Patents by Inventor Hermann Oppermann

Hermann Oppermann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10960109
    Abstract: The present invention relates to an Autologous Bone Graft Substitute composition (ABGS) for inducing new bone formation, promoting bone growth and treating of bone defect, a preparation method of the Autologous Bone Graft Substitute composition, and a kit for preparing the Autologous Bone Graft Substitute composition of implant. In a particular aspect, the invention relates to an injectable/extrudable/implantable Autologous Bone Graft Substitute composition for use in treatment of bone defects, inducing new bone formation and promoting bone growth for bone fracture healing, spinal fusions and to repair bone defects in bone reconstructive procedures of orthopedic and oral maxillofacial-dental surgeries.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: March 30, 2021
    Assignee: Perform Biologies, Inc.
    Inventors: Slobodan Vukicevic, Kuber T. Sampath, Lovorka Grgurevic, Charles Cohen, Hermann Oppermann
  • Publication number: 20210018686
    Abstract: An assembly may include at least one camera and a controllable mechanical handling device. The system may further include a first component, including a first optical waveguide and a second component, including a second optical waveguide. The first component and the second component are fixedly connected to a substrate and arranged directly next to one another on the substrate and relative to one another in such a way that a coupling side of the first component and a coupling side of the second component are situated opposite each other on a first and second side of a coupling plane. The optical waveguides of the first and second component each end at a first coupling surface or a second coupling surface. The first and second coupling sides are aligned, and optically coupled with one another at a first and second end face.
    Type: Application
    Filed: July 15, 2020
    Publication date: January 21, 2021
    Inventors: Hans-Hermann Oppermann, Tolga Tekin, Jörg Stockmeyer, Juliane Fröhlich
  • Publication number: 20210018679
    Abstract: Disclosed is a system for and a method of manufacturing of an optical system, including a first optical component, comprising a first waveguide and a carrier substrate, wherein the first optical component is arranged on the carrier substrate. The first optical component comprises a first markup set having a defined position/orientation with respect to the first waveguide, the carrier substrate has a second markup set detectable based on a relative position/orientation of the first and second markup sets when a desired orientation of the first waveguide relative to the carrier substrate is achieved in a reference plane extending parallel to a surface of the carrier substrate.
    Type: Application
    Filed: July 17, 2020
    Publication date: January 21, 2021
    Inventors: Charles-Alix Manier, Hans-Hermann Oppermann, Kai Zoschke, Tolga Tekin
  • Publication number: 20210018687
    Abstract: Disclosed herein is an optical system, comprising a first optical component, featuring a first waveguide and a recess which passes at least partially through the first optical component from a front side to a back side, a second optical component, arranged in the recess of the first optical component, and a second waveguide optically coupled with the first waveguide, and a carrier substrate. The first optical component including a first marking set with a defined position/orientation relative to the first waveguide, the second optical component including a second marking set with a defined position/orientation relative to the second waveguide, and based on a relative position/orientation of the first and second marking sets, determine whether the first and the second optical components are aligned in a reference plane that is parallel to a surface of the carrier substrate, such that the first and the second waveguide are optically coupled.
    Type: Application
    Filed: July 17, 2020
    Publication date: January 21, 2021
    Inventors: Hans-Hermann Oppermann, Tolga Tekin, Charles-Alix Manier
  • Publication number: 20200283922
    Abstract: The invention relates to a cyanide-free formulation for the electrodeposition of a layer of gold and silver on electrically conductive substrates, wherein the formulation respectively contains a complexing agent from the group of sulfites and thiosulfates and is characterized in that at least one transition metal from the 5th or 6th sub-group is added in the form of the soluble oxygen acid thereof in order to increase the bath stability.
    Type: Application
    Filed: March 1, 2020
    Publication date: September 10, 2020
    Applicant: FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E. V.
    Inventors: Lothar DIETRICH, Morten BRINK, Hermann OPPERMANN
  • Publication number: 20200237959
    Abstract: The present invention relates to an Autologous Bone Graft Substitute composition (ABGS) for inducing new bone formation, promoting bone growth and treating of bone defect, a preparation method of the Autologous Bone Graft Substitute composition, and a kit for preparing the Autologous Bone Graft Substitute composition of implant. In a particular aspect, the invention relates to an injectable/extrudable/implantable Autologous Bone Graft Substitute composition for use in treatment of bone defects, inducing new bone formation and promoting bone growth for bone fracture healing, spinal fusions and to repair bone defects in bone reconstructive procedures of orthopedic and oral maxillofacial-dental surgeries.
