Abstract: The disclosure provides a composite sensor with high reliability and a method for manufacturing the same. A moving body of an acceleration sensor and an oscillator of an angular velocity sensor are provided on the same sensor wafer, while being partitioned by a wall, and a cap wafer is formed to have a gap that corresponds to each of the sensors. A through hole and a bump are formed in a sensor sealing portion, the acceleration sensor is sealed in an air atmosphere in a first sealing process, and in a second sealing process, the angular velocity sensor is sealed by bringing the sensors and the cap into contact with each other and joining the sensors and the cap in a vacuum atmosphere. Thereafter, a composite sensor wafer is cut, a circuit board and a wiring board are mounted thereon, and a composite sensor is formed.

Abstract: A high-performance angular rate detecting device is provided. A driving part including a drive frame and a Coriolis frame is leviated by at least two fixing beams which share a fixed end and are extending in a direction orthogonal to a driving direction, thereby vibrating the driving part. Even when a substrate is deformed by mounting or heat fluctuation, internal stress generated to the fixed beam and a supporting beam is small, thereby maintaining a vibrating state such as resonance frequency and vibration amplitude constant. Therefore, a high-performance angular rate detecting device which is robust to changes in mounting environment can be obtained.

Abstract: In order to provide a technology capable of suppressing degradation of measurement accuracy due to fluctuation of detection sensitivity of an MEMS by suppressing fluctuation in natural frequency of the MEMS caused by a stress, first, fixed portions 3a to 3d are displaced outward in a y-direction of a semiconductor substrate 2 by deformation of the semiconductor substrate 2. Since a movable body 5 is disposed in a state of floating above the semiconductor substrate 2, it is not affected and displaced by the deformation of the semiconductor substrate 2. Therefore, a tensile stress (+?1) occurs in the beam 4a and a compressive stress (??2) occurs in the beam 4b. At this time, in terms of a spring system made by combining the beam 4a and the beam 4b, increase in spring constant due to the tensile stress acting on the beam 4a and decrease in spring constant due to the compressive stress acting on the beam 4b are offset against each other.

Abstract: In order to provide a technology capable of suppressing degradation of measurement accuracy due to fluctuation of detection sensitivity of an MEMS by suppressing fluctuation in natural frequency of the MEMS caused by a stress, first, fixed portions 3a to 3d are displaced outward in a y-direction of a semiconductor substrate 2 by deformation of the semiconductor substrate 2. Since a movable body 5 is disposed in a state of floating above the semiconductor substrate 2, it is not affected and displaced by the deformation of the semiconductor substrate 2. Therefore, a tensile stress (+?1) occurs in the beam 4a and a compressive stress (??2) occurs in the beam 4b. At this time, in terms of a spring system made by combining the beam 4a and the beam 4b, increase in spring constant due to the tensile stress acting on the beam 4a and decrease in spring constant due to the compressive stress acting on the beam 4b are offset against each other.

Abstract: Provided is an inertial sensor device comprising a detection part having an MEMS structure, wherein convenience during sensor installation is ensured while erroneous operation caused by the application of external vibration is controlled. To achieve this objective, an anti-vibration structure (103) is provided in the inertial sensor device, between a semiconductor chip (102) mounted on a package substrate and a semiconductor chip (104) comprising a sensor detection part. The anti-vibration structure (103) has a structure in which the periphery of an anti-vibration part (103a) is surrounded by an anti-vibration part (103b) comprising a material having a larger Young's modulus.

Abstract: A protrusion formation hole is provided so as to pierce a support substrate. A polysilicon film as an electrical conducting material is embedded in the protrusion formation hole through an oxide silicon film. The polysilicon film partially bulges out of the protrusion formation hole toward a movable section to form a protruding section. In other words, the polysilicon film bulges out of the protrusion formation hole toward the movable section to form the protruding section. Thereby, a movable section included in MEMS can be prevented from sticking to other members.

