Abstract: A modular datacenter is disclosed. The modular datacenter includes a containment unit, a first rack system mounted in the containment unit and extending along a first side wall thereof, a second rack system mounted in the containment unit and extending along a second side wall thereof. The second wall is opposed to the first wall, the first and second rack systems being spaced from one another and defining an aisle there between. The first and second rack systems are configured to house electronic devices disposed in immersion casings filled with an immersion cooling liquid. The modular datacenter further includes an extraction mobile apparatus for performing maintenance on the electronic devices, the extraction mobile apparatus being operatively connected to a floor surface of the containment unit and configured to navigate along the aisle.

Abstract: A rack system for housing an electronic device comprising: an immersion case configured to provide housing to the electronic device, and to receive an immersion cooling liquid, wherein the immersion case includes a drainage opening, wherein the drainage opening is configured to remove at least a part of the immersion cooling liquid from the immersion case, based on a user actuated action, during a de-racking operation of the immersion case; and a rack frame configured to slidably accommodate racking and de-racking operations of the immersion case.

Abstract: A rack for supporting data center equipment has a frame including vertical wall supports are connected to a base and extending upwardly therefrom. The base defines a first and second openings extending in a lateral direction for receiving a fork of a lifting machine along the lateral direction. The base includes: a first upper wall and a second upper wall defining in part the first opening and the second opening; a lower wall disposed between the upper walls along a depth direction of the rack and extending vertically lower than the upper walls; and two side walls extending vertically from the lower wall to a respective one of the upper walls. The two side walls and the lower wall together define a middle cavity. Each of the two side walls defines a third opening and a fourth opening for receiving the fork of the lifting machine along a depth direction.

Abstract: The disclosed systems and structures are directed to providing a hybrid liquid-cooling system for at least one rack-mounted immersion case containing at least one electronic assembly submerged in dielectric immersion cooling liquid. The hybrid liquid cooling system comprises a closed-loop fluid distribution arrangement configured to circulate channelized fluid, an external cooling module configured to thermally condition the channelized fluid circulated by the closed-loop fluid distribution arrangement, a serpentine convection coil structured to internally convey channelized fluid to operatively cool ambient temperatures of the dielectric immersion cooling liquid, and one or more fluid cooling blocks arranged to be in direct thermal contact with one or more heat-generating electronic processing components of the at least one electronic assembly.

Abstract: A method for assembling a rack column assembly comprising: positioning a first data center rack on a support surface; stacking a second data center rack atop the first data center rack; placing a first vertical column on a first lateral side of the data center racks; after said stacking, placing a second vertical column on a second lateral side of the data center racks; connecting the first vertical column to the data center racks by fastening first lateral side attachment brackets to the data center racks; and connecting the second vertical column to the data center racks by fastening second lateral side attachment brackets to the data center racks, the first lateral side attachment brackets and the second lateral side attachment brackets limiting movement of the data center racks in a depth direction of the rack column assembly. A rack column assembly is also disclosed.

Abstract: A cooling assembly and method for cooling a plurality of heat-generating components. The cooling assembly includes a main liquid inlet for receiving a heat-transfer liquid, a main liquid outlet for discharging the heat-transfer liquid and a plurality of liquid cooling units. Each liquid cooling unit is in thermal contact with a corresponding heat-generating component and includes an internal liquid conduit, the heat-transfer liquid flowing in the internal liquid conduit collecting thermal energy from the corresponding heat-generating component. The liquid cooling units are arranged in a plurality of groups, each group comprising one or more liquid cooling units fluidly connected in parallel to one another. The groups are arranged in at least one cluster, each cluster comprising two or more groups fluidly connected in series.

Abstract: A cooling arrangement for cooling of a rack hosting an electronic device includes a first loop including a liquid cooling unit thermally coupled to a heat-generating component of the electronic device, a primary side of a liquid-to-liquid heat exchanger fluidly connected to the liquid cooling unit; and a pump fluidly connected between the primary side and the liquid cooling unit. A second loop includes a secondary side of the liquid-to-liquid heat exchanger thermally coupled to the primary side for transfer of heat from the primary side to the secondary side. A relief line selectively fluidly connects the first and second loops and is operable in: (i) a closed state whereby the relief line does not allow cooling liquid flow therethrough, and (ii) an open state whereby the relief line fluidly connects the first and second loops.

