Patents by Inventor Henry F. Erk
Henry F. Erk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9487406Abstract: Methods and systems for producing silane that use electrolysis to regenerate reactive components therein are disclosed. The methods and systems may be substantially closed-loop with respect to halogen, an alkali or alkaline earth metal and/or hydrogen.Type: GrantFiled: February 13, 2015Date of Patent: November 8, 2016Assignee: SunEdison, Inc.Inventors: Puneet Gupta, Henry F. Erk, Alexis Grabbe
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Publication number: 20150151977Abstract: Methods and systems for producing silane that use electrolysis to regenerate reactive components therein are disclosed. The methods and systems may be substantially closed-loop with respect to halogen, an alkali or alkaline earth metal and/or hydrogen.Type: ApplicationFiled: February 13, 2015Publication date: June 4, 2015Applicant: SUNEDISON, INC.Inventors: Puneet Gupta, Henry F. Erk, Alexis Grabbe
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Patent number: 9011803Abstract: Methods and systems for producing silane that use electrolysis to regenerate reactive components therein are disclosed. The methods and systems may be substantially closed-loop with respect to halogen, an alkali or alkaline earth metal and/or hydrogen.Type: GrantFiled: December 14, 2012Date of Patent: April 21, 2015Assignee: SunEdison, Inc.Inventors: Puneet Gupta, Henry F. Erk, Alexis Grabbe
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Patent number: 8974761Abstract: Methods and systems for producing silane that use electrolysis to regenerate reactive components therein are disclosed. The methods and systems may be substantially closed-loop with respect to halogen, an alkali or alkaline earth metal and/or hydrogen.Type: GrantFiled: July 18, 2014Date of Patent: March 10, 2015Assignee: SunEdison, Inc.Inventors: Puneet Gupta, Henry F. Erk, Alexis Grabbe
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Publication number: 20140328740Abstract: Methods and systems for producing silane that use electrolysis to regenerate reactive components therein are disclosed. The methods and systems may be substantially closed-loop with respect to halogen, an alkali or alkaline earth metal and/or hydrogen.Type: ApplicationFiled: July 18, 2014Publication date: November 6, 2014Applicant: SUNEDISON LLCInventors: Puneet Gupta, Henry F. Erk, Alexis Grabbe
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Patent number: 8828324Abstract: Fluidized bed reactor systems and distributors are disclosed as well as processes for producing polycrystalline silicon from a thermally decomposable silicon compound such as trichlorosilane. The processes generally involve reduction of silicon deposits on reactor walls during polycrystalline silicon production by use of a silicon tetrahalide.Type: GrantFiled: December 23, 2010Date of Patent: September 9, 2014Assignee: SunEdison, Inc.Inventor: Henry F. Erk
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Patent number: 8821825Abstract: Methods and systems for producing silane that use electrolysis to regenerate reactive components therein are disclosed. The methods and systems may be substantially closed-loop with respect to halogen, an alkali or alkaline earth metal and/or hydrogen.Type: GrantFiled: December 23, 2010Date of Patent: September 2, 2014Assignee: SunEdison, Inc.Inventors: Puneet Gupta, Henry F. Erk, Alexis Grabbe
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Patent number: 8309464Abstract: The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.Type: GrantFiled: March 31, 2009Date of Patent: November 13, 2012Assignee: MEMC Electronic Materials, Inc.Inventors: Henry F. Erk, Peter D. Albrecht, Eugene R. Hollander, Thomas E. Doane, Judith A. Schmidt, Roland R. Vandamme, Guoqiang (David) Zhang
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Publication number: 20120160702Abstract: Methods and systems for producing silane that use electrolysis to regenerate reactive components therein are disclosed. The methods and systems may be substantially closed-loop with respect to halogen, an alkali or alkaline earth metal and/or hydrogen.Type: ApplicationFiled: December 23, 2010Publication date: June 28, 2012Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: Puneet Gupta, Henry F. Erk, Alexis Grabbe
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Publication number: 20120164033Abstract: Methods and systems for producing silane that use electrolysis to regenerate reactive components therein are disclosed. The methods and systems may be substantially closed-loop with respect to halogen, an alkali or alkaline earth metal and/or hydrogen.Type: ApplicationFiled: December 23, 2010Publication date: June 28, 2012Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: Puneet Gupta, Henry F. Erk, Alexis Grabbe
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Patent number: 8192822Abstract: The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.Type: GrantFiled: March 31, 2009Date of Patent: June 5, 2012Assignee: MEMC Electronic Materials, Inc.Inventors: Henry F. Erk, Peter D. Albrecht, Eugene R. Hollander, Thomas E. Doane, Judith A. Schmidt, Roland R. Vandamme, Guoqiang (David) Zhang
