Patents by Inventor Heung Cho Ko
Heung Cho Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11424163Abstract: Provided are a three-dimensional electronic device manufactured through a polymer frame solvent-plasticizing process and a method for manufacturing the three-dimensional electronic device including a polymer frame configured to have a planar figure-like shape so as to have a polygonal bottom and adjacent surfaces which are formed to be extended from respective edges of the bottom; and a flexible electronic device which is transferred to the polymer frame. The polymer frame is exposed to organic solvent vapor and has a change in Young's modulus.Type: GrantFiled: March 14, 2019Date of Patent: August 23, 2022Assignee: GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Heung Cho Ko, Gi Gwan Kim, Hun Soo Jang, Seong Hyeon Kang, Yeong Min Kim, Seong Gwang Yoo, Jung Il Yoo
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Publication number: 20220199606Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: ApplicationFiled: March 9, 2022Publication date: June 23, 2022Inventors: John A. ROGERS, Ralph NUZZO, Matthew MEITL, Etienne MENARD, Alfred BACA, Michael MOTALA, Jong-Hyun AHN, Sang-Il PARK, Chang-Jae YU, Heung Cho KO, Mark STOYKOVICH, Jongseung YOON
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Patent number: 11309305Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: GrantFiled: October 29, 2019Date of Patent: April 19, 2022Assignees: The Board of Trustees of the University of Illinois, X-Celeprint LimitedInventors: John A. Rogers, Ralph Nuzzo, Matthew Meitl, Etienne Menard, Alfred Baca, Michael Motala, Jong-Hyun Ahn, Sang-Il Park, Chang-Jae Yu, Heung Cho Ko, Mark Stoykovich, Jongseung Yoon
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Publication number: 20210066131Abstract: Provided are a three-dimensional electronic device manufactured through a polymer frame solvent-plasticizing process and a method for manufacturing the three-dimensional electronic device including a polymer frame configured to have a planar figure-like shape so as to have a polygonal bottom and adjacent surfaces which are formed to be extended from respective edges of the bottom; and a flexible electronic device which is transferred to the polymer frame. The polymer frame is exposed to organic solvent vapor and has a change in Young's modulus.Type: ApplicationFiled: March 14, 2019Publication date: March 4, 2021Inventors: Heung Cho KO, Gi Gwan KIM, Hun Soo JANG, Seong Hyeon KANG, Yeong Min KIM, Seong Gwang YOO, Jung Il YOO
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Publication number: 20200161291Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: ApplicationFiled: October 29, 2019Publication date: May 21, 2020Inventors: John A. ROGERS, Ralph NUZZO, Matthew MEITL, Etienne MENARD, Alfred BACA, Michael MOTALA, Jong-Hyun AHN, Sang-Il PARK, Chang-Jae YU, Heung Cho KO, Mark STOYKOVICH, Jongseung YOON
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Patent number: 10591272Abstract: A deformation sensing sensor as disclosed includes a conductive material inside the body thereof such that, by sensing a change in resistance or capacitance resulting from a deformation, a degree of deformation of the measurement object can be detected. The body includes an elastic layer, which has a corrugation formed on one surface thereof, and a conductive layer, which is formed on the other surface of the elastic layer using a conductive material. When the body is deformed in the lateral direction of the surface on which the corrugation is formed, the change in resistance of the conductive layer before and after the deformation, or the change in capacitance thereof is measured, thereby detecting the degree of deformation of the measurement object.Type: GrantFiled: September 1, 2016Date of Patent: March 17, 2020Assignee: GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Heung Cho Ko, Yun Jeong Heo, Young Kyu Hwang
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Patent number: 10504882Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: GrantFiled: January 10, 2017Date of Patent: December 10, 2019Assignees: The Board of Trustees of the University of Illinois, X-Celeprint LimitedInventors: John Rogers, Ralph Nuzzo, Matthew Meitl, Etienne Menard, Alfred Baca, Michael Motala, Jong-Hyun Ahn, Sang-Il Park, Chang-Jae Yu, Heung Cho Ko, Mark Stoykovich, Jongseung Yoon