Abstract: A fluid leakage deflection arrangement for a liquid-cooled rack-mounted electronic processing assembly and a method for deflecting fluid leakages in a liquid-cooled rack-mounted electronic processing assembly are disclosed. The fluid leakage deflection arrangement comprises an immersion case containing a first cooling liquid in which an electronic device of the rack-mounted electronic processing assembly is at least partially submerged therein; and a deflection unit configured to prevent the electronic device from being in contact with a leaking liquid distinct from the first cooling liquid by diverting leaking liquid away from the electronic components.

Abstract: An electronic device and a cooling monitoring system for an electronic device receiving power from a power supply. The electronic device includes a board at least in part immersed in an immersion case comprising a first heat-transfer liquid for cooling of the electronic device, one or more sensors configured to measure an operating parameter of the first heat-transfer liquid, and a controller communicably connected to the one or more sensors, the controller being configured to receive signals from the one or more sensors and, in response to determining that the signals indicate that the operating parameter of the first heat-transfer liquid is above a threshold, cause to disconnect the electronic device from the power supply.

Abstract: A method is provided for positioning a data center rack relative to a rack-supporting frame. The method includes: affixing at least one left guiding member and at least one right guiding member to the to left and right vertical support units; affixing at least one front rack-locating member to a front side of the data center rack; lifting the data center rack; inserting the data center rack between the left and right vertical support units until the at least one front rack-locating member abuts front end surfaces of the vertical support units or the at least one left and right guiding members; affixing at least one rear rack-locating member to a rear side of the data center rack; and lowering the data center rack so that the front and rear rack-locating members are supported by the at least one left guiding member and the at least one right guiding member.

Abstract: A system comprises a rack, a support member, and a component configured for being supported in the rack by the support member. The support member is selectively insertable in the rack and comprises a plate at its rear end, the plate extending at an angle from a direction of insertion of the support member in the rack, the support member further comprising a first liquid connector mounted to the plate. The component comprises a second liquid connector mounted on a rear edge of the component, the second liquid connector being connectable to the first liquid connector when the support member and the component are inserted in the rack. A method comprises mounting the first and second liquid connectors to the support member and to the component, respectively, inserting the support member to the rack, and inserting the component in the rack until both liquid connectors are connected.

Abstract: A cooling arrangement for a rack hosting electronic equipment and at least one fan comprises first and second air-liquid heat exchangers. A first one is mounted to the rack so that heated air expelled from the rack by the fan flows therethrough. The second one is mounted to the first one so that air having flowed through the first heat exchanger flows through the second heat exchanger. Each heat exchanger comprises a frame, an inlet receiving liquid from a cold supply line, an outlet returning liquid to a hot return line, and a continuous internal conduit forming a plurality of interconnected parallel sections. The cooling arrangement is mounted to the rack so that the first and second frames are parallel and adjacent. One interconnected parallel section of the first heat exchanger nearest to its inlet is proximate one interconnected parallel section of the second heat exchanger nearest to its outlet.

Abstract: A rack adapting device for an electronic equipment rack is disclosed. The electronic equipment rack is configured to house first electronic equipment modules having a first module width between left and right equipment supports laterally spaced apart from one another by a rack housing width corresponding to the first module width. The rack adapting device is configured to adapt the electronic equipment rack to house a plurality of second electronic equipment modules having a second module width and comprises: an adapter body; a plurality of rack-engaging features disposed on a first lateral side thereof and configured to engage rack mounting features of one of the left and right equipment supports; and a plurality of adapter mounting features disposed on a second lateral side such that, in use, the second electronic equipment modules are mounted between the rack adapting device and an other one of the left and right equipment supports.

