereof is insulated, forming a shield layer comprising a metallic material on the surface of the electrode substrate in a planar view and providing a space for internal observation inside the shield layer makes it possible to check for internal defects.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: February 13, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Masatoshi Kanamaru, Masahide Hayashi, Masashi Yura, Heewon Jeong
  • Patent number: 9804188
    Abstract: An inertial sensor not susceptible to temperature change and vibration disturbance in an implementation environment of the inertial sensor is provided. In the present invention, for example, as illustrated in FIG. 9, an extending portion EXU is provided so as to connect to a fixing portion FU3, this extending portion EXU and a third region P3 which configures part of a mass body MS are connected via a support beam BM3 and a support beam BM4, and the support beam BM3 and the support beam BM4 are disposed oppositely with respect to a virtual line IL1. With this, natural frequency of an unwanted mode due to rotation and torsion of the mass body MS can be shifted to a high frequency band.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: October 31, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Heewon Jeong, Kiyoko Yamanaka, Masahide Hayashi
  • Publication number: 20170233246
    Abstract: For a small sensor produced through a MEMS process, when an electrode pad, wiring, or a shield layer is formed in a final step, it is difficult to nondestructively investigate whether a structure for sensing a physical quantity has been processed satisfactorily. In the present invention, in a physical quantity sensor formed from an MEMS structure, in a structure in which a surface electrode having through wiring is formed on the surface of an electrode substrate and the periphery thereof is insulated, forming a shield layer comprising a metallic material on the surface of the electrode substrate in a planar view and providing a space for internal observation inside the shield layer makes it possible to check for internal defects.
    Type: Application
    Filed: June 29, 2015
    Publication date: August 17, 2017
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Masatoshi KANAMARU, Masahide HAYASHI, Masashi YURA, Heewon JEONG
  • Publication number: 20170219620
    Abstract: Provided is a highly reliable acceleration sensor having little 0-point drift. For example, an acceleration sensor having a support substrate having a first direction and a second direction orthogonal thereto in a single surface, a device layer disposed on the support substrate with a space interposed therebetween and having a weight that deforms according to the application of acceleration, and a cap layer disposed on the device layer with a space interposed therebetween, wherein a fixed part fixed to the support substrate is provided in the center of the weight, a beam is provided that extends from the fixed part and makes the weight mobile by being connected thereto, a plurality of posts for coupling the support substrate and the cap layer are disposed on the fixed part, and electric signals are applied to and received from the weight via the posts.
    Type: Application
    Filed: April 8, 2015
    Publication date: August 3, 2017
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Heewon JEONG, Masahide HAYASHI, Kiyoko YAMANAKA, Daisuke MAEDA
  • Publication number: 20170191830
    Abstract: An inertial sensor having a simple configuration by vacuum sealing a resonator which detects acceleration and exploits a resonance vibration using a high Q value MEMS device. The sensor includes: a detecting proof mass and beam which detects acceleration; a driving electrode which excites the detecting proof mass and beam; a resonant frequency tuning electrode which changes the resonant frequency of the detecting proof mass and beam; and a detecting circuit which applies voltage to the resonant frequency tuning electrode for changing the resonant frequency to cancel a change of the resonant frequency of the detecting proof mass and beam when the acceleration is applied to the detecting proof mass and beam during the vibration of the detecting proof mass and beam by the voltage applied to the detecting proof mass and beam, and outputs the acceleration based on a value of the voltage applied to resonant frequency tuning electrode.
    Type: Application
    Filed: April 8, 2015
    Publication date: July 6, 2017
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Daisuke MAEDA, Heewon JEONG, Masahide HAYASHI
  • Publication number: 20170138981
    Abstract: Provided is a highly reliable acceleration sensor that keeps production costs low and has low zero point drift initially and over time even when used in a poor installation environment. In this acceleration sensor, a weight that rotates when acceleration is applied in the z-direction is disposed in a cavity surrounded by a support substrate and a cap layer. The cap layer is formed such that both sides thereof across the axis of rotation of the weight have different masses per unit area.
    Type: Application
    Filed: March 25, 2015
    Publication date: May 18, 2017
    Inventors: Masahide HAYASHI, Heewon JEONG
  • Patent number: 9651408
    Abstract: To suppress variations of a vacuum pressure atmosphere in a physical sensor, a physical sensor in which a sensing part that measures a physical quantity is provided in a vacuum space, includes a sensor part in which a plurality of substrates are stacked, and a cavity substrate 9 having a space and provided on an upper surface side or a lower surface side of the sensor part by bonding, wherein the sensing part communicates with a space of the cavity substrate via a ventilation passage 11a provided in the sensor part.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: May 16, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Masatoshi Kanamaru, Takanori Aono, Masahide Hayashi, Heewon Jeong
  • Publication number: 20170045360
    Abstract: The purpose of the present invention is to provide an inertial force detection device that can more accurately detect faults in a temperature sensor. Provided is an inertial force detection device configured so that in a state where an oscillating body is made to oscillate in a first direction, the amount of displacement when the oscillating body is displaced in a second direction due to the generation of angular velocity is detected as angular velocity, wherein the inertial force detection device has a means for performing control so that the oscillating body enters a state of resonance in the first direction, a temperature detection means for detecting temperature, and a means for detecting faults in the temperature detection means, and outputs a plurality of signals, which indicate the fault detection results of the three means, continuously from a single signal wire.
