Abstract: A test set-up (10) for non-destructive detection of a flaw in a device being tested by means of an eddy current has an excitation coil (14), to which an excitation signal (SE) can be sent to act on the device being tested (16) with an electromagnetic alternating field, a receiving coil (17) to generate a coil signal (SP), which is a function of the flaw in the device being tested (16), an analog-digital converter (21), which is coupled to the receiving coil (17) on the input side, a filter arrangement (22), which is coupled to the analog-digital converter (21) on the input side and is designed for band-pass filtering and scan rate reduction, and a demodulator (27), which is coupled to an output of the filter arrangement (22) on the input side.

Abstract: A sensor arrangement (10) includes a sensor (11) for a mechanical quantity or a thermal quantity, a processing circuit (12), which is connected at the input end to the sensor (11) and provides an output signal (SRF), which is processed for wireless transmission, and a cable (13), which is coupled to the processing circuit (12), to which the output signal (SRF) or a signal derived from the output signal (SRF) is supplied and which delivers a power supply to the processing circuit.

Abstract: A sensor arrangement (10) has a vibration sensor (11), which includes a cable (13) and is free of a metal housing, and a holding device (12), which is joined detachably to the vibration sensor (11) and is configured and arranged to protect mechanically and fix in place the vibration sensor (11).

Abstract: A device for the evaluation of vibrations (10) comprises an evaluating device (12), which comprises an input for introducing a vibration signal (SG) and is designed to determine a characteristic signal (BK) with the dimension of length/time? and/or the square (SE) of the characteristic signal (BK) from the vibration signal (SG) by means of a frequency-dependent evaluation of the vibration signal (SG). For a predefined value of a dimensional exponent ?, 1.3<?<1.7, a vibration sensor (11) of the device (10) outputs the vibration signal (SG). An RMS value (BEF) of the characteristic signal (BK) or the square (SE) of the characteristic signal (BK) essentially corresponds to the damaging effect of the vibrations on a structure or a machine. The square (SE) can be converted into a service life (T) according to the equation T=KB/SE and displayed.

Abstract: Method for determining a characteristic for the quality of alignment of a rotating machine, by obtaining vibration data with at least one vibration sensor, and using the vibration data obtained with the vibration sensor to determine a characteristic for the quality of alignment. Furthermore, alignment data obtained from first and second optoelectronic units is used in addition to the vibration data obtained with the at least one vibration sensor to produce a combination value from which both an instantaneous vibration state and success of the alignment can be determined.

Abstract: An alignment device with one or two optoelectronic transmitting and/or receiving units and an evaluation unit. At least one optoelectronic transmitting and/or receiving unit contains an inclinometer. Furthermore, the transmitting and/or receiving unit is connected to a vibration sensor which can be the inclinometer. Both the result of the alignment process and also the result of the vibration measurement are communicated to the user as an easily understandable characteristic on a display of the evaluation unit. For vibration measurement at a non-rotating part of a machine, an accelerometer/inclinometer sensor may be used for measuring acceleration forces resulting from machine vibrations to be measured and for measuring gravity and an electronic evaluation unit determining the orientation of the sensor with regard to gravity from a stationary component of the sensor output and determining sensor orientation from evaluation of non-stationary components of sensor output.

Abstract: A device for determining the position of a first mechanical element relative to a second mechanical element, having a first measurement unit for attachment to the first mechanical element, a second measurement unit for attachment to the second mechanical element, and an evaluation unit. The first measurement unit emits spectrally differing first and second light beams in essentially the same direction and a position-sensitive optical detector. The second measurement unit has a reflector arrangement facing the first measurement unit, in order to reflect the first and second light beams onto the detector. Surfaces facing the first measurement unit being color splitters having different reflectivity/transmissibility for the first light beam and the second light beam. The evaluation unit determines the location of the first and second mechanical elements relative to one another from the incidence positions of the reflected first and second light beams on the detector.

Abstract: An alignment device with one or two optoelectronic transmitting and/or receiving units and an evaluation unit. At least one optoelectronic transmitting and/or receiving unit contains an inclinometer. Furthermore, the transmitting and/or receiving unit is connected to a vibration sensor which can be the inclinometer. Both the result of the alignment process and also the result of the vibration measurement are communicated to the user as an easily understandable characteristic on a display of the evaluation unit. For vibration measurement at a non-rotating part of a machine, an accelerometer/inclinometer sensor may be used for measuring acceleration forces resulting from machine vibrations to be measured and for measuring gravity and an electronic evaluation unit determining the orientation of the sensor with regard to gravity from a stationary component of the sensor output and determining sensor orientation from evaluation of non-stationary components of sensor output.

