Abstract: A timing calibration system for an adjustable delay time of a delay module for an electronic circuit is provided. The system includes a control delay module including at least one calibration delay module, the control delay module having a second delay time. The system also includes a timing module associated with the control delay module, a comparison module associated with the timing module and an adjustment module for the delay module. The timing module measures the second delay time, the comparison module compares the second delay time with a desired delay time and produces a comparison result and the adjustment module calibrates the adjustable delay time utilizing the comparison result.

Abstract: A capsule is formed from a PVA composition by blow moulding. Such capsules can at last provide a viable alternative to gelatin for biodegradable capsules containing a pharmaceutical or consumable or other substance, for example, a detergent. The capsules may contain solid or liquid substances. Blow moulding apparatus suitable for forming such capsules is also disclosed.

Abstract: The invention relates to load-carrying apparatus, for example pallets and shipping containers, rotationally moulded from a plastics material filled with a mineral filler. Methods and apparatus for manufacturing the load-carrying apparatus are also described. In one embodiment, the load-carrying apparatus comprises a pallet formed in two halves as two pallet elements. The plastic, rotationally moulded pallet elements form a nested configuration when stacked in the same orientation, but interlock to form a double-sided pallet when one of the pallet elements is inverted.

Abstract: The invention relates to load-carrying apparatus, for example pallets and shipping containers, rotationally moulded from a plastics material filled with a mineral filler. Methods and apparatus for manufacturing the load-carrying apparatus are also described. In one embodiment, the load-carrying apparatus comprises a pallet formed in two halves as two pallet elements. The plastic, rotationally moulded pallet elements form a nested configuration when stacked in the same orientation, but interlock to form a double-sided pallet when one of the pallet elements is inverted.

Abstract: The interaction of Sn, Sb and Pb with tungsten in contact with an aqueous medium has a synergistic effect in which the leachability of each metal is suppressed. This means that tungsten has the ability to suppress the leachability of these same metals, in particular lead. For example, tungsten may be added to the lead-contaminated soil in order to suppress lead contamination of the ground water by forming lead tungstate which has a very low solubility.

Abstract: The leachability of tungsten in an aqueous medium may be suppressed by combining tungsten metal with a metal oxide or metal salt that will form an insoluble tungsten-containing compound when the mixture is brought into contact with an aqueous medium. The additive is preferably present in an amount from about 1 weight percent (wt. %) to about 10 weight percent of the tungsten of the tungsten. Preferred additives are lead oxide and calcium sulfate.

Abstract: The coating the tungsten powder particles with a ceramic barrier suppresses the leachability of tungsten in aqueous media. Preferably, the ceramic coating substantially encapsulates each particle of tungsten and has a thickness of at least about 30 nm and, more preferable, from about 200 nm to about 500 nm. Examples of ceramic coatings that may be used include, but are not limited to, aluminum oxide (alumina), aluminum oxyhydroxide (AlOOH), zirconium oxide (zirconia), cerium oxide (ceria), hafnium oxide (hafnia), and magnesium oxide (magnesia).

Abstract: An extrudable PVA-containing composition is disclosed, which enables PVA articles to be manufactured on conventional extrusion apparatus. The composition includes a lubricant, such as a fatty acid amide, and is formed into pellets by cold pressing. The compositions are suitable for manufacturing a variety of products.

Abstract: A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an electroplating process, that generates metal grains that are sufficiently small so as to substantially fill the recessed microstructures. The deposited metal is subsequently subjected to an annealing process at a temperature below about 100 degrees Celsius, and may even take place at ambient room temperature to allow grain growth which provides optimal electrical properties. Various novel apparatus for executing unique annealing processes are also set forth.

Abstract: A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an electroplating process, that generates metal grains that are sufficiently small so as to substantially fill the recessed microstructures. The deposited metal is subsequently subjected to an annealing process at a temperature below about 100 degrees Celsius, and may even take place at ambient room temperature to allow grain growth which provides optimal electrical properties. Various novel apparatus for executing unique annealing processes are also set forth.

