Abstract: A method for arranging electronic components, can comprise the following steps: a) at least one, preferably a plurality of electronic components are pasted onto a first front face of a carrier having a bonding layer, i.e.

Abstract: An arrangement of a substrate with at least one optical waveguide and with an optical coupling location for coupling in and/or coupling out an optical a radiation into and/or out of the at least one optical waveguide, and of at least one optoelectronic component which is assembled on the substrate and a method for manufacturing such an arrangement is suggested. The optical coupling location is designed in a manner such that the radiation is coupled in and/or coupled out with a coupling-in and/or coupling-out angle of greater than 2° to the perpendicular to the substrate surface. The optoelectronic component is assembled over the coupling location on the substrate in a manner tilted obliquely to the substrate surface, wherein the tilt angle to this surface corresponds to the coupling-in angle and/or coupling out-angle.

Abstract: The invention relates to a method for connecting a precious metal surface to a polymer, wherein a layer made of 20% to 40% gold and 60% to 80% silver is deposited on a substrate and the silver is subsequently selectively removed in order to produce a nanoporous gold layer. A fluid polymer is applied to the gold layer and cured.

Abstract: An optical coupling system having an optical coupler and a light-transmissive external medium, the optical coupler comprising a light guide which extends parallel to a main plane of the optical coupler, a mirror surface which is inclined relative to the main plane by an angle of inclination and an outer surface of the coupler which abuts on the medium, the waveguide.

Abstract: The invention relates to a paste, preferably for joining components of power electronics modules, the paste comprising a solder powder, a metal powder and a binder, wherein the binder binds solder powder and metal powder before a first heating. According to the invention, the binder is free of flux or is a flux having only low activation. In this way, a joining layer which exhibits only few included voids and good mechanical and electrical stability can be provided between a first and a second component.

Abstract: A method for producing a nanoporous layer comprises applying a plating base with adhesion strengthening onto a substrate, depositing a layer made of gold and silver onto the substrate, the composition being in the range of 20% to 40% gold and 80% to 60% silver, and selectively removing the silver in order to produce a nanoporous gold layer.

Abstract: The invention relates to a component arrangement with a first substrate and at least one second substrate arranged on the first substrate, wherein the first substrate has at least one first contact element and the at least one second substrate has at least one second contact element and the contact elements each has a contact surface connected such as to give an electrical contact and a protective layer connecting the first and second substrate together. During production the protective layer is structured such that a part surface of the first substrate and a part surface of the at least one second substrate are not covered, wherein the part surfaces include the contact surfaces of the at least one first and second contact elements and the contact generated between the contact surfaces is hence not contaminated by the protective layer. The contact surfaces are thus freely accessible without elements of the protective layer lying therebetween.

Abstract: The invention provides modified TGF-? family proteins having altered biological or biochemical properties, and methods for making them. Specific modified protein constructs include TGF-? family member proteins that have N-terminal truncations, “latent” proteins, fusion proteins and heterodimers.

Abstract: An in-vivo implantable coil assembly includes a planar coil having at least one coil layer formed from conductive traces disposed in or on a polymer matrix. A ferrite platelet is bonded to a surface of the polymer matrix. Methods of making and using the in-vivo implantable coil assembly are also disclosed.

Abstract: The invention relates to a method for connecting two joining surfaces, particularly in the field of semiconductors, wherein at least one joining surface is produced by depositing a layer comprising 20 to 40% gold and 80 to 60% silver onto a substrate and selectively removing the silver from the deposited layer in order to produce a nanoporous gold layer as a joining surface. The joining surface with the nanoporous gold layer and an additional joining surface are disposed one above the other and pressed together.

Abstract: Whole blood-derived coagulum devices are described for use in treating bone defects.

Abstract: The invention provides modified TGF-? family proteins having altered biological or biochemical properties, and methods for making them. Specific modified protein constructs include TGF-? family member proteins that have N-terminal truncations, “latent” proteins, fusion proteins and heterodimers.

Abstract: The invention relates to a component arrangement with a first substrate and at least one second substrate arranged on the first substrate, wherein the first substrate has at least one first contact element and the at least one second substrate has at least one second contact element and the contact elements each has a contact surface connected such as to give an electrical contact and a protective layer connecting the first and second substrate together. During production the protective layer is structured such that a part surface of the first substrate and a part surface of the at least one second substrate are not covered, wherein the part surfaces include the contact surfaces of the at least one first and second contact elements and the contact generated between the contact surfaces is hence not contaminated by the protective layer. The contact surfaces are thus freely accessible without elements of the protective layer lying therebetween.

Abstract: A light-emitting semi-conductor diode comprising a light emitting chip at least partially surrounded by a transparent electronics protecting body on which a composite layer foil is disposed, the composite layer foil includes at its side facing away from the electronics protection body a carrier layer, which has a refraction index that is greater than the refraction index of the electronics protection body and, at the opposite side, an active layer of the same material of which the electronics protecting body consists.

Abstract: A method is provided for the production of a bond between a first element having at least one first metal coating and at least one further element having a second metal coating, the at least one further element being freely moveable in a medium and the at least one first metal coating of the first element and the second metal coating of the at least one further element being in a solid state, a liquid phase being formed upon contact of the at least one first metal coating with the second metal coating.

Abstract: The invention relates to a method for producing a nanoporous layer, wherein a layer made of gold and silver is deposited onto a substrate, particularly in an electrochemical or galvanic fashion, wherein the composition of said layer lies between 20% and 40% gold and 80% to 60% silver. The silver is subsequently selectively removed in order to obtain a nanoporous gold layer.

Abstract: The invention relates to a method for connecting a precious metal surface to a polymer, wherein a layer made of 20% to 40% gold and 80% to 60% silver is deposited on a substrate and the silver is subsequently selectively removed in order to produce a nanoporous gold layer. A fluid polymer is applied to the gold layer and cured.

Abstract: The invention relates to a method for connecting two joining surfaces, particularly in the field of semiconductors, wherein at least one joining surface is produced by depositing a layer comprising 20 to 40% gold and 80 to 60% silver onto a substrate and selectively removing the silver from the deposited layer in order to produce a nanoporous gold layer as a joining surface. The joining surface with the nanoporous gold layer and an additional joining surface are disposed one above the other and pressed together.

Abstract: A method is provided for the production of a bond between a first element having at least one first metal coating and at least one further element having a second metal coating, the at least one further element being freely moveable in a medium and the at least one first metal coating of the first element and the second metal coating of the at least one further element being in a solid state, a liquid phase being formed upon contact of the at least one first metal coating with the second metal coating.

Abstract: Whole blood-derived coagulum devices are described for use in treating bone defects.