Abstract: A spoutless training lid assembly of a sippy cup includes a collar and a valve. The collar is configured to couple to a vessel and has an outer wall, an inner wall, an upper portion configured to be located outside the vessel and including an upper peripheral rim and a lower portion configured to be located inside the vessel and including a lower peripheral edge. The collar includes a peripheral shelf located about the inner wall. The valve is inserted into the collar and includes a flexible gasket over-molded to a rigid baffle to form a single, separable component. The gasket extends from a plate of the baffle and terminates at an outer peripheral edge that engages with the rim of the collar. The baffle secures to the shelf and portions of a perimeter edge of the plate of the baffle abut the inner wall of the collar.

Abstract: The present disclosure describes a semiconductor structure with a dielectric liner. The semiconductor structure includes a substrate and a fin structure on the substrate. The fin structure includes a stacked fin structure, a fin bottom portion below the stacked fin structure, and an isolation layer between the stacked fin structure and the bottom fin portion. The semiconductor structure further includes a dielectric liner in contact with an end of the stacked fin structure and a spacer structure in contact with the dielectric liner.

Abstract: A semiconductor device and method of forming the same are disclosed. The semiconductor device includes a fin structure, a gate electrode, a source-drain region, a plug and a hard mask structure. The gate electrode crosses over the fin structure. The source-drain region in the fin structure is aside the gate electrode. The plug is disposed over and electrically connected to the gate electrode. The hard mask structure surrounds the plug and is disposed over the gate electrode, wherein the hard mask structure includes a first hard mask layer and a second hard mask layer, the second hard mask layer covers a sidewall and a top surface of the first hard mask layer, and a material of the first hard mask layer is different from a material of the second hard mask layer.

Abstract: A method for forming a gate all around transistor includes forming a plurality of semiconductor nanosheets. The method includes forming a cladding inner spacer between a source region of the transistor and a gate region of the transistor. The method includes forming sheet inner spacers between the semiconductor nanosheets in a separate deposition process from the cladding inner spacer.

Abstract: An electrode for an electrochemical energy storage device formed from an electrostatic deposition process employs a composite particle including active material (AM) particle with adhered binder and optionally conductive particles formed with sufficient interaction forces between the individual ingredient particles to form an effective composite particle which can overcome particle separation during electrostatic charging, fluidization, and/or mechanical conveyance. Secondary binder particles undergo deagglomeration to form sub particles, which are adhered to the AM particles having a predetermined morphology. Smaller conductive particles, typically carbon black (CB) or similar carbon, are bound to the binder and adhere to the AM particles. The result is a composite particle adhered for withstanding separation forces imposed from electrostatic deposition onto a current collector.

Abstract: An electrode for an electrochemical energy storage device formed from an electrostatic deposition process employs a composite particle including active material (AM) particle with adhered binder and optionally conductive particles formed with sufficient interaction forces between the individual ingredient particles to form an effective composite particle which can overcome particle separation during electrostatic charging, fluidization, and/or mechanical conveyance. Secondary binder particles undergo deagglomeration to form sub particles, which are adhered to the AM particles having a predetermined morphology. Smaller conductive particles, typically carbon black (CB) or similar carbon, are bound to the binder and adhere to the AM particles. The result is a composite particle adhered for withstanding separation forces imposed from electrostatic deposition onto a current collector.

Abstract: Provided is a speaker, including: a frame, a first diaphragm and a flexible printed circuit board connected to the frame. The first diaphragm includes a first surface close to the flexible printed circuit board and arranged opposite to the flexible printed circuit board. The first surface is recessed along a direction departing from the flexible printed circuit board to form a glue slot. The first surface is connected to the flexible printed circuit board by glue to enable the glue to enter the glue slot. A thickness of the glue at a glue junction is increased to enhance strength of connection between the flexible printed circuit board and the first diaphragm to ensure reliability of mounting of the flexible printed circuit board on the first diaphragm, which may reduce a failure rate of the speaker.

Abstract: Provided in the present invention are a 4-1BB antibody and a preparation method and the use thereof. In particular, provided in the present invention are a 4-1BB antibody, which has high affinity to 4-1BB protein, can effectively activate the signal downstream of the 4-1BB and significantly increase expression quantities of IFN-? and IL-2 in human mixed lymphocytes or T lymphocytes, and can be used to treat cancers and autoimmune diseases.

Abstract: A spoutless training lid assembly of a sippy cup includes a collar and a valve. The collar is configured to couple to a vessel and has an outer wall, an inner wall, an upper portion configured to be located outside the vessel and including an upper peripheral rim and a lower portion configured to be located inside the vessel and including a lower peripheral edge. The collar includes a peripheral shelf located about the inner wall. The valve is inserted into the collar and includes a flexible gasket over-molded to a rigid baffle to form a single, separable component. The gasket extends from a plate of the baffle and terminates at an outer peripheral edge that engages with the rim of the collar. The baffle secures to the shelf and portions of a perimeter edge of the plate of the baffle abut the inner wall of the collar.

