Patents by Inventor Heung Cho Ko

Heung Cho Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10424572
    Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: September 24, 2019
    Assignees: The Board of Trustees of the University of Illinois, X-Celeprint Limited
    Inventors: John Rogers, Ralph Nuzzo, Matthew Meitl, Etienne Menard, Alfred Baca, Michael Motala, Jong-Hyun Ahn, Sang-Il Park, Chang-Jae Yu, Heung Cho Ko, Mark Stoykovich, Jongseung Yoon
  • Patent number: 10361180
    Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: July 23, 2019
    Assignees: The Board of Trustees of the University of Illinois, X-Celeprint Limited
    Inventors: John Rogers, Ralph Nuzzo, Matthew Meitl, Etienne Menard, Alfred Baca, Michael Motala, Jong-Hyun Ahn, Sang-Il Park, Chang-Jae Yu, Heung Cho Ko, Mark Stoykovich, Jongseung Yoon
  • Patent number: 10355113
    Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: July 16, 2019
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: John A. Rogers, Matthew Meitl, Yugang Sun, Heung Cho Ko, Andrew Carlson, Won Mook Choi, Mark Stoykovich, Hanqing Jiang, Yonggang Huang, Ralph G. Nuzzo, Zhengtao Zhu, Etienne Menard, Dahl-Young Khang
  • Patent number: 10292261
    Abstract: Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.
    Type: Grant
    Filed: May 7, 2015
    Date of Patent: May 14, 2019
    Assignees: The Board of Trustees of the University of Illinois, Northwestern University
    Inventors: John A Rogers, Yonggang Huang, Heung Cho Ko, Mark Stoykovich, Won Mook Choi, Jizhou Song, Jong Hyun Ahn, Dae Hyeong Kim
  • Publication number: 20180292196
    Abstract: A deformation sensing sensor as disclosed includes a conductive material inside the body thereof such that, by sensing a change in resistance or capacitance resulting from a deformation, a degree of deformation of the measurement object can be detected. The body includes an elastic layer, which has a corrugation formed on one surface thereof, and a conductive layer, which is formed on the other surface of the elastic layer using a conductive material. When the body is deformed in the lateral direction of the surface on which the corrugation is formed, the change in resistance of the conductive layer before and after the deformation, or the change in capacitance thereof is measured, thereby detecting the degree of deformation of the measurement object.
    Type: Application
    Filed: September 1, 2016
    Publication date: October 11, 2018
    Applicant: Gwangju Institute of Science and Technology
    Inventors: Heung Cho KO, Yun Jeong HEO, Young Kyu Hwang
  • Patent number: 10064269
    Abstract: Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.
    Type: Grant
    Filed: October 22, 2014
    Date of Patent: August 28, 2018
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: John A Rogers, Yonggang Huang, Heung Cho Ko, Mark Stoykovich, Won Mook Choi, Jizhou Song, Jong Hyun Ahn, Dae Hyeong Kim
  • Patent number: 10014473
    Abstract: The present disclosure relates a method for transfer printing of an electronic device comprising: forming a sacrificial layer on a handling substrate; forming a protective layer on the sacrificial layer; forming a polymer substrate on the protective layer; forming a pattern on the polymer substrate, and forming a ciliary adhesive rod on the sides of the polymer substrate; forming a supportive layer on the polymer substrate on which the adhesive rod is formed; and removing the sacrificial layer and the protective layer, and transfer printing the electronic device onto an object to-be-printed, while dissolving the to supportive layer.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: July 3, 2018
    Assignee: GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Heung Cho Ko, Jongwon Yoon, Yunkyung Jeong, Seonggwang Yoo, Heeje Kim, Youngkyu Hwang
  • Patent number: 9827799
    Abstract: Disclosed herein is a transfer printing technology. A transfer printing substrate includes a plurality of pillar structures and a sacrificial layer applied thereon. In situ alignment of a transfer layer is performed by the pillar structures and a structural confinement by a concave structure formed on a bottom surface of the transfer layer corresponding to the pillar structures, or a chemical bond of the pillar structure and the transfer layer. In the in situ alignment by the structural confinement, the remaining sacrificial layer after being removed may serve as an adhesive component. The transfer process is performed by a separation of the bond by the sacrificial layer, a cutting of the pillar structures in the chemic bonding state of the pillar structures and the transfer layer, or a separation of the bond between the pillar structures and the handling substrate.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: November 28, 2017
    Assignee: Gwangju Institute of Science and Technology
    Inventors: Heung Cho Ko, Su Ok Yun, Jeong Pil Park, Suk Ho Kim, Young Kyu Hwang, Yujun Hyun, Hun Soo Jang, Yun Kyung Jeong
  • Publication number: 20170179085
    Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.
    Type: Application
    Filed: January 10, 2017
    Publication date: June 22, 2017
    Inventors: John ROGERS, Ralph NUZZO, Matthew MEITL, Etienne MENARD, Alfred BACA, Michael MOTALA, Jong-Hyun AHN, Sang-Il PARK, Chang-Jae YU, Heung Cho KO, Mark STOYKOVICH, Jongseung YOON
  • Publication number: 20170179100
    Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.
    Type: Application
    Filed: January 10, 2017
    Publication date: June 22, 2017
    Inventors: John ROGERS, Ralph NUZZO, Matthew MEITL, Etienne MENARD, Alfred BACA, Michael MOTALA, Jong-Hyun AHN, Sang-Il PARK, Chang-Jae YU, Heung Cho KO, Mark STOYKOVICH, Jongseung YOON
  • Publication number: 20170179356
    Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.