    Type: Application
    Filed: October 19, 2018
    Publication date: July 30, 2020
    Inventors: Slobodan Vukicevic, Kuber T. Sampath, Lovorka Grgurevic, Charles Cohen, Hermann Oppermann
  • Patent number: 10658187
    Abstract: A method for manufacturing a semiconductor component including: providing a flat carrier with an upper side and a lower side, the carrier including a continuous opening that runs between the upper side and the lower side; providing a semiconductor arrangement that includes a semiconductor chip that includes electrically and/or optically active regions on a lower side; arranging the semiconductor arrangement in the opening such that a lower side of the semiconductor arrangement and the lower side of the carrier run in a common plane; casting the semiconductor arrangement with a potting compound, such that the semiconductor arrangement is materially connected to the carrier; and thinning out the semiconductor system by way of grinding from above, such that an upper side of the carrier and an upper side of the semiconductor arrangement run in a common plane.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: May 19, 2020
    Assignee: FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
    Inventors: Hans-Hermann Oppermann, Kai Zoschke, Charles-Alix Manier, Martin Wilke, Tolga Tekin, Robert Gernhardt
  • Publication number: 20190088490
    Abstract: A method for manufacturing a semiconductor component including: providing a flat carrier with an upper side and a lower side, the carrier including a continuous opening that runs between the upper side and the lower side; providing a semiconductor arrangement that includes a semiconductor chip that includes electrically and/or optically active regions on a lower side; arranging the semiconductor arrangement in the opening such that a lower side of the semiconductor arrangement and the lower side of the carrier run in a common plane; casting the semiconductor arrangement with a potting compound, such that the semiconductor arrangement is materially connected to the carrier; and thinning out the semiconductor system by way of grinding from above, such that an upper side of the carrier and an upper side of the semiconductor arrangement run in a common plane.
    Type: Application
    Filed: March 1, 2017
    Publication date: March 21, 2019
    Inventors: Hans-Hermann Oppermann, Kai Zoschke, Charles-Alix Manier, Martin Wilke, Tolga Tekin, Robert Gernhardt
  • Patent number: 10074608
    Abstract: A method for manufacturing metal structures for the electrical connection of components comprises the following steps: depositing an auxiliary layer on a substrate; structuring the auxiliary layer in a manner such that the substrate is exposed at least one environment which is envisaged for the metal structures; depositing a galvanic starting layer on the structured auxiliary layer; depositing a lithography layer on the galvanic starting layer and structuring the lithography layer in a manner such that the galvanic starting layer is exposed at least one location envisaged for the metal structure; galvanically depositing the at least one metal structure at the at least one exposed location; removing the structured auxiliary layer. An electronic component is also described.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: September 11, 2018
    Assignees: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., Technische Universität Berlin
    Inventors: Martin Wilke, Kai Zoschke, Markus Wöhrmann, Thomas Fritzsch, Hermann Oppermann, Oswin Ehrmann
  • Patent number: 9917070
    Abstract: A method for arranging electronic components that includes a plurality of electronic components pasted onto a first front face of a carrier having a bonding layer. The front face and/or the electronic components being provided with a plurality of bonding points and the diameter of and distance between the bonding points are selected such that each of the plurality of electronic components is attached by at least three bonding points to the carrier having the bonding layer. The method also includes arranging at least one portion of the plurality of the components on a switching element carrier and connecting the components to the carrier. The method also includes detaching a component from the carrier having a bonding layer, using a solvent or a mechanical force that separates the carrier having a bonding layer and the switching element carrier from one another.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: March 13, 2018
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventors: Hans-Hermann Oppermann, Kai Zoschke, Lena Goullon
  • Patent number: 9815146
    Abstract: The invention relates to a paste, preferably for joining components of power electronics modules, the paste comprising a solder powder, a metal powder and a binder, wherein the binder binds solder powder and metal powder before a first heating. According to the invention, the binder is free of flux or is a flux having only low activation. In this way, a joining layer which exhibits only few included voids and good mechanical and electrical stability can be provided between a first and a second component.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: November 14, 2017
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventors: Hermann Oppermann, Matthias Hutter, Christian Ehrhardt
  • Publication number: 20170194257
    Abstract: The application describes a method for manufacturing metal structures for the electrical connection of components. The method comprises the following steps: depositing an auxiliary layer on a substrate; structuring the auxiliary layer in a manner such that the substrate is exposed at least one environment which is envisaged for the metal structures; depositing a galvanic starting layer on the structured auxiliary layer; depositing a lithography layer on the galvanic starting layer and structuring the lithography layer in a manner such that the galvanic starting layer is exposed at least one location envisaged for the metal structure; galvanically depositing the at least one metal structure at the at least one exposed location; removing the structured auxiliary layer. An electronic component is also described.