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Patent number: 10424572Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: GrantFiled: January 10, 2017Date of Patent: September 24, 2019Assignees: The Board of Trustees of the University of Illinois, X-Celeprint LimitedInventors: John Rogers, Ralph Nuzzo, Matthew Meitl, Etienne Menard, Alfred Baca, Michael Motala, Jong-Hyun Ahn, Sang-Il Park, Chang-Jae Yu, Heung Cho Ko, Mark Stoykovich, Jongseung Yoon
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Patent number: 10361180Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: GrantFiled: January 10, 2017Date of Patent: July 23, 2019Assignees: The Board of Trustees of the University of Illinois, X-Celeprint LimitedInventors: John Rogers, Ralph Nuzzo, Matthew Meitl, Etienne Menard, Alfred Baca, Michael Motala, Jong-Hyun Ahn, Sang-Il Park, Chang-Jae Yu, Heung Cho Ko, Mark Stoykovich, Jongseung Yoon
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Patent number: 10355113Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.Type: GrantFiled: March 29, 2016Date of Patent: July 16, 2019Assignee: The Board of Trustees of the University of IllinoisInventors: John A. Rogers, Matthew Meitl, Yugang Sun, Heung Cho Ko, Andrew Carlson, Won Mook Choi, Mark Stoykovich, Hanqing Jiang, Yonggang Huang, Ralph G. Nuzzo, Zhengtao Zhu, Etienne Menard, Dahl-Young Khang
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Patent number: 10292261Abstract: Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.Type: GrantFiled: May 7, 2015Date of Patent: May 14, 2019Assignees: The Board of Trustees of the University of Illinois, Northwestern UniversityInventors: John A Rogers, Yonggang Huang, Heung Cho Ko, Mark Stoykovich, Won Mook Choi, Jizhou Song, Jong Hyun Ahn, Dae Hyeong Kim
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Publication number: 20180292196Abstract: A deformation sensing sensor as disclosed includes a conductive material inside the body thereof such that, by sensing a change in resistance or capacitance resulting from a deformation, a degree of deformation of the measurement object can be detected. The body includes an elastic layer, which has a corrugation formed on one surface thereof, and a conductive layer, which is formed on the other surface of the elastic layer using a conductive material. When the body is deformed in the lateral direction of the surface on which the corrugation is formed, the change in resistance of the conductive layer before and after the deformation, or the change in capacitance thereof is measured, thereby detecting the degree of deformation of the measurement object.Type: ApplicationFiled: September 1, 2016Publication date: October 11, 2018Applicant: Gwangju Institute of Science and TechnologyInventors: Heung Cho KO, Yun Jeong HEO, Young Kyu Hwang
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Patent number: 10064269Abstract: Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.Type: GrantFiled: October 22, 2014Date of Patent: August 28, 2018Assignee: The Board of Trustees of the University of IllinoisInventors: John A Rogers, Yonggang Huang, Heung Cho Ko, Mark Stoykovich, Won Mook Choi, Jizhou Song, Jong Hyun Ahn, Dae Hyeong Kim
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Patent number: 10014473Abstract: The present disclosure relates a method for transfer printing of an electronic device comprising: forming a sacrificial layer on a handling substrate; forming a protective layer on the sacrificial layer; forming a polymer substrate on the protective layer; forming a pattern on the polymer substrate, and forming a ciliary adhesive rod on the sides of the polymer substrate; forming a supportive layer on the polymer substrate on which the adhesive rod is formed; and removing the sacrificial layer and the protective layer, and transfer printing the electronic device onto an object to-be-printed, while dissolving the to supportive layer.Type: GrantFiled: October 7, 2016Date of Patent: July 3, 2018Assignee: GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Heung Cho Ko, Jongwon Yoon, Yunkyung Jeong, Seonggwang Yoo, Heeje Kim, Youngkyu Hwang
