Abstract: A micromechanical component for a sensor device or microphone device. The component includes a diaphragm support structure with a diaphragm, a cavity formed in the diaphragm support structure and adjoined by a diaphragm inner side, and a separating trench structured through the surface of the diaphragm support structure and extends to the cavity and completely frames the diaphragm, and that is sealed off media-tight and/or air-tight using at least one separating trench closure material. An etching channel is formed in the diaphragm support structure, separately from the separating trench, and extends from its first etching channel end section to its second etching channel end section. The first etching channel end section opens into the cavity, and the second etching channel end section is sealed off media-tight and/or air-tight using at least one etching channel closure structure formed on an outer partial surface of the surface of the diaphragm support structure.

Abstract: A bonding pad layer system is deposited on a semiconductor chip as a base, for example, a micromechanical semiconductor chip, in which at least one self-supporting dielectric membrane made up of dielectric layers, a platinum conductor track and a heater made of platinum is integrated. In the process, the deposition of a tantalum layer takes place first, upon that the deposition of a first platinum layer, upon that the deposition of a tantalum nitride layer, upon that the deposition of a second platinum layer and upon that the deposition of a gold layer, at least one bonding pad for connecting with a bonding wire being formed in the gold layer. The bonding pad is situated in the area of the contact hole on the semiconductor chip, in which a platinum conductor track leading to the heater is connected using a ring contact and/or is connected outside this area.

Abstract: Roller packages (IO) for grinding devices (70), comprising a first roll (11), which is maintained by at least one first bearing body (13), and a second roll (12), which is maintained by at least one second bearing body (14). The first bearing body (13) and the second bearing body (14) are prestressed against each other and comprise stop elements (17,19) with stop surfaces (18, 20), the contact of which counteracts a contact of the rolls (11, 12). The rotational position of the first stop element (17) determines the minimum width of the grinding gap. Also disclosed are grinding devices (70), methods for operating a roll assembly (10) and methods for determining the radial force acting between the rolls (11, 12) of a roll assembly (10).

Abstract: Roller packages (IO) for grinding devices (70), comprising a first roll (11), which is maintained by at least one first bearing body (13), and a second roll (12), which is maintained by at least one second bearing body (14). The first bearing body (13) and the second bearing body (14) are prestressed against each other and comprise stop elements (17,19) with stop surfaces (18, 20), the contact of which counteracts a contact of the rolls (11, 12). The rotational position of the first stop element (17) determines the minimum width of the grinding gap. Also disclosed are grinding devices (70), methods for operating a roll assembly (10) and methods for determining the radial force acting between the rolls (11, 12) of a roll assembly (10).

Abstract: A sensor device. The sensor device includes: a substrate; an electrical insulation layer on the substrate; an edge structure disposed on the electrical insulation layer and that delimits an internal region above the substrate; a membrane anchored on the edge structure and at least partly spanning the internal region, the membrane encompassing in the internal region a region movable by a pressure; a first intermediate carrier that extends in the movable region below the membrane and is electrically and mechanically connected to the membrane by contact points, and encompasses at least one spacing element that extends from the intermediate carrier toward the substrate; and a first counter electrode on the electrical insulation layer, the first counter electrode extending under the intermediate carrier, and a first distance between the intermediate carrier and the first counter electrode being modifiable by the pressure on the movable region.

Abstract: A production method for a micromechanical component for a sensor or microphone device. The method includes: patterning a plurality of first trenches through a substrate surface of a monocrystalline substrate made of at least one semiconductor material using anisotropic etching, covering the lateral walls of the plurality of first trenches with a passivation layer, while bottom areas of the plurality of first trenches are kept free or are freed of the passivation layer, etching at least one first cavity, into which the plurality of first trenches opens, into the monocrystalline substrate using an isotropic etching method, in which an etching medium of the isotropic etching method is conducted through the plurality of first trenches, and by covering the plurality of first trenches by epitaxially growing a monocrystalline sealing layer on the substrate surface of the monocrystalline substrate made of the at least one identical semiconductor material as the monocrystalline substrate.

Abstract: Roller packages (IO) for grinding devices (70), comprising a first roller (II), which is maintained by at least one first bearing body (13), and a second roller (12), which is maintained by at least one second bearing body (14). The first bearing body (13) and the second bearing body (14) are prestressed against each other and comprise stop elements (17, 19) with stop surfaces (18, 20), the contact of which counteracts a contact of the rollers (II, 12). The rotational position of the first stop element (17) determines the minimum width of the grinding gap. Also disclosed are grinding devices (70), methods for operating a roller group (IO) and methods for determining the radial force acting between the rollers (II, 12) of a roller group (IO).

Abstract: A method for sealing entries in a MEMS element. The method includes: providing a functional layer having a functional region; producing a cavity underneath the functional region of the functional layer with the aid of a first entry outside of the functional region of the functional layer; sealing the first entry; producing a second entry to the cavity outside of the functional region of the functional layer; melting sealing material in the region of the second entry; and cooling off the melted sealing material to seal the second entry.

Abstract: A micromechanical component for a capacitive pressure sensor device, including a diaphragm that is stretched with the aid of a frame structure in such a way that a cantilevered area of the diaphragm spans a framed partial surface, and including a reinforcement structure that is formed at the cantilevered area. A first spatial direction oriented in parallel to the framed partial surface is definable in which the cantilevered area has a minimal extension, and a second spatial direction oriented in parallel to the framed partial surface and oriented perpendicularly with respect to the first spatial direction is definable in which the cantilevered area has a greater extension. The reinforcement structure is present at a first distance from the frame structure in the first spatial direction, and at a second distance in the second spatial direction, the second distance being greater than the first distance.

