Patents by Inventor Hermann Oppermann

Hermann Oppermann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190088490
    Abstract: A method for manufacturing a semiconductor component including: providing a flat carrier with an upper side and a lower side, the carrier including a continuous opening that runs between the upper side and the lower side; providing a semiconductor arrangement that includes a semiconductor chip that includes electrically and/or optically active regions on a lower side; arranging the semiconductor arrangement in the opening such that a lower side of the semiconductor arrangement and the lower side of the carrier run in a common plane; casting the semiconductor arrangement with a potting compound, such that the semiconductor arrangement is materially connected to the carrier; and thinning out the semiconductor system by way of grinding from above, such that an upper side of the carrier and an upper side of the semiconductor arrangement run in a common plane.
    Type: Application
    Filed: March 1, 2017
    Publication date: March 21, 2019
    Inventors: Hans-Hermann Oppermann, Kai Zoschke, Charles-Alix Manier, Martin Wilke, Tolga Tekin, Robert Gernhardt
  • Patent number: 10074608
    Abstract: A method for manufacturing metal structures for the electrical connection of components comprises the following steps: depositing an auxiliary layer on a substrate; structuring the auxiliary layer in a manner such that the substrate is exposed at least one environment which is envisaged for the metal structures; depositing a galvanic starting layer on the structured auxiliary layer; depositing a lithography layer on the galvanic starting layer and structuring the lithography layer in a manner such that the galvanic starting layer is exposed at least one location envisaged for the metal structure; galvanically depositing the at least one metal structure at the at least one exposed location; removing the structured auxiliary layer. An electronic component is also described.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: September 11, 2018
    Assignees: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., Technische Universität Berlin
    Inventors: Martin Wilke, Kai Zoschke, Markus Wöhrmann, Thomas Fritzsch, Hermann Oppermann, Oswin Ehrmann
  • Patent number: 9917070
    Abstract: A method for arranging electronic components that includes a plurality of electronic components pasted onto a first front face of a carrier having a bonding layer. The front face and/or the electronic components being provided with a plurality of bonding points and the diameter of and distance between the bonding points are selected such that each of the plurality of electronic components is attached by at least three bonding points to the carrier having the bonding layer. The method also includes arranging at least one portion of the plurality of the components on a switching element carrier and connecting the components to the carrier. The method also includes detaching a component from the carrier having a bonding layer, using a solvent or a mechanical force that separates the carrier having a bonding layer and the switching element carrier from one another.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: March 13, 2018
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventors: Hans-Hermann Oppermann, Kai Zoschke, Lena Goullon
  • Patent number: 9815146
    Abstract: The invention relates to a paste, preferably for joining components of power electronics modules, the paste comprising a solder powder, a metal powder and a binder, wherein the binder binds solder powder and metal powder before a first heating. According to the invention, the binder is free of flux or is a flux having only low activation. In this way, a joining layer which exhibits only few included voids and good mechanical and electrical stability can be provided between a first and a second component.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: November 14, 2017
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventors: Hermann Oppermann, Matthias Hutter, Christian Ehrhardt
  • Publication number: 20170194257
    Abstract: The application describes a method for manufacturing metal structures for the electrical connection of components. The method comprises the following steps: depositing an auxiliary layer on a substrate; structuring the auxiliary layer in a manner such that the substrate is exposed at least one environment which is envisaged for the metal structures; depositing a galvanic starting layer on the structured auxiliary layer; depositing a lithography layer on the galvanic starting layer and structuring the lithography layer in a manner such that the galvanic starting layer is exposed at least one location envisaged for the metal structure; galvanically depositing the at least one metal structure at the at least one exposed location; removing the structured auxiliary layer. An electronic component is also described.
    Type: Application
    Filed: January 5, 2017
    Publication date: July 6, 2017
    Inventors: Martin Wilke, Kai Zoschke, Markus Wöhrmann, Thomas Fritzsch, Hermann Oppermann, Oswin Ehrmann
  • Publication number: 20170170141
    Abstract: A method for arranging electronic components, can comprise the following steps: a) at least one, preferably a plurality of electronic components are pasted onto a first front face of a carrier having a bonding layer, i.e.