Abstract: A movable part rotates about a rotation axis, which passes through a support, when an inertial force in a detecting direction is applied to an inertial sensor. The movable part includes a first region and a second region displaced in a direction opposite to a direction of the first region when the inertial force is applied. A second substrate includes first and second detection electrodes opposed to the first and second regions, respectively. The first detection electrode and the second detection electrode are provided symmetrically with respect to the rotation axis. A cavity is provided symmetrically with respect to the rotation axis. In a direction perpendicular to the detecting direction and a direction in which the rotation axis extends, a length from the rotation axis to an end of the first region and a length from the rotation axis to an end of the second region are different.

Abstract: A high-performance angular rate detecting device is provided. A driving part including a drive frame and a Coriolis frame is levitated by at least two fixing beams which share a fixed end and are extending in a direction orthogonal to a driving direction, thereby vibrating the driving part. Even when a substrate is deformed by mounting or heat fluctuation, internal stress generated to the fixed beam and a supporting beam is small, thereby maintaining a vibrating state such as resonance frequency and vibration amplitude constant. Therefore, a high-performance angular rate detecting device which is robust to changes in mounting environment can be obtained.

Abstract: An object of the invention is to provide an inertial sensor with small delay and high accuracy. An inertial sensor 1 includes an acceleration detecting element 2 that detects an acceleration of at least one axis of a vehicle; a first filter 6 that limits a detection signal of the acceleration to a first band; a second filter 7 that limits a detection signal of the acceleration to a second band; a vehicle control variable calculation section 8 that calculates a vehicle control variable Gxc on the basis of the detection signal of the acceleration limited to the second band; and a sensor signal output section 9 that outputs the detection signal of the acceleration limited to the first band and the vehicle control variable.

Abstract: A semiconductor physical quantity detection sensor includes (1) a first electrostatic capacitance formed by the movable electrode, and a first fixed electrode formed in a first conductive layer shared with the movable electrode, (2) a second electrostatic capacitance that is formed by the movable electrode, and a second fixed electrode formed in a second conductive layer different in a height from a substrate surface from the movable electrode, and (3) an arithmetic circuit that calculates the physical quantity on the basis of a change in the first and second electrostatic capacitances generated when the physical quantity is applied. In this configuration, an electric signal from the first electrostatic capacitance, and an electric signal from the second electrostatic capacitance are input to the arithmetic circuit.

Abstract: In an inertial sensor, an acceleration sensor element section includes a first movable section configured to respond to acceleration applied thereto and a diagnosis electrode configured to displace the first movable section with an electrostatic force according to voltage application from a control circuit section. An angular velocity sensor element section includes a second movable section configured to respond to an angular velocity applied thereto and a driving electrode configured to displace the second movable section with an electrostatic force according to voltage application from the control circuit section. A voltage signal input to the driving electrode and a voltage signal input to the diagnosis electrode are the same voltage signal. The voltage signal input to the diagnosis electrode is a signal for detecting a mechanical failure. Carrier signal for detecting displacement of the first movable section has frequency higher than frequency of signal applied to the diagnosis electrode.

Abstract: Reliability and accuracy of a sensor are secured while adjustment cost of a sensor module is suppressed. A signal component analysis part 10 receives a signal output from a signal processing part 7 before passing through a low-pass filter 8, analyzes whether or not application of a fragile frequency with respect to a physical quantity is equal to or more than a threshold level, if the application of the fragile frequency is equal to or more than the threshold level, outputs output stop signals to output signal control parts 9, 16. The output signal control parts 9, 16 receive control signals output from the signal component analysis part 10, and outputs an acceleration signal and a physical quantity signal from which noise has been removed by the low-pass filters 8, 15 through the signal processing parts 7, 14.

Abstract: An object of the invention is to provide a combined sensor capable of suppressing the influence of electrostatic force generated by a potential difference and preventing a reduction in the S/N ratio or a variation in the sensitivity of a sensor. A combined sensor according to the invention includes first and second movable portions and first and second dummy portions provided around the first and second movable portions, which are formed in a layer of a laminated substrate. The first dummy portion and the second dummy portion are electrically separated from each other. A first potential is applied to the first movable portion and the first dummy portion and a second potential is applied to the second movable portion and the second dummy portion (see FIG. 2).

