Abstract: A system to enable detection of the process corner of each of the P and N devices of an SRAM array (of bitcells) and of peripheral devices. This permits more focused (optimized and compensated) design of non-SRAM peripheral circuits and of read and write assist circuits for better handling of process distribution impact on circuits improving functionality and yield.

Abstract: A system to enable detection of the process corner of each of the P and N devices of an SRAM array (of bitcells) and of peripheral devices. This permits more focused (optimized and compensated) design of non-SRAM peripheral circuits and of read and write assist circuits for better handling of process distribution impact on circuits improving functionality and yield.

Abstract: A system to enable detection of the process corner of each of the P and N devices of an SRAM array (of bitcells) and of peripheral devices. This permits more focused (optimized and compensated) design of non-SRAM peripheral circuits and of read and write assist circuits for better handling of process distribution impact on circuits improving functionality and yield.

Abstract: A circuit is powered through a P-type transistor whose thermal instability behavior is to be evaluated. The threshold of the P-type transistor under evaluation and consequently the saturation current of the transistor are reflected in the frequency of the circuit, which in one embodiment is a ring oscillator. Additional circuitry is connected to the P-type transistor and the ring oscillator to ensure the proper stress conditions for the transistor and consequently to the evaluation of the P-type transistor.

Abstract: A system to enable detection of the process corner of each of the P and N devices of an SRAM array (of bitcells) and of peripheral devices. This permits more focused (optimized and compensated) design of non-SRAM peripheral circuits and of read and write assist circuits for better handling of process distribution impact on circuits improving functionality and yield.

Abstract: A circuit is powered through a transistor whose thermal instability behavior is to be evaluated in a stress test. The transistor is stressed during a stress phase of the stress test with a sensor circuit powered off and the Vds of the transistor is zero. The sensor circuit is powered on through the transistor during an evaluate phase of the stress test.

Abstract: A golf club head with an improved striking face is disclosed herein. More specifically, the present invention utilizes an innovative die quenching method that can alter the Young's modulus of the material of the striking face. The striking face portion of the present invention generally created from an ?+? titanium alloy such as SP 700 that contains a ? rich alloy composition to create more phase change in the alloying elements. In a preferred embodiment, the die quenching process could create a localized change in the material's Young's modulus throughout different regions of the striking face, resulting in a change in the Young's modulus of the material within the same striking face.

Abstract: A golf club head with an improved striking face is disclosed herein. More specifically, the present invention utilizes an innovative die quenching method that can alter the Young's modulus of the material of the striking face. The striking face portion of the present invention generally created from an ?+? titanium alloy such as SP 700 that contains a ? rich alloy composition to create more phase change in the alloying elements. In a preferred embodiment, the die quenching process could create a localized change in the material's Young's modulus throughout different regions of the striking face, resulting in a change in the Young's modulus of the material within the same striking face.

Abstract: A sensor circuit is used to provide bit-cell read strength distribution of an SRAM array. A current-mirror circuit mirroring the bit-line current of an SRAM array is used to power the sensor circuit. A reference current representing nominal bit-cell read current is used as a reference. The current-mirror circuit senses the bit-line current. The current-mirror and the ring oscillator are not part of the bit-line read path.

Abstract: A circuit is powered through a transistor whose thermal instability behavior is to be evaluated in a stress test. The transistor is stressed during a stress phase of the stress test with a sensor circuit powered off and the Vds of the transistor is zero. The sensor circuit is powered on through the transistor during an evaluate phase of the stress test.

Abstract: A golf club head with an improved striking face is disclosed herein. More specifically, the present invention utilizes an innovative die quenching method that can alter the Young's modulus of the material of the striking face. The striking face portion of the present invention generally created from an ?+? titanium alloy such as SP 700 that contains a ? rich alloy composition to create more phase change in the alloying elements. In a preferred embodiment, the die quenching process could create a localized change in the material's Young's modulus throughout different regions of the striking face, resulting in a change in the Young's modulus of the material within the same striking face.

Abstract: A sensor circuit is used to provide bit-cell read strength distribution of an SRAM array. A current-mirror circuit mirroring the bit-line current of an SRAM array is used to power the sensor circuit. A reference current representing nominal bit-cell read current is used as a reference. The current-mirror circuit senses the bit-line current. The current-mirror and the ring oscillator are not part of the bit-line read path.