    Type: Application
    Filed: April 8, 2015
    Publication date: February 16, 2017
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Toshiaki NAKAMURA, Heewon JEONG, Masahide HAYASHI
  • Patent number: 9568490
    Abstract: Provided is an angular velocity sensor including a plurality of angular velocity detection units each outputting a different detection result, and including a common driving circuit to drive the angular velocity detection units. The angular velocity detection units of the angular velocity sensor of the present invention are configured to have different driving amplitudes when being driven by a driving signal at the same frequency.
    Type: Grant
    Filed: March 19, 2012
    Date of Patent: February 14, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Heewon Jeong, Masahide Hayashi, Kiyoko Yamanaka
  • Publication number: 20170038210
    Abstract: In order to provide a technology capable of suppressing degradation of measurement accuracy ale to fluctuation of detection sensitivity of an MEMS by suppressing fluctuation in natural frequency of the MEMS caused by a stress, first, fixed portions 3a to 3d are displaced outward in a y-direction of a semiconductor substrate 2 by deformation of the semiconductor substrate 2. Since a movable body 5 is disposed in a state of floating above the semiconductor substrate 2, it is not affected and displaced by the deformation of the semiconductor substrate 2. Therefore, a tensile stress (+?1) occurs in the beam 4a and a compressive stress (?2) occurs in the beam 4b. At this time, in terms of a spring system made by combining the beam 4a and the beam 4b, increase in spring constant due to the tensile stress acting on the beam 4a and decrease in spring constant due to the compressive stress acting on the beam 4b are offset against each other.
    Type: Application
    Filed: October 21, 2016
    Publication date: February 9, 2017
    Inventors: Munenori DEGAWA, Heewon JEONG
  • Patent number: 9557345
    Abstract: In an inertial sensor, an acceleration sensor element section includes a first movable section configured to respond to acceleration applied thereto and a diagnosis electrode configured to displace the first movable section with an electrostatic force according to voltage application from a control circuit section. An angular velocity sensor element section includes a second movable section configured to respond to an angular velocity applied thereto and a driving electrode configured to displace the second movable section with an electrostatic force according to voltage application from the control circuit section. A voltage signal input to the driving electrode and a voltage signal input to the diagnosis electrode are the same voltage signal. The voltage signal input to the diagnosis electrode is a signal for detecting a mechanical failure. Carrier signal for detecting displacement of the first movable section has frequency higher than frequency of signal applied to the diagnosis electrode.
    Type: Grant
    Filed: June 19, 2013
    Date of Patent: January 31, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Daisuke Maeda, Heewon Jeong, Masahide Hayashi
  • Patent number: 9511993
    Abstract: A semiconductor physical quantity detection sensor includes (1) a first electrostatic capacitance formed by the movable electrode, and a first fixed electrode formed in a first conductive layer shared with the movable electrode, (2) a second electrostatic capacitance that is formed by the movable electrode, and a second fixed electrode formed in a second conductive layer different in a height from a substrate surface from the movable electrode, and (3) an arithmetic circuit that calculates the physical quantity on the basis of a change in the first and second electrostatic capacitances generated when the physical quantity is applied. In this configuration, an electric signal from the first electrostatic capacitance, and an electric signal from the second electrostatic capacitance are input to the arithmetic circuit.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: December 6, 2016
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Kiyoko Yamanaka, Heewon Jeong, Chisaki Takubo
  • Patent number: 9500666
    Abstract: In order to provide a technology capable of suppressing degradation of measurement accuracy due to fluctuation of detection sensitivity of an MEMS by suppressing fluctuation in natural frequency of the MEMS caused by a stress, first, fixed portions 3a to 3d are displaced outward in a y-direction of a semiconductor substrate 2 by deformation of the semiconductor substrate 2. Since a movable body 5 is disposed in a state of floating above the semiconductor substrate 2, it is not affected and displaced by the deformation of the semiconductor substrate 2. Therefore, a tensile stress (+?1) occurs in the beam 4a and a compressive stress (??2) occurs in the beam 4b. At this time, in terms of a spring system made by combining the beam 4a and the beam 4b, increase in spring constant due to the tensile stress acting on the beam 4a and decrease in spring constant due to the compressive stress acting on the beam 4b are offset against each other.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: November 22, 2016
    Assignee: Hitachi, Ltd.
    Inventors: Munenori Degawa, Heewon Jeong
  • Patent number: 9366687
    Abstract: A high-performance angular rate detecting device is provided. A driving part including a drive frame and a Coriolis frame is leviated by at least two fixing beams which share a fixed end and are extending in a direction orthogonal to a driving direction, thereby vibrating the driving part. Even when a substrate is deformed by mounting or heat fluctuation, internal stress generated to the fixed beam and a supporting beam is small, thereby maintaining a vibrating state such as resonance frequency and vibration amplitude constant. Therefore, a high-performance angular rate detecting device which is robust to changes in mounting environment can be obtained.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: June 14, 2016
    Assignee: Hitachi, Ltd.
    Inventors: Heewon Jeong, Yasushi Goto