    Type: Application
    Filed: January 28, 2015
    Publication date: June 15, 2017
    Inventors: Hans-Hermann Oppermann, Kai Zoschke, Lena Goullon
  • Patent number: 9507107
    Abstract: An arrangement of a substrate with at least one optical waveguide and with an optical coupling location for coupling in and/or coupling out an optical a radiation into and/or out of the at least one optical waveguide, and of at least one optoelectronic component which is assembled on the substrate and a method for manufacturing such an arrangement is suggested. The optical coupling location is designed in a manner such that the radiation is coupled in and/or coupled out with a coupling-in and/or coupling-out angle of greater than 2° to the perpendicular to the substrate surface. The optoelectronic component is assembled over the coupling location on the substrate in a manner tilted obliquely to the substrate surface, wherein the tilt angle to this surface corresponds to the coupling-in angle and/or coupling out-angle.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: November 29, 2016
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventor: Hans-Hermann Oppermann
  • Patent number: 9254993
    Abstract: The invention relates to a method for connecting a precious metal surface to a polymer, wherein a layer made of 20% to 40% gold and 60% to 80% silver is deposited on a substrate and the silver is subsequently selectively removed in order to produce a nanoporous gold layer. A fluid polymer is applied to the gold layer and cured.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: February 9, 2016
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
    Inventor: Hermann Oppermann
  • Patent number: 9134483
    Abstract: An optical coupling system having an optical coupler and a light-transmissive external medium, the optical coupler comprising a light guide which extends parallel to a main plane of the optical coupler, a mirror surface which is inclined relative to the main plane by an angle of inclination and an outer surface of the coupler which abuts on the medium, the waveguide.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: September 15, 2015
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventor: Hans-Hermann Oppermann
  • Publication number: 20140079472
    Abstract: The invention relates to a paste, preferably for joining components of power electronics modules, the paste comprising a solder powder, a metal powder and a binder, wherein the binder binds solder powder and metal powder before a first heating. According to the invention, the binder is free of flux or is a flux having only low activation. In this way, a joining layer which exhibits only few included voids and good mechanical and electrical stability can be provided between a first and a second component.
    Type: Application
    Filed: February 28, 2012
    Publication date: March 20, 2014
    Applicant: FRAUNHOFER-GESELLSCHAFT ZUR FOEDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
    Inventors: Hermann Oppermann, Matthias Hutter, Christian Ehrhardt
  • Patent number: 8673773
    Abstract: A method for producing a nanoporous layer comprises applying a plating base with adhesion strengthening onto a substrate, depositing a layer made of gold and silver onto the substrate, the composition being in the range of 20% to 40% gold and 80% to 60% silver, and selectively removing the silver in order to produce a nanoporous gold layer.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: March 18, 2014
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventors: Hermann Oppermann, Lothar Dietrich, Gunter Engelmann, Wolf Jürgen
  • Patent number: 8564969
    Abstract: The invention relates to a component arrangement with a first substrate and at least one second substrate arranged on the first substrate, wherein the first substrate has at least one first contact element and the at least one second substrate has at least one second contact element and the contact elements each has a contact surface connected such as to give an electrical contact and a protective layer connecting the first and second substrate together. During production the protective layer is structured such that a part surface of the first substrate and a part surface of the at least one second substrate are not covered, wherein the part surfaces include the contact surfaces of the at least one first and second contact elements and the contact generated between the contact surfaces is hence not contaminated by the protective layer. The contact surfaces are thus freely accessible without elements of the protective layer lying therebetween.
    Type: Grant
    Filed: February 19, 2010
    Date of Patent: October 22, 2013
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V.
    Inventors: Hans-Hermann Oppermann, Matthias Klein, Michael Toepper, Juergen Wolf
  • Patent number: 8518411
    Abstract: The invention provides modified TGF-? family proteins having altered biological or biochemical properties, and methods for making them. Specific modified protein constructs include TGF-? family member proteins that have N-terminal truncations, “latent” proteins, fusion proteins and heterodimers.