    Type: Application
    Filed: January 10, 2017
    Publication date: June 22, 2017
    Inventors: John ROGERS, Ralph NUZZO, Matthew MEITL, Etienne MENARD, Alfred BACA, Michael MOTALA, Jong-Hyun AHN, Sang-Il PARK, Chang-Jae YU, Heung Cho KO, Mark STOYKOVICH, Jongseung YOON
  • Publication number: 20170162791
    Abstract: The present disclosure relates a method for transfer printing of an electronic device comprising: forming a sacrificial layer on a handling substrate; forming a protective layer on the sacrificial layer; forming a polymer substrate on the protective layer; forming a pattern on the polymer substrate, and forming a ciliary adhesive rod on the sides of the polymer substrate; forming a supportive layer on the polymer substrate on which the adhesive rod is formed; and removing the sacrificial layer and the protective layer, and transfer printing the electronic device onto an object to-be-printed, while dissolving the to supportive layer.
    Type: Application
    Filed: October 7, 2016
    Publication date: June 8, 2017
    Inventors: Heung Cho KO, Jongwon YOON, Yunkyung JEONG, Seonggwang YOO, Heeje KIM, Youngkyu HWANG
  • Patent number: 9656502
    Abstract: The present disclosure provides a method for fabricating a substrate for transfer printing using a concave-convex structure and a substrate for transfer printing fabricated thereby. The method includes preparing a handling substrate having a concave-convex structure formed thereon; forming a sacrificial layer along the concave-convex structure on the handling substrate; coating a polymer on the handling substrate having the sacrificial layer formed thereon to form a polymer substrate having bumps filling a concave portion of the concave-convex structure; and removing the sacrificial layer from the handling substrate. The substrate for transfer printing includes a handling substrate having a concave-convex structure formed thereon; and a polymer substrate placed on the concave-convex structure and having bumps filling a concave portion of the concave-convex structure of the handling substrate.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: May 23, 2017
    Assignee: GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Heung Cho Ko, Seok Ho Kim, Jongwon Yoon, Young Kyu Hwang, Su Ok Yun, Hun Soo Jang, Seong-Ju Park, Hyun-A Cho, Byeong-Il Noh, Jaeyi Chun
  • Patent number: 9601671
    Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: March 21, 2017
    Assignees: The Board of Trustees of the University of Illinois, Semprius, Inc.
    Inventors: John Rogers, Ralph Nuzzo, Matthew Meitl, Etienne Menard, Alfred Baca, Michael Motala, Jong-Hyun Ahn, Sang-Il Park, Chang-Jae Yu, Heung Cho Ko, Mark Stoykovich, Jongseung Yoon
  • Publication number: 20160381789
    Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.
    Type: Application
    Filed: March 29, 2016
    Publication date: December 29, 2016
    Inventors: John A. ROGERS, Matthew MEITL, Yugang SUN, Heung Cho KO, Andrew CARLSON, Won Mook CHOI, Mark STOYKOVICH, Hanqing JIANG, Yonggang HUANG, Ralph G. NUZZO, Zhengtao ZHU, Etienne MENARD, Dahl-Young KHANG
  • Patent number: 9368346
    Abstract: A method of preparing zinc oxide nanostructures using a liquid masking layer is disclosed. The method includes preparing a substrate having a zinc oxide seed layer formed thereon; loading the substrate in a reactor in which a lower liquid masking layer, a precursor liquid layer for hydrothermal growth, and an upper liquid masking layer are disposed in order; and forming zinc oxide nanostructures in a pattern on the substrate through hydrothermal growth by heating the precursor liquid layer for hydrothermal growth.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: June 14, 2016
    Assignee: GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Heung-Cho Ko, Hun-Soo Jang, Gun-Young Jung, Bokyeong Son, Hui Song
  • Patent number: 9349900
    Abstract: Provided are methods for making a device or device component by providing a multi layer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
    Type: Grant
    Filed: April 7, 2014
    Date of Patent: May 24, 2016
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: John A. Rogers, Ralph G. Nuzzo, Matthew Meitl, Heung Cho Ko, Jongseung Yoon, Etienne Menard, Alfred J. Baca
  • Patent number: 9324733
    Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: April 26, 2016
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: John A. Rogers, Matthew Meitl, Yugang Sun, Heung Cho Ko, Andrew Carlson, Won Mook Choi, Mark Stoykovich, Hanqing Jiang, Yonggang Huang, Ralph G. Nuzzo, Zhengtao Zhu, Etienne Menard, Dahl-Young Khang
  • Publication number: 20160104616
    Abstract: A method of preparing zinc oxide nanostructures using a liquid masking layer is disclosed. The method includes preparing a substrate having a zinc oxide seed layer formed thereon; loading the substrate in a reactor in which a lower liquid masking layer, a precursor liquid layer for hydrothermal growth, and an upper liquid masking layer are disposed in order; and forming zinc oxide nanostructures in a pattern on the substrate through hydrothermal growth by heating the precursor liquid layer for hydrothermal growth.
    Type: Application
    Filed: December 29, 2014
    Publication date: April 14, 2016
    Inventors: Heung-Cho KO, Hun-Soo JANG, Gun-Young JUNG, Bokyeong SON, Hui SONG
  • Publication number: 20160072027
    Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.
    Type: Application
    Filed: July 15, 2015
    Publication date: March 10, 2016
    Inventors: John ROGERS, Ralph NUZZO, Matthew MEITL, Etienne MENARD, Alfred BACA, Michael MOTALA, Jong-Hyun AHN, Sang-Il PARK, Chang-Jae YU, Heung Cho KO, Mark STOYKOVICH, Jongseung YOON