Abstract: An acoustic imaging system coupled to a sensing plate to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers coupled to the sensing plate opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: An acoustic imaging system includes multiple transducers disposed to circumscribe a portion of substrate. An acoustic imaging system also includes a controller and an image resolver. The transducers convert electrical signals into mechanical energy and/or mechanical energy into electrical signals. The controller is adapted to apply an electrical signal to the transducers which, in response, induce a mechanical wave, such as a surface wave, into the circumscribed portion. The controller is also adapted to receive electrical signals from the transducers. The image resolver uses the electrical signals received by the controller in order to construct an image of an object in physical contact with the substrate.

Abstract: A biometric input system for an electronic device is provided. The biometric input system may be a fingerprint sensing system. The biometric input system includes a biometric sensing component, which may be a capacitive sensing component. The biometric input system also includes a composite cover element, which may be a dielectric cap or coating, and the biometric sensing component is capable of receiving a biometric input from a user through the composite cover element. Electronic devices including the biometric input system are also provided.

Abstract: Electronic assemblies and methods of attaching retention structures are described. The electronic assemblies may include a receiving substrate and a retention structure bonded to the receiving substrate. The retention structure may be patterned to include openings such as slot openings or a fishbone pattern in order to receive a pair of solder joints to bond the retention structure to a top side of the receiving substrate.

Abstract: An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: A gas-sensing apparatus with gas convection capability includes a gas sensor mounted inside a container, a substrate forming a bottom plate of the container and an actuator. The gas sensor is mounted over a first surface of the substrate internal to the container. The actuator is coupled to a second surface of the substrate external to the container. The actuator can cause convection of a gas within the container by enabling movements of the substrate in response to an activation signal.

Abstract: A portable electronic device may include a housing member defining a side surface of the portable electronic device, a portion of the housing member defining a side wall of a hole extending through the housing member, a button member positioned along the side surface and defining a chassis portion and a hollow post extending into the hole defined through the housing member, and a first waterproof seal defined between the hollow post and the side wall of the hole. The portable electronic device may also include a biometric sensing component coupled to the chassis portion, a flexible circuit element extending through the hollow post and conductively coupling the biometric sensing component to a component within the housing, and a second waterproof seal defined within the hollow post.

Abstract: An acoustic imaging system coupled to a sensing plate to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers coupled to the sensing plate opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: An acoustic imaging system includes multiple transducers disposed to circumscribe a portion of substrate. An acoustic imaging system also includes a controller and an image resolver. The transducers convert electrical signals into mechanical energy and/or mechanical energy into electrical signals. The controller is adapted to apply an electrical signal to the transducers which, in response, induce a mechanical wave, such as a surface wave, into the circumscribed portion. The controller is also adapted to receive electrical signals from the transducers. The image resolver uses the electrical signals received by the controller in order to construct an image of an object in physical contact with the substrate.

Abstract: An acoustic imaging system includes multiple transducers disposed to circumscribe a portion of substrate. An acoustic imaging system also includes a controller and an image resolver. The transducers convert electrical signals into mechanical energy and/or mechanical energy into electrical signals. The controller is adapted to apply an electrical signal to the transducers which, in response, induce a mechanical wave, such as a surface wave, into the circumscribed portion. The controller is also adapted to receive electrical signals from the transducers. The image resolver uses the electrical signals received by the controller in order to construct an image of an object in physical contact with the substrate.

Abstract: Aspects of the subject technology relate to electronic devices with antennas. The antenna may be a display-integrated antenna. An antenna feed for the antenna may be located in a recess in a sidewall of a housing of the device. The antenna feed may be coupled to transceiver circuitry on a logic board of the device by a pair of flex circuits. A first one of the pair of flex circuits may form a portion of an antenna feed assembly. A second one of the pair of flex circuits may be an impedance-matching flex having an end that is soldered to the main logic board. The antenna may be coupled to a conductive portion of the housing of the device.

Abstract: A gas-sensing apparatus with gas convection capability includes a gas sensor mounted inside a container, a substrate forming a bottom plate of the container and an actuator. The gas sensor is mounted over a first surface of the substrate internal to the container. The actuator is coupled to a second surface of the substrate external to the container. The actuator can cause convection of a gas within the container by enabling movements of the substrate in response to an activation signal.