    Type: Grant
    Filed: March 7, 2007
    Date of Patent: August 27, 2013
    Assignee: Stryker Corporation
    Inventors: Hermann Oppermann, Mei-Sheng Tai, John McCartney
  • Patent number: 8521303
    Abstract: An in-vivo implantable coil assembly includes a planar coil having at least one coil layer formed from conductive traces disposed in or on a polymer matrix. A ferrite platelet is bonded to a surface of the polymer matrix. Methods of making and using the in-vivo implantable coil assembly are also disclosed.
    Type: Grant
    Filed: July 17, 2007
    Date of Patent: August 27, 2013
    Assignee: University of Utah Reasearch Foundation
    Inventors: Florian Solzbacher, Reid R. Harrison, Richard A. Normann, Sohee Kim, Michael Töpper, Hans-Hermann Oppermann, Klaus Buschick, Matthias Klein
  • Patent number: 8299613
    Abstract: The invention relates to a method for connecting two joining surfaces, particularly in the field of semiconductors, wherein at least one joining surface is produced by depositing a layer comprising 20 to 40% gold and 80 to 60% silver onto a substrate and selectively removing the silver from the deposited layer in order to produce a nanoporous gold layer as a joining surface. The joining surface with the nanoporous gold layer and an additional joining surface are disposed one above the other and pressed together.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: October 30, 2012
    Assignee: Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung E.V.
    Inventor: Hermann Oppermann
  • Patent number: 8197840
    Abstract: Whole blood-derived coagulum devices are described for use in treating bone defects.
    Type: Grant
    Filed: July 23, 2007
    Date of Patent: June 12, 2012
    Assignee: Genera Istrazivanja d.o.o.
    Inventors: Slobodan Vukicevic, Lovorka Grgurevic, Hermann Oppermann
  • Publication number: 20120122778
    Abstract: The invention provides modified TGF-? family proteins having altered biological or biochemical properties, and methods for making them. Specific modified protein constructs include TGF-? family member proteins that have N-terminal truncations, “latent” proteins, fusion proteins and heterodimers.
    Type: Application
    Filed: March 7, 2007
    Publication date: May 17, 2012
    Inventors: Hermann Oppermann, Mei-Sheng Tai, John McCartney
  • Publication number: 20120039056
    Abstract: The invention relates to a component arrangement with a first substrate and at least one second substrate arranged on the first substrate, wherein the first substrate has at least one first contact element and the at least one second substrate has at least one second contact element and the contact elements each has a contact surface connected such as to give an electrical contact and a protective layer connecting the first and second substrate together. During production the protective layer is structured such that a part surface of the first substrate and a part surface of the at least one second substrate are not covered, wherein the part surfaces include the contact surfaces of the at least one first and second contact elements and the contact generated between the contact surfaces is hence not contaminated by the protective layer. The contact surfaces are thus freely accessible without elements of the protective layer lying therebetween.
    Type: Application
    Filed: February 19, 2010
    Publication date: February 16, 2012
    Inventors: Hans-Hermann Oppermann, Mathias Klein, Michael Toepper, Juergen Wolf
  • Patent number: 7928466
    Abstract: A light-emitting semi-conductor diode comprising a light emitting chip at least partially surrounded by a transparent electronics protecting body on which a composite layer foil is disposed, the composite layer foil includes at its side facing away from the electronics protection body a carrier layer, which has a refraction index that is greater than the refraction index of the electronics protection body and, at the opposite side, an active layer of the same material of which the electronics protecting body consists.
    Type: Grant
    Filed: January 18, 2008
    Date of Patent: April 19, 2011
    Assignee: Merck Patent GmbH
    Inventors: Hermann Oppermann, Julius Muschaweck, Jochen Kunze, Thomas Luce, Eike Krochmann, Walter Tews, Gundula Roth
  • Patent number: 7861914
    Abstract: A method is provided for the production of a bond between a first element having at least one first metal coating and at least one further element having a second metal coating, the at least one further element being freely moveable in a medium and the at least one first metal coating of the first element and the second metal coating of the at least one further element being in a solid state, a liquid phase being formed upon contact of the at least one first metal coating with the second metal coating.
    Type: Grant
    Filed: October 7, 2009
    Date of Patent: January 4, 2011
    Assignee: Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.
    Inventor: Hans-Hermann Oppermann