Abstract: An autologous bone graft substitute composition for inducing new bone formation, promoting bone growth and treating bone defects, a method of preparation thereof, and a method of inducing or promoting bone growth by treatment of a bone with an autologous bone graft substitute composition. The composition includes autologous blood; one or more analogs of an osteogenic bone morphogenetic protein selected from BMP-6, BMP-2, BMP-7, BMP-4, BMP-5, BMP-8, BMP-9, BMP-12, and BMP-13, and combinations thereof; and a compression resistant matrix selected from the group consisting of a bone autograft, bone allograft, hydroxyapatite, tri-calcium phosphate, and combinations thereof. The autologous blood forms a coagulum gel comprising a fibrin-meshwork reinforced with the compression resistant matrix and containing the osteogenic bone morphogenetic protein which is released over a sustained period.

Abstract: The invention relates to a cyanide-free formulation for the electrodeposition of a layer of gold and silver on electrically conductive substrates, wherein the formulation respectively contains a complexing agent from the group of sulfites and thiosulfates and is characterized in that at least one transition metal from the 5th or 6th sub-group is added in the form of the soluble oxygen acid thereof in order to increase the bath stability.

Abstract: An autologous bone graft substitute composition for inducing new bone formation, promoting bone growth and treating bone defects, a method of preparation thereof, and a method of inducing or promoting bone growth by treatment of a bone with an autologous bone graft substitute composition. The composition includes autologous blood; one or more analogs of an osteogenic bone morphogenetic protein selected from BMP-6, BMP-2, BMP-7, BMP-4, BMP-5, BMP-8, BMP-9, BMP-12, and BMP-13, and combinations thereof; and a compression resistant matrix selected from the group consisting of a bone autograft, bone allograft, hydroxyapatite, tri-calcium phosphate, and combinations thereof. The autologous blood forms a coagulum gel comprising a fibrin-meshwork reinforced with the compression resistant matrix and containing the osteogenic bone morphogenetic protein which is released over a sustained period.

Abstract: The present invention relates to an Autologous Bone Graft Substitute composition (ABGS) for inducing new bone formation, promoting bone growth and treating of bone defect, a preparation method of the Autologous Bone Graft Substitute composition, and a kit for preparing the Autologous Bone Graft Substitute composition of implant. In a particular aspect, the invention relates to an injectable/extrudable/implantable Autologous Bone Graft Substitute composition for use in treatment of bone defects, inducing new bone formation and promoting bone growth for bone fracture healing, spinal fusions and to repair bone defects in bone reconstructive procedures of orthopedic and oral maxillofacial-dental surgeries.

Abstract: The invention relates to a cyanide-free formulation for the electrodeposition of a layer of gold and silver on electrically conductive substrates, wherein the formulation respectively contains a complexing agent from the group of sulfites and thiosulfates and is characterized in that at least one transition metal from the 5th or 6th sub-group is added in the form of the soluble oxygen acid thereof in order to increase the bath stability.

Abstract: The present invention relates to an Autologous Bone Graft Substitute composition (ABGS) for inducing new bone formation, promoting bone growth and treating of bone defect, a preparation method of the Autologous Bone Graft Substitute composition, and a kit for preparing the Autologous Bone Graft Substitute composition of implant. In a particular aspect, the invention relates to an injectable/extrudable/implantable Autologous Bone Graft Substitute composition for use in treatment of bone defects, inducing new bone formation and promoting bone growth for bone fracture healing, spinal fusions and to repair bone defects in bone reconstructive procedures of orthopedic and oral maxillofacial-dental surgeries.

Abstract: A method for manufacturing metal structures for the electrical connection of components comprises the following steps: depositing an auxiliary layer on a substrate; structuring the auxiliary layer in a manner such that the substrate is exposed at least one environment which is envisaged for the metal structures; depositing a galvanic starting layer on the structured auxiliary layer; depositing a lithography layer on the galvanic starting layer and structuring the lithography layer in a manner such that the galvanic starting layer is exposed at least one location envisaged for the metal structure; galvanically depositing the at least one metal structure at the at least one exposed location; removing the structured auxiliary layer. An electronic component is also described.