Abstract: A process for providing one or more protected copper elements on a surface of a workpiece is set forth. In accordance with the process, a barrier layer is applied to the workpiece. If the barrier layer is not suitable as a seed layer for subsequent electroplating processes, a separate seed layer is applied over the surface of the barrier layer. One or more copper elements are then electroplated on selected portions of the seed layer or, if suitable, the barrier layer. If used, the seed layer is then substantially removed. At least a portion of a surface of the barrier layer is rendered unplatable while leaving the copper elements suitable for electroplating. A protective layer is then electroplated onto surfaces of the one or more copper elements.

Abstract: An extrudable PVA-containing composition is disclosed, which enables PVA articles to be manufactured on conventional extrusion apparatus. The compositions includes a lubricant, such as a fatty acid amide, most preferably octodecanamide and is most preferably formed into pellets by cold pressing.,The compositions are suitable for manufacturing a variety of products.

Abstract: A process for removing at least one thin-film layer from a surface of a workpiece pursuant to manufacturing a microelectronic interconnect or component is set forth. Generally stated, the process comprises the oxidation of at least a portion of the at least one thin-film layer and the etching of the oxidized thin-film layer using an etchant that selectively etches primarily the oxidized thin-film layer.

Abstract: A timing calibration system for an adjustable delay time of a delay module for an electronic circuit is provided. The system includes a control delay module including at least one calibration delay module, the control delay module having a second delay time. The system also includes a timing module associated with the control delay module, a comparison module associated with the timing module and an adjustment module for the delay module. The timing module measures the second delay time, the comparison module compares the second delay time with a desired delay time and produces a comparison result and the adjustment module calibrates the adjustable delay time utilizing the comparison result.

Abstract: A process for removing at least one thin-film layer from a surface of a workpiece pursuant to manufacturing a microelectronic interconnect or component is set forth. Generally stated, the process comprises the oxidation of at least a portion of the at least one thin-film layer and the etching of the oxidized thin-film layer using an etchant that selectively etches primarily the oxidized thin-film layer.

Abstract: An apparatus for application of a chemical process to a workpiece in which movement and precise location of the workpiece within the apparatus is accomplished by means of a single linear actuator and two locator components. A sequence of liquid solutions may be applied to a surface of the workpiece during processing, and a sequence of controlled atmospheres may be provided within a reaction chamber of the apparatus to thereby facilitate implementation of chemical processes that utilize both liquid-phase and gas-phase reactions in concert.

Abstract: A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an electroplating process, that generates metal grains that are sufficiently small so as to substantially fill the recessed microstructures. The deposited metal is subsequently subjected to an annealing process at a temperature below about 100 degrees Celsius, and may even take place at ambient room temperature to allow grain growth which provides optimal electrical properties. Various novel apparatus for executing unique annealing processes are also set forth.

Abstract: A process for providing one or more protected copper elements on a surface of a workpiece is set forth. In accordance with the process, a barrier layer is applied to the workpiece. If the barrier layer is not suitable as a seed layer for subsequent electroplating processes, a separate seed layer is applied over the surface of the barrier layer. One or more copper elements are then electroplated on selected portions of the seed layer or, if suitable, the barrier layer. If used, the seed layer is then substantially removed. At least a portion of a surface of the barrier layer is rendered unplatable while leaving the copper elements suitable for electroplating. A protective layer is then electroplated onto surfaces of the one or more copper elements.

Abstract: An apparatus for application of a chemical process to a workpiece in which movement and precise location of the workpiece within the apparatus is accomplished by means of a single linear actuator and two locator components. A sequence of liquid solutions may be applied to a surface of the workpiece during processing, and a sequence of controlled atmospheres may be provided within a reaction chamber of the apparatus to thereby facilitate implementation of chemical processes that utilize both liquid-phase and gas-phase reactions in concert.