Abstract: A rotating machine element is monitored for displacements using co-rotating sensors for acceleration, rotation or the direction of gravitation. In doing so, the sensor data are received by a, likewise, co-rotating electronic unit. The data can also be stored and further processed in this electronic unit.

Abstract: A method for correction of the measured values of optical alignment systems with at least two measurement planes which are located in succession in the beam path. From each measurement plane, the beam path to the light source is transformed back in order to compute new incidence points using a beam which has been corrected by taking into consideration imaging errors.

Abstract: A compact vibration meter has at least two vibration sensors which sense vibrations at regions of a support element, the detected vibrations being adjusted to the frequency range to be sensed by the respective sensor.

Abstract: A test set-up (10) for non-destructive detection of a flaw in a device being tested by means of an eddy current has an excitation coil (14), to which an excitation signal (SE) can be sent to act on the device being tested (16) with an electromagnetic alternating field, a receiving coil (17) to generate a coil signal (SP), which is a function of the flaw in the device being tested (16), an analog-digital converter (21), which is coupled to the receiving coil (17) on the input side, a filter arrangement (22), which is coupled to the analog-digital converter (21) on the input side and is designed for band-pass filtering and scan rate reduction, and a demodulator (27), which is coupled to an output of the filter arrangement (22) on the input side.

Abstract: A rotating machine element is monitored for displacements using co-rotating sensors for acceleration, rotation or the direction of gravitation. In doing so, the sensor data are received by a, likewise, co-rotating electronic unit. The data can also be stored and further processed in this electronic unit.

Abstract: A method for correction of the measured values of optical alignment systems with at least two measurement planes which are located in succession in the beam path. From each measurement plane, the beam path to the light source is transformed back in order to compute new incidence points using a beam which has been corrected by taking into consideration imaging errors.

Abstract: An alignment device with one or two optoelectronic transmitting and/or receiving units and an evaluation unit. At least one optoelectronic transmitting and/or receiving unit contains an inclinometer. Furthermore, the transmitting and/or receiving unit is connected to a vibration sensor which can be the inclinometer. Both the result of the alignment process and also the result of the vibration measurement are communicated to the user as an easily understandable characteristic on a display of the evaluation unit. For vibration measurement at a non-rotating part of a machine, an accelerometer/inclinometer sensor may be used for measuring acceleration forces resulting from machine vibrations to be measured and for measuring gravity and an electronic evaluation unit determining the orientation of the sensor with regard to gravity from a stationary component of the sensor output and determining sensor orientation from evaluation of non-stationary components of sensor output.

Abstract: A photodetector arrangement has a semiconductor body with a substrate, and first, second and third layers. The first layer is located at the first main surface of the semiconductor body which is suited for reception of incident photon radiation which is to be detected. The second layer is located at the second main surface of the semiconductor body which is at a distance to the first main surface. The third layer is located between the substrate and the second layer.

Abstract: A photodetector arrangement has a semiconductor body formed of a substrate, a first layer at a first main surface of the semiconductor body, and a second layer at a second main surface of the semiconductor body. The second main surface is remote from the first main surface. A first and a second measurement terminal are arranged at the second main surface on the edge of the second layer in regions remote from one another and are formed for the electrical contact-connection of the second layer from outside the semiconductor body. A first and a second transistor couple the second layer to the first and respectively the second measurement terminal.

Abstract: An optical element with improved deflection of a laser light beam calls for combination of a pentaprism with one or more glass blocks or an afocal optical system. A rotational angle-dependent parallel offset of emerging beams is eliminated for the most part.

Abstract: The shock isolation system for an inertial sensor arrangement, on the one hand, causes an advantageous moment of inertia by the special arrangement of the individual sensors, especially of the gyroscope used. On the other hand, an advantageous long interval of the required shock-absorbing components (“shock mounts”) is provided by the use of several tubular shells. A measurement device with this inertial sensor arrangement thus achieves improved accuracy and reliability.

Abstract: Vibration sensors or measurement detectors having connecting cables (40) for electrical supply voltages and/or signal voltages are provided with a clamping or winding space (42) on the bottom of the sensor housing (10). One or more turns of the respective connecting cable is deposited with in the clamping or winding space when the sensors are screwed tightly onto a machine or the like. The connecting cable can have any optional azimuth angle relative to the sensor coordinates and is well protected against external, damaging mechanical effects.