Abstract: The invention relates to a paste, preferably for joining components of power electronics modules, the paste comprising a solder powder, a metal powder and a binder, wherein the binder binds solder powder and metal powder before a first heating. According to the invention, the binder is free of flux or is a flux having only low activation. In this way, a joining layer which exhibits only few included voids and good mechanical and electrical stability can be provided between a first and a second component.

Abstract: The application describes a method for manufacturing metal structures for the electrical connection of components. The method comprises the following steps: depositing an auxiliary layer on a substrate; structuring the auxiliary layer in a manner such that the substrate is exposed at least one environment which is envisaged for the metal structures; depositing a galvanic starting layer on the structured auxiliary layer; depositing a lithography layer on the galvanic starting layer and structuring the lithography layer in a manner such that the galvanic starting layer is exposed at least one location envisaged for the metal structure; galvanically depositing the at least one metal structure at the at least one exposed location; removing the structured auxiliary layer. An electronic component is also described.

Abstract: The invention relates to a method for connecting a precious metal surface to a polymer, wherein a layer made of 20% to 40% gold and 60% to 80% silver is deposited on a substrate and the silver is subsequently selectively removed in order to produce a nanoporous gold layer. A fluid polymer is applied to the gold layer and cured.

Abstract: The invention relates to a paste, preferably for joining components of power electronics modules, the paste comprising a solder powder, a metal powder and a binder, wherein the binder binds solder powder and metal powder before a first heating. According to the invention, the binder is free of flux or is a flux having only low activation. In this way, a joining layer which exhibits only few included voids and good mechanical and electrical stability can be provided between a first and a second component.

Abstract: A method for producing a nanoporous layer comprises applying a plating base with adhesion strengthening onto a substrate, depositing a layer made of gold and silver onto the substrate, the composition being in the range of 20% to 40% gold and 80% to 60% silver, and selectively removing the silver in order to produce a nanoporous gold layer.

Abstract: The invention provides modified TGF-? family proteins having altered biological or biochemical properties, and methods for making them. Specific modified protein constructs include TGF-? family member proteins that have N-terminal truncations, “latent” proteins, fusion proteins and heterodimers.

Abstract: The invention relates to a method for connecting two joining surfaces, particularly in the field of semiconductors, wherein at least one joining surface is produced by depositing a layer comprising 20 to 40% gold and 80 to 60% silver onto a substrate and selectively removing the silver from the deposited layer in order to produce a nanoporous gold layer as a joining surface. The joining surface with the nanoporous gold layer and an additional joining surface are disposed one above the other and pressed together.

Abstract: Whole blood-derived coagulum devices are described for use in treating bone defects.

Abstract: The invention provides modified TGF-? family proteins having altered biological or biochemical properties, and methods for making them. Specific modified protein constructs include TGF-? family member proteins that have N-terminal truncations, “latent” proteins, fusion proteins and heterodimers.

Abstract: A light-emitting semi-conductor diode comprising a light emitting chip at least partially surrounded by a transparent electronics protecting body on which a composite layer foil is disposed, the composite layer foil includes at its side facing away from the electronics protection body a carrier layer, which has a refraction index that is greater than the refraction index of the electronics protection body and, at the opposite side, an active layer of the same material of which the electronics protecting body consists.

Abstract: The invention relates to a method for producing a nanoporous layer, wherein a layer made of gold and silver is deposited onto a substrate, particularly in an electrochemical or galvanic fashion, wherein the composition of said layer lies between 20% and 40% gold and 80% to 60% silver. The silver is subsequently selectively removed in order to obtain a nanoporous gold layer.

Abstract: The invention relates to a method for connecting a precious metal surface to a polymer, wherein a layer made of 20% to 40% gold and 80% to 60% silver is deposited on a substrate and the silver is subsequently selectively removed in order to produce a nanoporous gold layer. A fluid polymer is applied to the gold layer and cured.

Abstract: The invention relates to a method for connecting two joining surfaces, particularly in the field of semiconductors, wherein at least one joining surface is produced by depositing a layer comprising 20 to 40% gold and 80 to 60% silver onto a substrate and selectively removing the silver from the deposited layer in order to produce a nanoporous gold layer as a joining surface. The joining surface with the nanoporous gold layer and an additional joining surface are disposed one above the other and pressed together.