Abstract: A lamp post comprising a support pole; a light module supported by the support pole, said light module comprising a light source; an antenna module supported by the support pole; said antenna module comprising an antenna configured for receiving and emitting cellular data; and a base station module; wherein the base station module comprises a housing and base station circuitry mounted in said housing; wherein the base station circuitry is coupled to the antenna; wherein the base station module is attached to an external surface of the support pole and carried by the support pole.

Abstract: A lamp post comprising a support pole; a light module supported by the support pole, said light module comprising a light source; an antenna module supported by the support pole; said antenna module comprising an antenna configured for receiving and emitting cellular data; and a base station module; wherein the base station module comprises a housing and base station circuitry mounted in said housing; wherein the base station circuitry is coupled to the antenna; wherein the base station module is attached to an external surface of the support pole and carried by the support pole.

Abstract: The invention relates to a lamp post comprising: a support pole; a light unit supported by the support pole; said light unit comprising a light source; a functional module comprising a housing and functional circuitry mounted therein, said housing comprising a bottom wall intended to be floating, a top wall and a peripheral wall between the bottom and top wall, said housing covering or surrounding a portion of the support pole; wherein the bottom wall is provided with one or more lower air flow holes; and wherein at least one of the peripheral wall and said portion of the support pole, is provided with one or more upper air flow holes.

Abstract: A light-emitting diode module includes a printed circuit board with a light-emitting diode array mounted on first surface. A secondary lens array is positioned over the light-emitting diode array and includes a secondary lens element for each light-emitting diode element in the light-emitting diode array. A lens holder is mounted to the printed circuit board and configured to retain each secondary lens element of the secondary lens array in alignment in an x-y plane with respect to each light-emitting diode element of the light-emitting diode array. The printed circuit board further includes a first locating feature corresponding to a second locating feature of either the secondary lens array or the lens holder. The locating features align the secondary lens array with respect to the light-emitting diode array on the printed circuit board.

Abstract: A light-emitting diode module includes a printed circuit board with a light-emitting diode array mounted on first surface. A secondary lens array is positioned over the light-emitting diode array and includes a secondary lens element for each light-emitting diode element in the light-emitting diode array. A lens holder is mounted to the printed circuit board and configured to retain each secondary lens element of the secondary lens array in alignment in an x-y plane with respect to each light-emitting diode element of the light-emitting diode array. The printed circuit board further includes a first locating feature corresponding to a second locating feature of either the secondary lens array or the lens holder. The locating features align the secondary lens array with respect to the light-emitting diode array on the printed circuit board.

Abstract: An LED module is formed using a method of mounting secondary lens arrays over light-emitting diode arrays on a printed circuit board. In the LED module, a lens array assembly is mounted to a printed circuit board. The lens array assembly comprises a silicone free form lens array which is mounted in a lens holder by aligning markings on the lens holder with markings on the free form lens array. The lens array assembly is correctly positioned, in an x-y plane, on the printed circuit board by the engagement of positioning pins formed on a surface of the free form lens array with corresponding recesses formed in the printed circuit board and is retained in the correct position by clips integrally formed with the lens holder. The positioning pins are shaped to allow for thermal changes due to the operating temperature range of the LED module.

Abstract: An LED module is formed using a method of mounting secondary lens arrays over light-emitting diode arrays on a printed circuit board. In the LED module, a lens array assembly is mounted to a printed circuit board. The lens array assembly comprises a silicone free form lens array which is mounted in a lens holder by aligning markings on the lens holder with markings on the free form lens array. The lens array assembly is correctly positioned, in an x-y plane, on the printed circuit board by the engagement of positioning pins formed on a surface of the free form lens array with corresponding recesses formed in the printed circuit board and is retained in the correct position by clips integrally formed with the lens holder. The positioning pins are shaped to allow for thermal changes due to the operating temperature range of the LED module.