Abstract: An electronic device may be provided with environmental sensors. Environmental sensors may include one or more environmental sensor components and one or more acoustic components. Acoustic components may include a speaker or a microphone. Environmental sensor components may include a temperature sensor, a pressure sensor, a humidity sensor, a gas sensor, or other sensors or combinations of sensors for sensing attributes of the environment surrounding the device. The environmental sensor may have an enclosure with an opening. The enclosure may be formed from a rigid support structure and a portion of a printed circuit. The opening may be formed in the rigid support structure or the printed circuit. The opening in the enclosure for the environmental sensor may be aligned with an opening in an outer structural member for the device. The outer structural member may be a housing structure or a cover layer for a device display.

Abstract: An electronic device having a pressure sensor configured to determine pressure is disclosed. The electronic device includes an enclosure defining an internal volume. The enclosure may include a sidewall with an external opening that provides a vent for the internal components. To reduce the response of the pressure sensor (that is, the time required to detect a pressure change), the pressure sensor may secure with an internal wall of the enclosure. Further, the internal wall includes an opening defining an air pocket significantly smaller than the internal volume. When the pressure sensor is mounted to receive air via the air pocket, the pressure sensor may respond faster to pressure changes, as compared to receiving air circulating throughout the internal volume. This is due in part to an amount of airflow passing through the air pocket causing a greater pressure change throughout the air pocket as compared to the internal volume.

Abstract: A hardware security token in contact with a user's body can send a signal via interbody communication to one or more electronic devices associated with a system of electronic devices having unified access controls such that a user can access each of the electronic devices using the same credentials. The signal sent by the hardware security token can be deputized by a user in possession of credentials to the system as a temporary proxy for that user's identity. In other examples, the signal sent by the portable security token can be deputized by a user in possession of credentials to the system as a temporary proxy for another user's identity. In some embodiments, the proxy can expire after a period of time or after a particular event occurs.

Abstract: An electronic device may be provided with environmental sensors. Environmental sensors may include one or more environmental sensor components and one or more acoustic components. Acoustic components may include a speaker or a microphone. Environmental sensor components may include a temperature sensor, a pressure sensor, a humidity sensor, a gas sensor, or other sensors or combinations of sensors for sensing attributes of the environment surrounding the device. The environmental sensor may have an enclosure with an opening. The enclosure may be formed from a rigid support structure and a portion of a printed circuit. The opening may be formed in the rigid support structure or the printed circuit. The opening in the enclosure for the environmental sensor may be aligned with an opening in an outer structural member for the device. The outer structural member may be a housing structure or a cover layer for a device display.

Abstract: A hardware security token in contact with a user's body can send a signal via interbody communication to one or more electronic devices associated with a system of electronic devices having unified access controls such that a user can access each of the electronic devices using the same credentials. The signal sent by the hardware security token can be deputized by a user in possession of credentials to the system as a temporary proxy for that user's identity. In other examples, the signal sent by the portable security token can be deputized by a user in possession of credentials to the system as a temporary proxy for another user's identity. In some embodiments, the proxy can expire after a period of time or after a particular event occurs.

Abstract: Aspects of the subject technology relate to electronic devices with antennas. The antenna may be a display-integrated antenna. An antenna feed for the antenna may be located in a recess in a sidewall of a housing of the device. The antenna feed may be coupled to transceiver circuitry on a logic board of the device by a pair of flex circuits. A first one of the pair of flex circuits may form a portion of an antenna feed assembly. A second one of the pair of flex circuits may be an impedance-matching flex having an end that is soldered to the main logic board. The antenna may be coupled to a conductive portion of the housing of the device.

Abstract: An electronic device may be provided with environmental sensors. Environmental sensors may include one or more environmental sensor components and one or more acoustic components. Acoustic components may include a speaker or a microphone. Environmental sensor components may include a temperature sensor, a pressure sensor, a humidity sensor, a gas sensor, or other sensors or combinations of sensors for sensing attributes of the environment surrounding the device. The environmental sensor may have an enclosure with an opening. The enclosure may be formed from a rigid support structure and a portion of a printed circuit. The opening may be formed in the rigid support structure or the printed circuit. The opening in the enclosure for the environmental sensor may be aligned with an opening in an outer structural member for the device. The outer structural member may be a housing structure or a cover layer for a device display.

Abstract: Systems, methods, and computer-readable media for calibrating the offset of a magnetometer assembly with reduced power are provided. In one embodiment, a method for operating an assembly may include determining a difference between a current signal measurement output component of a first magnetometer sensor and a previous signal measurement output component of the first magnetometer sensor, comparing the determined difference with a current threshold value, and generating an assembly output based on the comparing, where, when the determined difference is greater than the current threshold value, the generating may include providing a first assembly output using a current offset output component of a second magnetometer sensor, and, when the determined difference is less than the current threshold value, the generating may include providing a second assembly output using a previous offset output component of the second magnetometer sensor.