    Type: Application
    Filed: January 5, 2017
    Publication date: July 6, 2017
    Inventors: Martin Wilke, Kai Zoschke, Markus Wöhrmann, Thomas Fritzsch, Hermann Oppermann, Oswin Ehrmann
  • Publication number: 20170170141
    Abstract: A method for arranging electronic components, can comprise the following steps: a) at least one, preferably a plurality of electronic components are pasted onto a first front face of a carrier having a bonding layer, i.e.
    Type: Application
    Filed: January 28, 2015
    Publication date: June 15, 2017
    Inventors: Hans-Hermann Oppermann, Kai Zoschke, Lena Goullon
  • Patent number: 9507107
    Abstract: An arrangement of a substrate with at least one optical waveguide and with an optical coupling location for coupling in and/or coupling out an optical a radiation into and/or out of the at least one optical waveguide, and of at least one optoelectronic component which is assembled on the substrate and a method for manufacturing such an arrangement is suggested. The optical coupling location is designed in a manner such that the radiation is coupled in and/or coupled out with a coupling-in and/or coupling-out angle of greater than 2° to the perpendicular to the substrate surface. The optoelectronic component is assembled over the coupling location on the substrate in a manner tilted obliquely to the substrate surface, wherein the tilt angle to this surface corresponds to the coupling-in angle and/or coupling out-angle.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: November 29, 2016
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventor: Hans-Hermann Oppermann
  • Patent number: 9254993
    Abstract: The invention relates to a method for connecting a precious metal surface to a polymer, wherein a layer made of 20% to 40% gold and 60% to 80% silver is deposited on a substrate and the silver is subsequently selectively removed in order to produce a nanoporous gold layer. A fluid polymer is applied to the gold layer and cured.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: February 9, 2016
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
    Inventor: Hermann Oppermann
  • Patent number: 9134483
    Abstract: An optical coupling system having an optical coupler and a light-transmissive external medium, the optical coupler comprising a light guide which extends parallel to a main plane of the optical coupler, a mirror surface which is inclined relative to the main plane by an angle of inclination and an outer surface of the coupler which abuts on the medium, the waveguide.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: September 15, 2015
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventor: Hans-Hermann Oppermann
  • Publication number: 20140079472
    Abstract: The invention relates to a paste, preferably for joining components of power electronics modules, the paste comprising a solder powder, a metal powder and a binder, wherein the binder binds solder powder and metal powder before a first heating. According to the invention, the binder is free of flux or is a flux having only low activation. In this way, a joining layer which exhibits only few included voids and good mechanical and electrical stability can be provided between a first and a second component.
    Type: Application
    Filed: February 28, 2012
    Publication date: March 20, 2014
    Applicant: FRAUNHOFER-GESELLSCHAFT ZUR FOEDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
    Inventors: Hermann Oppermann, Matthias Hutter, Christian Ehrhardt
  • Patent number: 8673773
    Abstract: A method for producing a nanoporous layer comprises applying a plating base with adhesion strengthening onto a substrate, depositing a layer made of gold and silver onto the substrate, the composition being in the range of 20% to 40% gold and 80% to 60% silver, and selectively removing the silver in order to produce a nanoporous gold layer.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: March 18, 2014
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventors: Hermann Oppermann, Lothar Dietrich, Gunter Engelmann, Wolf Jürgen
  • Patent number: 8564969
    Abstract: The invention relates to a component arrangement with a first substrate and at least one second substrate arranged on the first substrate, wherein the first substrate has at least one first contact element and the at least one second substrate has at least one second contact element and the contact elements each has a contact surface connected such as to give an electrical contact and a protective layer connecting the first and second substrate together. During production the protective layer is structured such that a part surface of the first substrate and a part surface of the at least one second substrate are not covered, wherein the part surfaces include the contact surfaces of the at least one first and second contact elements and the contact generated between the contact surfaces is hence not contaminated by the protective layer. The contact surfaces are thus freely accessible without elements of the protective layer lying therebetween.
    Type: Grant
    Filed: February 19, 2010
    Date of Patent: October 22, 2013
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V.
    Inventors: Hans-Hermann Oppermann, Matthias Klein, Michael Toepper, Juergen Wolf
  • Patent number: 8518411
    Abstract: The invention provides modified TGF-? family proteins having altered biological or biochemical properties, and methods for making them. Specific modified protein constructs include TGF-? family member proteins that have N-terminal truncations, “latent” proteins, fusion proteins and heterodimers.
    Type: Grant
    Filed: March 7, 2007
    Date of Patent: August 27, 2013
    Assignee: Stryker Corporation
    Inventors: Hermann Oppermann, Mei-Sheng Tai, John McCartney