Abstract: An electronic device may be provided with electronic components such as buttons and environmental sensors. An environmental sensor may be temperature sensor for gathering temperature data associated with the environment surrounding the device. The temperature sensor may be mounted to a button member for the button. The button member may be an actuating member that moves within an opening in a device housing and that extends beyond an outer surface of the housing into the surrounding environment. The button member may be arranged so that an internal electronic switch is activated when the button member is moved within the opening. The button member may be thermally isolated from other device structures using insulating material on the button member. The button member may be formed from a thermally conductive material that transmits the temperature of environmental materials that contact the button member to the temperature sensor.

Abstract: An electronic device that includes an enclosure having an external surface and a first array of ultrasonic transducers arranged along a first direction and a second array of ultrasonic transducers arranged along a second direction. The first array of ultrasonic transducers may be configured to produce a surface wave along the external surface. A set of scattered waves may be created by the touch on the external surface. The second array of ultrasonic transducers may be configured to receive a portion of the set of scattered waves and produce an output. The device may also include a processing unit that is configured to identify the touch using the output. The processing unit may be further configured to create a reconstruction of at least a portion of a fingerprint associated with the touch on the cover, and to identify the fingerprint using the reconstruction.

Abstract: An electronic device may be provided with environmental sensors. Environmental sensors may include one or more environmental sensor components and one or more acoustic components. Acoustic components may include a speaker or a microphone. Environmental sensor components may include a temperature sensor, a pressure sensor, a humidity sensor, a gas sensor, or other sensors or combinations of sensors for sensing attributes of the environment surrounding the device. The environmental sensor may have an enclosure with an opening. The enclosure may be formed from a rigid support structure and a portion of a printed circuit. The opening may be formed in the rigid support structure or the printed circuit. The opening in the enclosure for the environmental sensor may be aligned with an opening in an outer structural member for the device. The outer structural member may be a housing structure or a cover layer for a device display.

Abstract: In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.

Abstract: In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.

Abstract: An electronic device may be provided with environmental sensors. Environmental sensors may include one or more environmental sensor components and one or more acoustic components. Acoustic components may include a speaker or a microphone. Environmental sensor components may include a temperature sensor, a pressure sensor, a humidity sensor, a gas sensor, or other sensors or combinations of sensors for sensing attributes of the environment surrounding the device. The environmental sensor may have an enclosure with an opening. The enclosure may be formed from a rigid support structure and a portion of a printed circuit. The opening may be formed in the rigid support structure or the printed circuit. The opening in the enclosure for the environmental sensor may be aligned with an opening in an outer structural member for the device. The outer structural member may be a housing structure or a cover layer for a device display.

Abstract: An electronic device may be provided with an electronic compass. The electronic compass may include magnetic sensors. The magnetic sensors may include thin-film magnetic sensor elements such as giant magnetoresistance sensor elements. Magnetic flux concentrators may be used to guide magnetic fields through the sensor elements. The magnetic flux concentrators may be configured to reduce the angular sensitivity of the magnetic sensors. A magnetic flux concentrator may be formed from multiple stacked layers of soft magnetic material separated by non-magnetic material. The non-magnetic material may have a thickness allows the magnetic layers to magnetically couple through the Ruderman-Kittel-Kasuya-Yosida (RKKY) interaction.

Abstract: In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.

Abstract: An electronic device may include one or more low-noise pressure sensors for measuring air pressure. The electronic device may include wireless communications circuitry for communicating with external devices also having pressure sensors. Pressure data gathered by an external device may be used as reference pressure data for the electronic device. For example, if both devices are located in the same building, both pressure sensors will detect similar pressure fluctuations due to doors opening and closing and temperature-control systems turning on and off. By subtracting the reference pressure data from the pressure data gathered by the electronic device, calibrated pressure data may be obtained and may be used to reliably detect vertical displacement changes of the electronic device. In other scenarios, the pressure data may be compared with the reference pressure data to determine whether the two devices are in the same room.

Abstract: Electronic devices may be provided with magnetic sensors for detecting the Earth's magnetic field. The magnetic sensors may include thin magnetic sensors located in magnetically quiet regions of the device. The magnetic sensors may be attached to a device housing or a component such as a battery or a cover structure for a battery. The device may include unidirectional magnetic sensors aligned in three orthogonal directions or sensors with two or three magnetic sensor elements aligned in orthogonal directions. Magnetic field data from the three orthogonally aligned sensors or sensor elements may be combined to form directional compass data for the device. Each magnetic sensor may include one or more magnetic sensor elements for detecting the magnetic field and one or more shielded reference sensor elements for detecting environmental changes that can affect the magnetic sensor element. Reference sensor elements may be shared elements for multiple magnetic sensors elements.

Abstract: An electronic device having a pressure sensor configured to determine pressure is disclosed. The electronic device includes an enclosure defining an internal volume. The enclosure may include a sidewall with an external opening that provides a vent for the internal components. To reduce the response of the pressure sensor (that is, the time required to detect a pressure change), the pressure sensor may secure with an internal wall of the enclosure. Further, the internal wall includes an opening defining an air pocket significantly smaller than the internal volume. When the pressure sensor is mounted to receive air via the air pocket, the pressure sensor may respond faster to pressure changes, as compared to receiving air circulating throughout the internal volume. This is due in part to an amount of airflow passing through the air pocket causing a greater pressure change throughout the air pocket as compared to the internal volume.