Abstract: A circuit is powered through a P-type transistor whose thermal instability behavior is to be evaluated. The threshold of the P-type transistor under evaluation and consequently the saturation current of the transistor are reflected in the frequency of the circuit, which in one embodiment is a ring oscillator. Additional circuitry is connected to the P-type transistor and the ring oscillator to ensure the proper stress conditions for the transistor and consequently to the evaluation of the P-type transistor.

Abstract: In one embodiment, one portion of an SRAM array is stressed by first writing a “1” in every bit of the array, followed by an evaluation of the relevant parameters of the array using a ring oscillator driven by a mirrored bit-line current, the ring oscillator not in line of the bit-line of the SRAM. The other portion of the array is then stressed after writing a “0” in every bit of the array. The evaluation procedure is then repeated.

Abstract: Systems and methods are disclosed for managing power consumption in electronic devices. In certain embodiments, an integrated circuit for managing power consumption in an electronic device includes an input/output (I/O) interface, a first circuit block coupled to the I/O interface, and an interface circuit coupled between the I/O interface and the first circuit block, the interface circuit configured to provide a defined logic state to the first circuit block or a second circuit block external to the integrated circuit if one of the first circuit block or the second circuit block is powered down. By providing a defined logic state to the first circuit block or the second circuit block when one of the first circuit block or the second circuit block is powered down, power consumption of the electronic device may be reduced.

Abstract: A golf club head with an improved striking face is disclosed herein. More specifically, the present invention utilizes an innovative die quenching method that can alter the Young's modulus of the material of the striking face. The striking face portion of the present invention generally created from an ?+? titanium alloy such as SP 700 that contains a ? rich alloy composition to create more phase change in the alloying elements. In a preferred embodiment, the die quenching process could create a localized change in the material's Young's modulus throughout different regions of the striking face, resulting in a change in the Young's modulus of the material within the same striking face.

Abstract: A synchronous memory system configurable in a multiplexed or non-multiplexed mode. In the multiplexed mode, address and data are provided on a shared bus, and accesses to the memory system are qualified by memory access control signals, including an address strobe signal, a counter enable signal and a counter repeat signal. A read/write control signal is maintained for one cycle after the last valid access command to avoid bus turn-around problems. In the multiplexed mode, chip enable and output enable signals may be constantly activated, thereby simplifying associated printed circuit board design. Different ports of the synchronous memory system can be independently configured to operate in either the multiplexed or non-multiplexed mode.

Abstract: Systems and methods are disclosed for managing power consumption in electronic devices. In certain embodiments, an integrated circuit for managing power consumption in an electronic device includes an input/output (I/O) interface, a first circuit block coupled to the I/O interface, and an interface circuit coupled between the I/O interface and the first circuit block, the interface circuit configured to provide a defined logic state to the first circuit block or a second circuit block external to the integrated circuit if one of the first circuit block or the second circuit block is powered down. By providing a defined logic state to the first circuit block or the second circuit block when one of the first circuit block or the second circuit block is powered down, power consumption of the electronic device may be reduced.

Abstract: A synchronous memory system configurable in a multiplexed or non-multiplexed mode. In the multiplexed mode, address and data are provided on a shared bus, and accesses to the memory system are qualified by memory access control signals, including an address strobe signal, a counter enable signal and a counter repeat signal. A read/write control signal is maintained for one cycle after the last valid access command to avoid bus turn-around problems. In the multiplexed mode, chip enable and output enable signals may be constantly activated, thereby simplifying associated printed circuit board design. Different ports of the synchronous memory system can be independently configured to operate in either the multiplexed or non-multiplexed mode.

Abstract: Capacitive coupling correction circuits are coupled between adjacent parallel dynamic (pre-charged) or static conductors. The capacitive coupling correction circuits effectively isolate a low voltage applied to a first conductor from a high pre-charged voltage stored on an adjacent second conductor (or vice versa). The adjacent parallel conductors can be bit lines of a memory cell. Each capacitive coupling correction circuit can include an inverter having an input terminal coupled to the first conductor, and an output terminal coupled to a first plate of a capacitor. A second plate of the capacitor is coupled to the second conductor. The capacitance of the capacitor is selected to be identical to a parasitic capacitance between the first and second conductors. As a result, there is a zero net voltage effect between the first and second conductors. The capacitive coupling correction circuits may be distributed along the length of the first and second conductors.