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Publication number: 20110158888Abstract: Fluidized bed reactor systems and distributors are disclosed as well as processes for producing polycrystalline silicon from a thermally decomposable silicon compound such as trichlorosilane. The processes generally involve reduction of silicon deposits on reactor walls during polycrystalline silicon production by use of a silicon tetrahalide.Type: ApplicationFiled: December 23, 2010Publication date: June 30, 2011Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventor: Henry F. Erk
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Publication number: 20110158857Abstract: Fluidized bed reactor systems and distributors are disclosed as well as processes for producing polycrystalline silicon from a thermally decomposable silicon compound such as trichlorosilane. The processes generally involve reduction of silicon deposits on reactor walls during polycrystalline silicon production by use of a silicon tetrahalide.Type: ApplicationFiled: December 23, 2010Publication date: June 30, 2011Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventor: Henry F. Erk
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Patent number: 7938982Abstract: A process for etching silicon wafers using a caustic etchant in the form of an aqueous solution comprising water, a hydroxide ion source, and a chelating agent. The process produces silicon wafers substantially free from diffused metal ions.Type: GrantFiled: January 2, 2008Date of Patent: May 10, 2011Assignee: MEMC Electronic Materials, Inc.Inventors: Mark G. Stinson, Henry F. Erk, Guoqiang Zhang
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Publication number: 20110017230Abstract: Systems and methods are provided for processing abrasive slurry used in cutting operations. The slurry is mixed with a first solvent in a tank. The slurry is vibrated and/or ultrasonically agitated such that abrasive grain contained in the slurry separates from the other components of the slurry and the first solvent. After the abrasive grain has settled to a bottom portion of the container, the other components of the slurry and the first solvent are removed from the tank. The abrasive grain may then be washed with a second solvent. The abrasive grain is then heated and is suitable for reuse in an abrasive slurry.Type: ApplicationFiled: July 21, 2010Publication date: January 27, 2011Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: Henry F. Erk, Vandan Tanna
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Publication number: 20090247055Abstract: The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.Type: ApplicationFiled: March 31, 2009Publication date: October 1, 2009Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: Henry F. Erk, Peter D. Albrecht, Eugene R. Hollander, Thomas E. Doane, Judith A. Schmidt, Roland R. Vandamme, Guoqiang (David) Zhang
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Publication number: 20090242126Abstract: The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.Type: ApplicationFiled: March 31, 2009Publication date: October 1, 2009Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: Henry F. Erk, Peter D. Albrecht, Eugene R. Hollander, Thomas E. Doane, Judith A. Schmidt, Roland Vandamme, Guoqiang (David) Zhang
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Publication number: 20090246444Abstract: The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.Type: ApplicationFiled: March 31, 2009Publication date: October 1, 2009Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: Henry F. Erk, Peter D. Albrecht, Eugene R. Hollander, Thomas E. Doane, Judith A. Schmidt, Roland R. Vandamme, Guoqiang (David) Zhang
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Patent number: 7323421Abstract: A process for etching silicon wafers using a caustic etchant in the form of an aqueous solution comprising water, a hydroxide ion source, and a chelating agent. The process produces silicon wafers substantially free from diffused metal ions.Type: GrantFiled: June 14, 2005Date of Patent: January 29, 2008Assignee: MEMC Electronic Materials, Inc.Inventors: Mark G. Stinson, Henry F. Erk, Guoqiang (David) Zhang, Mick Bjelopavlic, Alexis Grabbe, Jozef G. Vermeire, Judith A. Schmidt, Thomas E. Doane, James R. Capstick
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Publication number: 20040108297Abstract: A process for etching silicon wafers using a caustic etchant in the form of an aqueous solution comprising water and a source of hydroxide ions and generally characterized by a lower concentration of water and/or higher concentration of source of hydroxide ions. In accordance with another embodiment, the caustic etchant includes a salt additive. The process produces silicon wafers with improved surface characteristics such as flatness and nanotopography.Type: ApplicationFiled: September 18, 2003Publication date: June 10, 2004Applicant: MEMC Electronic Materials, Inc.Inventors: Henry F. Erk, James R. Capstick, Thomas E. Doane, Alexis Grabbe, Judith A. Schmidt, Annlie Sing, Mark G. Stinson, Guoqiang (David) Zhang