Abstract: An electronic device may be provided with an electronic compass. The electronic compass may include magnetic sensors. The magnetic sensors may include thin-film magnetic sensor elements such as giant magnetoresistance sensor elements. Magnetic flux concentrators may be used to guide magnetic fields through the sensor elements. The magnetic flux concentrators may be configured to reduce the angular sensitivity of the magnetic sensors. A magnetic flux concentrator may be formed from multiple stacked layers of soft magnetic material separated by non-magnetic material. The non-magnetic material may have a thickness allows the magnetic layers to magnetically couple through the Ruderman-Kittel-Kasuya-Yosida (RKKY) interaction.

Abstract: An electronic device may include one or more low-noise pressure sensors for measuring air pressure. The electronic device may include wireless communications circuitry for communicating with external devices also having pressure sensors. Pressure data gathered by an external device may be used as reference pressure data for the electronic device. For example, if both devices are located in the same building, both pressure sensors will detect similar pressure fluctuations due to doors opening and closing and temperature-control systems turning on and off. By subtracting the reference pressure data from the pressure data gathered by the electronic device, calibrated pressure data may be obtained and may be used to reliably detect vertical displacement changes of the electronic device. In other scenarios, the pressure data may be compared with the reference pressure data to determine whether the two devices are in the same MOM.

Abstract: Systems, methods, and computer-readable media for calibrating the offset of a magnetometer assembly with reduced power are provided. In one embodiment, a method for operating an assembly may include determining a difference between a current signal measurement output component of a first magnetometer sensor and a previous signal measurement output component of the first magnetometer sensor, comparing the determined difference with a current threshold value, and generating an assembly output based on the comparing, where, when the determined difference is greater than the current threshold value, the generating may include providing a first assembly output using a current offset output component of a second magnetometer sensor, and, when the determined difference is less than the current threshold value, the generating may include providing a second assembly output using a previous offset output component of the second magnetometer sensor.

Abstract: A portable consumer electronics device has a handheld portable device housing, and an electronic camera module integrated in the housing. The module has a focusing lens with an optical axis, an imaging sensor to receive the focused light, and an electro-optic variable aperture to allow different amounts of focused light to reach the imaging sensor. The aperture has a stack that includes a front transparent conductor medium, an electrolyte medium, an active electro-chromic medium, and a rear transparent conductor medium. The front transparent conductor medium contains an outer region and an inner region. The inner region is aligned with the optical axis, surrounded by the outer region, and electrically isolated from the outer region. Other embodiments are also described and claimed.

Abstract: An electro-optic aperture has a stack that includes a front transparent conductor medium, an active electro-chromic medium, and a rear transparent conductor medium. The front and rear transparent conductor mediums are directly connected to each other by a conductive section located within the imaging path. Other embodiments are also described and claimed.

Abstract: The described embodiments relate generally to a capacitor assembly for mounting on a printed circuit board (PCB) and more specifically to designs for mechanically isolating the capacitor assembly from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Termination elements in the capacitor assembly, including a porous conductive layer in the capacitor assembly may reduce an amount of vibrational energy transferred from the capacitor to the PCB. Termination elements including a soft contact layer may also reduce the amount of vibrational energy transferred to the PCB. Further, capacitor assemblies having thickened dielectric material may reduce the amount of vibrational energy transferred to the PCB.

Abstract: An electronic device may be provided with electronic components such as buttons and environmental sensors. An environmental sensor may be temperature sensor for gathering temperature data associated with the environment surrounding the device. The temperature sensor may be mounted to a button member for the button. The button member may be an actuating member that moves within an opening in a device housing and that extends beyond an outer surface of the housing into the surrounding environment. The button member may be arranged so that an internal electronic switch is activated when the button member is moved within the opening. The button member may be thermally isolated from other device structures using insulating material on the button member. The button member may be formed from a thermally conductive material that transmits the temperature of environmental materials that contact the button member to the temperature sensor.

Abstract: An electronic device may be provided with electronic components such as buttons and environmental sensors. An environmental sensor may be temperature sensor for gathering temperature data associated with the environment surrounding the device. The temperature sensor may be mounted to a button member for the button. The button member may be an actuating member that moves within an opening in a device housing and that extends beyond an outer surface of the housing into the surrounding environment. The button member may be arranged so that an internal electronic switch is activated when the button member is moved within the opening. The button member may be thermally isolated from other device structures using insulating material on the button member. The button member may be formed from a thermally conductive material that transmits the temperature of environmental materials that contact the button member to the temperature sensor.

Abstract: An electronic device may be provided with environmental sensors. Environmental sensors may include one or more environmental sensor components and one or more acoustic components. Acoustic components may include a speaker or a microphone. Environmental sensor components may include a temperature sensor, a pressure sensor, a humidity sensor, or other sensors or combinations of sensors for sensing attributes of the environment surrounding the device. The environmental sensor may have an enclosure with an opening. The enclosure may be formed from a rigid support structure and a portion of a printed circuit. The opening may be formed in the rigid support structure or the printed circuit. The opening in the enclosure for the environmental sensor may be aligned with an opening in an outer structural member for the device. The outer structural member may be a housing structure or a cover layer for a device display.