Abstract: Disclosed herein is an optical system, comprising a first optical component, featuring a first waveguide and a recess which passes at least partially through the first optical component from a front side to a back side, a second optical component, arranged in the recess of the first optical component, and a second waveguide optically coupled with the first waveguide, and a carrier substrate. The first optical component including a first marking set with a defined position/orientation relative to the first waveguide, the second optical component including a second marking set with a defined position/orientation relative to the second waveguide, and based on a relative position/orientation of the first and second marking sets, determine whether the first and the second optical components are aligned in a reference plane that is parallel to a surface of the carrier substrate, such that the first and the second waveguide are optically coupled.

Abstract: An autologous bone graft substitute composition for inducing new bone formation, promoting bone growth and treating bone defects, a method of preparation thereof, and a method of inducing or promoting bone growth by treatment of a bone with an autologous bone graft substitute composition. The composition includes autologous blood; one or more analogs of an osteogenic bone morphogenetic protein selected from BMP-6, BMP-2, BMP-7, BMP-4, BMP-5, BMP-8, BMP-9, BMP-12, and BMP-13, and combinations thereof; and a compression resistant matrix selected from the group consisting of a bone autograft, bone allograft, hydroxyapatite, tri-calcium phosphate, and combinations thereof. The autologous blood forms a coagulum gel comprising a fibrin-meshwork reinforced with the compression resistant matrix and containing the osteogenic bone morphogenetic protein which is released over a sustained period.

Abstract: Disclosed herein is a method for manufacturing a semiconductor comprising mechanically connecting one or more separate semiconductor components to a common intermediate carrier, arranging the intermediate carrier with respect to a substrate so that, at least for a majority of the semiconductor components, at least one solder pad of a particular semiconductor component lies opposite a solder pad of the substrate associated therewith forming a solder joint, and connecting mutually assiocaited solder pads of the one or more semiconductor components and the substrate by melting and solidifying a solder material arranged between the mutually associated solder pads. A surface tension of the solder material between the mutually associated solder pads of the substrate and the one or more semiconductor components sets a predetermined position of the intermediate carrier relative to the substrate, in which the one or more semiconductor components assume a target position relative to the substrate.

Abstract: Embodiments provide a method for manufacturing a device. The method comprises providing a first carrier having attached thereto a plurality of chips by means of an adhesive layer of the first carrier, a first surface of the plurality of chips being attached to the first carrier. Further, the method comprises selectively attaching a second surface of a subset of the plurality of chips to a conveyor carrier by means of a structured adhesive layer of the conveyor layer. Further, the method comprises selectively releasing the subset of the plurality of chips from the first carrier by means of debonding corresponding sections of the adhesive layer of the first carrier. Further, the method comprises attaching the first surface of the subset of the plurality of chips to a substrate of the device.

Abstract: An assembly may include at least one camera and a controllable mechanical handling device. The system may further include a first component, including a first optical waveguide and a second component, including a second optical waveguide. The first component and the second component are fixedly connected to a substrate and arranged directly next to one another on the substrate and relative to one another in such a way that a coupling side of the first component and a coupling side of the second component are situated opposite each other on a first and second side of a coupling plane. The optical waveguides of the first and second component each end at a first coupling surface or a second coupling surface. The first and second coupling sides are aligned, and optically coupled with one another at a first and second end face.

Abstract: Disclosed is a system for and a method of manufacturing of an optical system, including a first optical component, comprising a first waveguide and a carrier substrate, wherein the first optical component is arranged on the carrier substrate. The first optical component comprises a first markup set having a defined position/orientation with respect to the first waveguide, the carrier substrate has a second markup set detectable based on a relative position/orientation of the first and second markup sets when a desired orientation of the first waveguide relative to the carrier substrate is achieved in a reference plane extending parallel to a surface of the carrier substrate.

