Patents by Inventor Henry Ho

Henry Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6116186
    Abstract: An apparatus comprising a semiconductor processing chamber, a plasma generator, and a pipe connecting a semiconductor processing chamber and the plasma generator. The plasma generator includes a generation chamber, a radio frequency generator which generates an ion plasma within the generation chamber, a magnetic device which confines the plasma primarily within a center region of the generation chamber, and a thermally conductive member disposed around the outer surface of the generation chamber for removing heat away from the chamber.
    Type: Grant
    Filed: March 19, 1998
    Date of Patent: September 12, 2000
    Assignee: Applied Materials, Inc.
    Inventors: Steven T. Li, Andrew J. Ruspini, Henry Ho
  • Patent number: 6110284
    Abstract: A semiconductor processing system comprising a semiconductor processing chamber, a light, a temperature detector, and a member. The light is positioned to heat the confines of the chamber. The temperature detector measures the temperature at the location within the chamber. The member has a translucent quartz shell and opaque core and shields the location from light emanating from the light source.
    Type: Grant
    Filed: January 9, 1998
    Date of Patent: August 29, 2000
    Assignee: Applied Materials, Inc.
    Inventors: Chen-An Chen, Henry Ho, Steven A. Chen
  • Patent number: 6066836
    Abstract: A resistive heating structure for a processing apparatus such as a chemical vapor deposition chamber. The system includes a resistive heating substrate holder including a support surface and a support shaft, the holder being comprised of a first material. The support surface includes a resistive heating element. The support shaft has a given length, and through bores for allowing a thermocouple to engage the support surface and electrical conductors to couple to the resistive heating element in the support surface. A metallic mounting structure is coupled to the support shaft and secured to the process apparatus to create a sealed environment within the holder and mounting structure to protect the electrical leads and thermocouple from the process environment.
    Type: Grant
    Filed: September 23, 1996
    Date of Patent: May 23, 2000
    Assignee: Applied Materials, Inc.
    Inventors: Steven Aihua Chen, Henry Ho, Mei Chang, Ming Xi, Chen-An Chen, Chiliang Chen