Abstract: A rack assembly for a data center includes: a rack frame housing at least one heat-generating component; a heat exchanger defining a first internal fluid conduit; at least one liquid cooling block connected to the at least one heat-generating component, each of the at least one liquid cooling block defining a second internal fluid conduit, the second internal fluid conduit being in thermal connection with the first internal fluid conduit; a cooling loop independent from any sources of cooling fluid external to the rack assembly and comprising the first and second internal fluid conduits, the cooling loop transferring heat from the second internal fluid conduit to the first internal fluid conduit; and a fluid compensation system comprising a reservoir fluidly connected to the cooling loop and an actuating device to force cooling fluid from the reservoir to the cooling loop to compensate for loss of cooling fluid in the cooling loop.

Abstract: A flow detection device comprises a fluidic input port connected to a fluidic output port via a channel and a float located within the channel. A specific weight of the float exceeds a specific weight of a fluid injected in the flow detection device. Respective locations of the fluidic input port, of the channel and of the fluidic output port on the flow detection device cause the float to rise within the channel when a sufficient flow of the fluid is injected in the flow detection device. A sensor is provided to detect a position of the float within the channel. The flow detection device may be integrated in a cooling circuit having a cooling device for an electronic device to detect an eventual lack of a flow of a cooling fluid in the cooling circuit. A status of the flow of the cooling fluid is reported to a processor.

Abstract: A cooling arrangement for an electronic device comprises a primary cooling device and a secondary cooling device. The primary cooling device includes a fluidic input line receiving a cooling fluid from a cooling fluid source and a fluidic output line returning the cooling fluid toward a drain. The primary cooling device is thermally connected to the electronic device, receives the cooling fluid from the fluidic input line and transfers heat from the electronic device to the cooling fluid before returning the cooling fluid via the fluidic output line. A flow detection device monitors a flow of the cooling fluid in the primary cooling device. The secondary cooling device is thermally connected to the electronic device. A processor activates the secondary cooling device to absorb and dissipate heat from the electronic device when the flow detection device detects a lack of flow of the cooling fluid in the primary cooling device.

Abstract: A rack adapting device for an electronic equipment rack is disclosed. The electronic equipment rack is configured to house first electronic equipment modules having a first module width between left and right equipment supports laterally spaced apart from one another by a rack housing width corresponding to the first module width. The rack adapting device is configured to adapt the electronic equipment rack to house a plurality of second electronic equipment modules having a second module width and comprises: an adapter body; a plurality of rack-engaging features disposed on a first lateral side thereof and configured to engage rack mounting features of one of the left and right equipment supports; and a plurality of adapter mounting features disposed on a second lateral side such that, in use, the second electronic equipment modules are mounted between the rack adapting device and an other one of the left and right equipment supports.

Abstract: A rack system for housing an electronic device comprises an immersion case configured to provide housing to the electronic device. The immersion case includes a first wall, and a second wall. The first wall and the second wall define means for controlling deformation of the immersion case, such that when an immersion cooling liquid is inserted in the immersion case, the means for controlling deformation limit the deformation of the immersion case.

Abstract: A rack system for housing an electronic device comprising: an immersion case configured to provide housing to the electronic device, and to receive an immersion cooling liquid, wherein the immersion case includes a drainage opening, wherein the drainage opening is configured to remove at least a part of the immersion cooling liquid from the immersion case, based on a user actuated action, during a de-racking operation of the immersion case; and a rack frame configured to slidably accommodate racking and de-racking operations of the immersion case.

Abstract: A cooling device mountable on an electronic component comprising: a body having an internal fluid conduit for allowing a heat-transfer fluid to flow therethrough. The body comprises a first surface configured for mounting on the electronic component and permitting thermal transfer therethrough; a second surface; at least one side wall extending between the first surface and the second surface; and a gasket extending along the at least one side wall or a perimeter of the first surface, the gasket configured to extend away from the body beyond the first surface in a direction transverse thereto, to fluidly insulate the first surface when the first surface is mounted on the electronic component and submerged in the immersion cooling liquid in use.