Abstract: The invention relates to a cyanide-free formulation for the electrodeposition of a layer of gold and silver on electrically conductive substrates, wherein the formulation respectively contains a complexing agent from the group of sulfites and thiosulfates and is characterized in that at least one transition metal from the 5th or 6th sub-group is added in the form of the soluble oxygen acid thereof in order to increase the bath stability.

Abstract: An autologous bone graft substitute composition for inducing new bone formation, promoting bone growth and treating bone defects, a method of preparation thereof, and a method of inducing or promoting bone growth by treatment of a bone with an autologous bone graft substitute composition. The composition includes autologous blood; one or more analogs of an osteogenic bone morphogenetic protein selected from BMP-6, BMP-2, BMP-7, BMP-4, BMP-5, BMP-8, BMP-9, BMP-12, and BMP-13, and combinations thereof; and a compression resistant matrix selected from the group consisting of a bone autograft, bone allograft, hydroxyapatite, tri-calcium phosphate, and combinations thereof. The autologous blood forms a coagulum gel comprising a fibrin-meshwork reinforced with the compression resistant matrix and containing the osteogenic bone morphogenetic protein which is released over a sustained period.

Abstract: The present invention relates to an Autologous Bone Graft Substitute composition (ABGS) for inducing new bone formation, promoting bone growth and treating of bone defect, a preparation method of the Autologous Bone Graft Substitute composition, and a kit for preparing the Autologous Bone Graft Substitute composition of implant. In a particular aspect, the invention relates to an injectable/extrudable/implantable Autologous Bone Graft Substitute composition for use in treatment of bone defects, inducing new bone formation and promoting bone growth for bone fracture healing, spinal fusions and to repair bone defects in bone reconstructive procedures of orthopedic and oral maxillofacial-dental surgeries.

Abstract: Disclosed is a system for and a method of manufacturing of an optical system, including a first optical component, comprising a first waveguide and a carrier substrate, wherein the first optical component is arranged on the carrier substrate. The first optical component comprises a first markup set having a defined position/orientation with respect to the first waveguide, the carrier substrate has a second markup set detectable based on a relative position/orientation of the first and second markup sets when a desired orientation of the first waveguide relative to the carrier substrate is achieved in a reference plane extending parallel to a surface of the carrier substrate.

Abstract: Disclosed herein is an optical system, comprising a first optical component, featuring a first waveguide and a recess which passes at least partially through the first optical component from a front side to a back side, a second optical component, arranged in the recess of the first optical component, and a second waveguide optically coupled with the first waveguide, and a carrier substrate. The first optical component including a first marking set with a defined position/orientation relative to the first waveguide, the second optical component including a second marking set with a defined position/orientation relative to the second waveguide, and based on a relative position/orientation of the first and second marking sets, determine whether the first and the second optical components are aligned in a reference plane that is parallel to a surface of the carrier substrate, such that the first and the second waveguide are optically coupled.

Abstract: An assembly may include at least one camera and a controllable mechanical handling device. The system may further include a first component, including a first optical waveguide and a second component, including a second optical waveguide. The first component and the second component are fixedly connected to a substrate and arranged directly next to one another on the substrate and relative to one another in such a way that a coupling side of the first component and a coupling side of the second component are situated opposite each other on a first and second side of a coupling plane. The optical waveguides of the first and second component each end at a first coupling surface or a second coupling surface. The first and second coupling sides are aligned, and optically coupled with one another at a first and second end face.

Abstract: The invention relates to a cyanide-free formulation for the electrodeposition of a layer of gold and silver on electrically conductive substrates, wherein the formulation respectively contains a complexing agent from the group of sulfites and thiosulfates and is characterized in that at least one transition metal from the 5th or 6th sub-group is added in the form of the soluble oxygen acid thereof in order to increase the bath stability.