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Patent number: 9827799Abstract: Disclosed herein is a transfer printing technology. A transfer printing substrate includes a plurality of pillar structures and a sacrificial layer applied thereon. In situ alignment of a transfer layer is performed by the pillar structures and a structural confinement by a concave structure formed on a bottom surface of the transfer layer corresponding to the pillar structures, or a chemical bond of the pillar structure and the transfer layer. In the in situ alignment by the structural confinement, the remaining sacrificial layer after being removed may serve as an adhesive component. The transfer process is performed by a separation of the bond by the sacrificial layer, a cutting of the pillar structures in the chemic bonding state of the pillar structures and the transfer layer, or a separation of the bond between the pillar structures and the handling substrate.Type: GrantFiled: December 30, 2013Date of Patent: November 28, 2017Assignee: Gwangju Institute of Science and TechnologyInventors: Heung Cho Ko, Su Ok Yun, Jeong Pil Park, Suk Ho Kim, Young Kyu Hwang, Yujun Hyun, Hun Soo Jang, Yun Kyung Jeong
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Publication number: 20170179356Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: ApplicationFiled: January 10, 2017Publication date: June 22, 2017Inventors: John ROGERS, Ralph NUZZO, Matthew MEITL, Etienne MENARD, Alfred BACA, Michael MOTALA, Jong-Hyun AHN, Sang-Il PARK, Chang-Jae YU, Heung Cho KO, Mark STOYKOVICH, Jongseung YOON
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Publication number: 20170179085Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: ApplicationFiled: January 10, 2017Publication date: June 22, 2017Inventors: John ROGERS, Ralph NUZZO, Matthew MEITL, Etienne MENARD, Alfred BACA, Michael MOTALA, Jong-Hyun AHN, Sang-Il PARK, Chang-Jae YU, Heung Cho KO, Mark STOYKOVICH, Jongseung YOON
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Publication number: 20170179100Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: ApplicationFiled: January 10, 2017Publication date: June 22, 2017Inventors: John ROGERS, Ralph NUZZO, Matthew MEITL, Etienne MENARD, Alfred BACA, Michael MOTALA, Jong-Hyun AHN, Sang-Il PARK, Chang-Jae YU, Heung Cho KO, Mark STOYKOVICH, Jongseung YOON
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Publication number: 20170162791Abstract: The present disclosure relates a method for transfer printing of an electronic device comprising: forming a sacrificial layer on a handling substrate; forming a protective layer on the sacrificial layer; forming a polymer substrate on the protective layer; forming a pattern on the polymer substrate, and forming a ciliary adhesive rod on the sides of the polymer substrate; forming a supportive layer on the polymer substrate on which the adhesive rod is formed; and removing the sacrificial layer and the protective layer, and transfer printing the electronic device onto an object to-be-printed, while dissolving the to supportive layer.Type: ApplicationFiled: October 7, 2016Publication date: June 8, 2017Inventors: Heung Cho KO, Jongwon YOON, Yunkyung JEONG, Seonggwang YOO, Heeje KIM, Youngkyu HWANG
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Patent number: 9656502Abstract: The present disclosure provides a method for fabricating a substrate for transfer printing using a concave-convex structure and a substrate for transfer printing fabricated thereby. The method includes preparing a handling substrate having a concave-convex structure formed thereon; forming a sacrificial layer along the concave-convex structure on the handling substrate; coating a polymer on the handling substrate having the sacrificial layer formed thereon to form a polymer substrate having bumps filling a concave portion of the concave-convex structure; and removing the sacrificial layer from the handling substrate. The substrate for transfer printing includes a handling substrate having a concave-convex structure formed thereon; and a polymer substrate placed on the concave-convex structure and having bumps filling a concave portion of the concave-convex structure of the handling substrate.Type: GrantFiled: March 10, 2015Date of Patent: May 23, 2017Assignee: GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Heung Cho Ko, Seok Ho Kim, Jongwon Yoon, Young Kyu Hwang, Su Ok Yun, Hun Soo Jang, Seong-Ju Park, Hyun-A Cho, Byeong-Il Noh, Jaeyi Chun