Abstract: Provided is a speaker, including: a frame, a first diaphragm and a flexible printed circuit board connected to the frame. The first diaphragm includes a first surface close to the flexible printed circuit board and arranged opposite to the flexible printed circuit board. The first surface is recessed along a direction departing from the flexible printed circuit board to form a glue slot. The first surface is connected to the flexible printed circuit board by glue to enable the glue to enter the glue slot. A thickness of the glue at a glue junction is increased to enhance strength of connection between the flexible printed circuit board and the first diaphragm to ensure reliability of mounting of the flexible printed circuit board on the first diaphragm, which may reduce a failure rate of the speaker.

Abstract: A method for manufacturing a component comprising bombarding nanoparticles in a dispersion with a laser to transform the ligand and cause the nanoparticles to drop out of the dispersion and deposit onto a substrate; and bombarding additional nanoparticles in the dispersion with the laser to transform the ligand and cause the nanoparticles to drop out of the dispersion and deposit onto the nanoparticles previously deposited out of the dispersion.

Abstract: Embodiments of methods for treating dielectric layers are provided herein. In some embodiments, a method of treating a dielectric layer disposed on a substrate supported in a process chamber includes: (a) exposing the dielectric layer to an active radical species formed in a plasma for a first period of time; (b) heating the dielectric layer to a peak temperature of about 900 degrees Celsius to about 1200 degrees Celsius; and (c) maintaining the peak temperature for a second period of time of about 1 second to about 20 seconds.

Abstract: Provided in the present invention are a 4-1BB antibody and a preparation method and the use thereof. In particular, provided in the present invention are a 4-1BB antibody, which has high affinity to 4-1BB protein, can effectively activate the signal downstream of the 4-1BB and significantly increase expression quantities of IFN-? and IL-2 in human mixed lymphocytes or T lymphocytes, and can be used to treat cancers and autoimmune diseases.

Abstract: Devices and methods for selectively oxidizing silicon are described herein. An apparatus for selective oxidation of exposed silicon surfaces includes a thermal processing chamber with a plurality of walls, first inlet connection and a second inlet connection, wherein the walls define a processing region within the processing chamber, a substrate support within the processing chamber, a hydrogen source connected with the first inlet connection, a heat source connected with the hydrogen source, and a remote plasma source connected with the second inlet connection and an oxygen source. A method for selective oxidation of non-metal surfaces, can include positioning a substrate in a processing chamber at a temperature less than 800° C., flowing hydrogen into the processing chamber, generating a remote plasma comprising oxygen, mixing the remote plasma with the hydrogen gas in the processing chamber to create an activated processing gas, and exposing the substrate to the activated gas.

Abstract: A dry electrode manufacturing process is employed for low cost battery through a dry mixing and formation process. A thermal activation renders the dry fabricated electrode comparable to conventional slurry casted electrodes. The dry electrode mixture results from a combination of a plurality of types of constituent particles, including at least an active charge material and a binder, and typically a conductive material such as carbon. The process heats the deposited mixture to a moderate temperature for activating the binder for adhering the mixture to the substrate, and compresses the deposited mixture to a thickness for achieving an electrical sufficiency of the compressed, deposited mixture as a charge material in a lithium-ion battery. In order to increase the bonding between the current collector and charge materials, an adhesive interlayer is applied through dry printing.

Abstract: A dry electrode manufacturing process employed for low cost battery through a dry mixing and formation process. A thermal activation renders the dry fabricated electrode comparable to conventional slurry casted electrodes. The dry electrode mixture results from a combination of a plurality of types of constituent particles, including at least an active charge material and a binder, and typically a conductive material such as carbon. The process heats the deposited mixture to a moderate temperature for activating the binder for adhering the mixture to the substrate; and compresses the deposited mixture to a thickness for achieving an electrical sufficiency of the compressed, deposited mixture as a charge material in a battery.

Abstract: Confining material particles during laser irradiation of the particles at ambient atmospheric pressure for additive manufacturing. In an embodiment, an optically transparent press permits transmitting a laser beam through the press to process material particles while simultaneously applying pressure to the particles. Confinement of material particles assists laser processing by providing densification, providing planarization, reducing the gap for material evaporation and transfer to a substrate, and the like.

Abstract: Embodiments of substrate support rings providing more uniform thickness of layers deposited or grown on a substrate are provided herein. In some embodiments, a substrate support ring includes: an inner ring with a centrally located support surface to support a substrate; and an outer ring extending radially outward from the support surface, wherein the outer ring comprises a reaction surface area disposed above and generally parallel to a support plane of the support surface, and wherein the reaction surface extends beyond the support surface by about 24 mm to about 45 mm.

Abstract: Embodiments of the present invention generally relate to apparatus for and methods of measuring and monitoring the temperature of a substrate having a 3D feature thereon. The apparatus include a light source for irradiating a substrate having a 3D feature thereon, a focus lens for gathering and focusing reflected light, and an emissometer for detecting the emissivity of the focused reflected light. The apparatus may also include a beam splitter and an imaging device. The imaging device provides a magnified image of the diffraction pattern of the reflected light. The method includes irradiating a substrate having a 3D feature thereon with light, and focusing reflected light with a focusing lens. The focused light is then directed to a sensor and the emissivity of the substrate is measured. The reflected light may also impinge upon an imaging device to generate a magnified image of the diffraction pattern of the reflected light.