Abstract: A micromechanical component, whose diaphragm is supported and has support structures on its inner diaphragm side. Each of the support structures includes a first and second edge element structure, and at least one intermediate element structure positioned between the first and second edge element structures. For each of the support structures, a plane of symmetry is definable, with respect to which at least the first edge element structure of the respective support structure and the second edge element structure of the respective support structure are specularly symmetric. In each of support structures, a first maximum dimension of its first edge element structure perpendicular to its plane of symmetry and a second maximum dimension of its second edge element structure perpendicular to its plane of symmetry are greater than the maximum dimension of its intermediate element structure perpendicular to its plane of symmetry.

Abstract: A micromechanical component for a sensor or microphone device, including a substrate, a frame structure, which is situated on the substrate surface and/or at least one intermediate layer, and a diaphragm, which spans an inner volume, which is at least partially framed by the frame structure. The micromechanical component includes a bending beam structure, which is situated in the inner volume and includes at least one anchoring area, which is attached to the frame structure, to the substrate surface and/or to the at least one intermediate layer, and at least one self-supporting area, which is connected via at least one coupling structure to the diaphragm inner side of the diaphragm in such a way that the at least one self-supporting area is bendable by way of a warping of the diaphragm.

Abstract: Roller packages (IO) for grinding devices (70), comprising a first roller (II), which is maintained by at least one first bearing body (13), and a second roller (12), which is maintained by at least one second bearing body (14). The first bearing body (13) and the second bearing body (14) are prestressed against each other and comprise stop elements (17, 19) with stop surfaces (18, 20), the contact of which counteracts a contact of the rollers (II, 12). The rotational position of the first stop element (17) determines the minimum width of the grinding gap. Also disclosed are grinding devices (70), methods for operating a roller group (IO) and methods for determining the radial force acting between the rollers (II, 12) of a roller group (IO).

Abstract: A micromechanical component for a sensor device or microphone device. The component includes a diaphragm support structure with a diaphragm, a cavity formed in the diaphragm support structure and adjoined by a diaphragm inner side, and a separating trench structured through the surface of the diaphragm support structure and extends to the cavity and completely frames the diaphragm, and that is sealed off media-tight and/or air-tight using at least one separating trench closure material. An etching channel is formed in the diaphragm support structure, separately from the separating trench, and extends from its first etching channel end section to its second etching channel end section. The first etching channel end section opens into the cavity, and the second etching channel end section is sealed off media-tight and/or air-tight using at least one etching channel closure structure formed on an outer partial surface of the surface of the diaphragm support structure.

Abstract: A micromechanical pressure sensor device and a corresponding manufacturing method. The micromechanical pressure sensor device is equipped with a sensor substrate; a diaphragm system that is anchored in the sensor substrate and that includes a first diaphragm and a second diaphragm situated spaced apart therefrom, which are circumferentially connected to one another in an edge area and enclose a reference pressure in an interior space formed in between; and a plate-shaped electrode that is suspended in the interior space and that is situated spaced apart from the first diaphragm and from the second diaphragm and forms a first capacitor with the first diaphragm and forms a second capacitor with the second diaphragm. The first diaphragm and the second diaphragm are designed in such a way that they are deformable toward one another when acted on by an external pressure.

Abstract: A micromechanical component for a capacitive pressure sensor device includes a substrate; a frame structure that frames a partial surface; a membrane that is tensioned by the frame structure such that a self-supporting region of the membrane extends over the framed partial surface and an internal volume with a reference pressure therein is sealed in an airtight fashion, the self-supporting region of the membrane being deformable by a physical pressure on an external side of the self-supporting region that not equal to the reference pressure; a measurement electrode situated on the framed partial surface; and a reference measurement electrode that is situated on the framed partial surface and is electrically insulated from the measurement electrode.

Abstract: A bonding pad layer system is deposited on a semiconductor chip as a base, for example, a micromechanical semiconductor chip, in which at least one self-supporting dielectric membrane made up of dielectric layers, a platinum conductor track and a heater made of platinum is integrated. In the process, the deposition of a tantalum layer takes place first, upon that the deposition of a first platinum layer, upon that the deposition of a tantalum nitride layer, upon that the deposition of a second platinum layer and upon that the deposition of a gold layer, at least one bonding pad for connecting with a bonding wire being formed in the gold layer. The bonding pad is situated in the area of the contact hole on the semiconductor chip, in which a platinum conductor track leading to the heater is connected using a ring contact and/or is connected outside this area.

Abstract: A magnetically drivable micromirror having an outer frame, a coil former, and torsion springs, situated in a first plane, the torsion springs having an axis of rotation, and the coil former being connected to the outer frame by the torsion springs so as to be capable of rotational motion about the axis of rotation, having a mirror element that is situated in a second plane parallel to the first plane, the mirror element being connected to the coil former by an intermediate layer. A 2D scanner having a first magnetically drivable micromirror and a second drivable mirror, and to a method for producing a micromirror are also described.

Abstract: A method for the micro-structured application of a fluid or paste onto a surface, including providing a substrate having a surface, coating the surface with a non-stick layer, at least partially removing the non-stick layer and producing a coating area, and applying at least one fluid droplet or paste droplet onto the surface in the coating area.

Abstract: A method is described for producing a micromechanical component. The method includes providing a first substrate, providing a second substrate, developing a projecting patterned element on the second substrate, and connecting the first and the second substrate via the projecting patterned element. The method provides that the connecting of the first and the second substrate includes eutectic bonding. Also described is a micromechanical component, in which a first and a second substrate are connected to each other.

Abstract: A micromechanical component includes a first space in which a first sensor is situated and a second space in which a second sensor is situated, different pressures prevailing in the first and second spaces, one of the two spaces extending via a third space to a first lattice structure which is situated in an edge region of the component and is essentially hermetically sealed.