Abstract: The present invention relates to an Autologous Bone Graft Substitute composition (ABGS) for inducing new bone formation, promoting bone growth and treating of bone defect, a preparation method of the Autologous Bone Graft Substitute composition, and a kit for preparing the Autologous Bone Graft Substitute composition of implant. In a particular aspect, the invention relates to an injectable/extrudable/implantable Autologous Bone Graft Substitute composition for use in treatment of bone defects, inducing new bone formation and promoting bone growth for bone fracture healing, spinal fusions and to repair bone defects in bone reconstructive procedures of orthopedic and oral maxillofacial-dental surgeries.

Abstract: A method for manufacturing a semiconductor component including: providing a flat carrier with an upper side and a lower side, the carrier including a continuous opening that runs between the upper side and the lower side; providing a semiconductor arrangement that includes a semiconductor chip that includes electrically and/or optically active regions on a lower side; arranging the semiconductor arrangement in the opening such that a lower side of the semiconductor arrangement and the lower side of the carrier run in a common plane; casting the semiconductor arrangement with a potting compound, such that the semiconductor arrangement is materially connected to the carrier; and thinning out the semiconductor system by way of grinding from above, such that an upper side of the carrier and an upper side of the semiconductor arrangement run in a common plane.

Abstract: A method for manufacturing a semiconductor component including: providing a flat carrier with an upper side and a lower side, the carrier including a continuous opening that runs between the upper side and the lower side; providing a semiconductor arrangement that includes a semiconductor chip that includes electrically and/or optically active regions on a lower side; arranging the semiconductor arrangement in the opening such that a lower side of the semiconductor arrangement and the lower side of the carrier run in a common plane; casting the semiconductor arrangement with a potting compound, such that the semiconductor arrangement is materially connected to the carrier; and thinning out the semiconductor system by way of grinding from above, such that an upper side of the carrier and an upper side of the semiconductor arrangement run in a common plane.

Abstract: A method for manufacturing metal structures for the electrical connection of components comprises the following steps: depositing an auxiliary layer on a substrate; structuring the auxiliary layer in a manner such that the substrate is exposed at least one environment which is envisaged for the metal structures; depositing a galvanic starting layer on the structured auxiliary layer; depositing a lithography layer on the galvanic starting layer and structuring the lithography layer in a manner such that the galvanic starting layer is exposed at least one location envisaged for the metal structure; galvanically depositing the at least one metal structure at the at least one exposed location; removing the structured auxiliary layer. An electronic component is also described.

Abstract: A method for arranging electronic components that includes a plurality of electronic components pasted onto a first front face of a carrier having a bonding layer. The front face and/or the electronic components being provided with a plurality of bonding points and the diameter of and distance between the bonding points are selected such that each of the plurality of electronic components is attached by at least three bonding points to the carrier having the bonding layer. The method also includes arranging at least one portion of the plurality of the components on a switching element carrier and connecting the components to the carrier. The method also includes detaching a component from the carrier having a bonding layer, using a solvent or a mechanical force that separates the carrier having a bonding layer and the switching element carrier from one another.

Abstract: The invention relates to a paste, preferably for joining components of power electronics modules, the paste comprising a solder powder, a metal powder and a binder, wherein the binder binds solder powder and metal powder before a first heating. According to the invention, the binder is free of flux or is a flux having only low activation. In this way, a joining layer which exhibits only few included voids and good mechanical and electrical stability can be provided between a first and a second component.

Abstract: The application describes a method for manufacturing metal structures for the electrical connection of components. The method comprises the following steps: depositing an auxiliary layer on a substrate; structuring the auxiliary layer in a manner such that the substrate is exposed at least one environment which is envisaged for the metal structures; depositing a galvanic starting layer on the structured auxiliary layer; depositing a lithography layer on the galvanic starting layer and structuring the lithography layer in a manner such that the galvanic starting layer is exposed at least one location envisaged for the metal structure; galvanically depositing the at least one metal structure at the at least one exposed location; removing the structured auxiliary layer. An electronic component is also described.