Abstract: To provide a combined sensor that can detect a plurality of physical quantities. With the combined sensor, it is possible to realize, while maintaining performance, a reduction in size and a reduction in costs by increasing elements that can be shared among respective sensors. A weight M2 and a detection electrode DTE2 used in an angular-velocity detecting section are also used as a reference capacitive element of a Z-direction-acceleration detecting section configured to detect acceleration in a Z direction. That is, in the Z-direction-acceleration detecting section, a detection capacitive element including the weight M2 and the detection electrode DTE2 configuring the angular-velocity detecting section is used as a reference capacitive element for a detection capacitive element formed by a detection electrode DTE5 and a weight M4.

Abstract: Provided is an inertial sensor device comprising a detection part having an MEMS structure, wherein convenience during sensor installation is ensured while erroneous operation caused by the application of external vibration is controlled. To achieve this objective, an anti-vibration structure (103) is provided in the inertial sensor device, between a semiconductor chip (102) mounted on a package substrate and a semiconductor chip (104) comprising a sensor detection part. The anti-vibration structure (103) has a structure in which the periphery of an anti-vibration part (103a) is surrounded by an anti-vibration part (103b) comprising a material having a larger Young's modulus.

Abstract: In order to provide an inertial sensor capable of suppressing a wrong diagnosis even in an adverse environment such that sudden noise occurs, an inertial sensor is provided with a movable part (105), a first detection unit (C1, C2) for detecting the amount of displacement of the movable part (105), a forced vibration means (503, C3, C4) for forcedly vibrating the movable part (105) by applying a diagnosis signal, a physical quantity calculation unit (502) for calculating the physical quantity from a detection signal from the first detection unit (C1, C2), and an abnormality determination unit (504) for determining the presence or absence of the abnormality for the physical quantity using the diagnosis signal obtained via the first detection unit (C1, C2), and is used within a vehicle, the inertial sensor further comprising a second sensor (510) mounted in the same vehicle and connected to the abnormality determination unit (504).

Abstract: An inertial sensor capable of making pressure of a space in which an inertial sensor such as an acceleration sensor is placed to be higher than that during a sealing step and improving reliability is provided. The inertial sensor can be achieved by means of making an inertial sensor including a substrate, a movable portion on the substrate, a cap member which seals the movable portion so as to cover the movable portion, wherein a gas-generating material is applied to the movable portion side of the cap.

Abstract: This invention is directed to provision of high-performance inertial sensor that can sustain SNR even in an environment where vibration disturbance exists. A vibration type inertial sensor comprises: two deadweights (2, 3); means (C1, C2, C3, C4, +vd, ?vd) for displacing the two dead weights in the anti-phase; two sets of electrodes (C5, C6, C7, C8) for detecting, as capacitance changes, the displacements of the two dead weights; and a C/V converting unit (53) for converting the capacitance changes of the electrodes to electric signals. In the vibration type inertial sensor, a set of electrodes (e.g., C5 and C8), which exhibit an increased electrostatic capacitance therebetween in the case where the two dead weights (2, 3) are displaced in the anti-phase, are electrically connected to each other, and a set of electrodes (e.g.

Abstract: A technique in which a false detection and a wrong diagnosis can be suppressed in a capacitance sensor represented by an acceleration sensor is provided. A first capacitative element and a second capacitative element, which configure a capacitance detection unit, and a third capacitative element and a fourth capacitative element, which configure a forced oscillation generation unit, are electrically separated from each other. That is, the diagnosis movable electrode that configures the third capacitative element and the fourth capacitative element is formed integrally with the movable part. On the other hand, the diagnosis fixed electrode and the diagnosis fixed electrode are electrically separated from the detection fixed electrode and the detection fixed electrode.

Abstract: A high-performance angular rate detecting device is provided. A driving part including a drive frame and a Coriolis frame is levitated by at least two fixing beams which share a fixed end and are extending in a direction orthogonal to a driving direction, thereby vibrating the driving part. Even when a substrate is deformed by mounting or heat fluctuation, internal stress generated to the fixed beam and a supporting beam is small, thereby maintaining a vibrating state such as resonance frequency and vibration amplitude constant. Therefore, a high-performance angular rate detecting device which is robust to changes in mounting environment can be obtained.