Patents by Inventor Heung Cho Ko
Heung Cho Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8722458Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: GrantFiled: May 4, 2011Date of Patent: May 13, 2014Assignees: The Board of Trustees of the University of Illinois, Semprius, Inc.Inventors: John Rogers, Ralph Nuzzo, Matthew Meitl, Etienne Menard, Alfred J. Baca, Michael Motala, Jong-Hyun Ahn, Sang-Il Park, Chang-Jae Yu, Heung Cho Ko, Mark Stoykovich, Jongseung Yoon
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Patent number: 8552299Abstract: Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.Type: GrantFiled: March 5, 2009Date of Patent: October 8, 2013Assignee: The Board of Trustees of the University of IllinoisInventors: John A. Rogers, Yonggang Huang, Heung Cho Ko, Mark Stoykovich, Won Mook Choi, Jizhou Song, Jong Hyun Ahn, Dae Hyeong Kim
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Patent number: 8394706Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.Type: GrantFiled: October 11, 2011Date of Patent: March 12, 2013Assignee: The Board of Trustees of the University of IllinoisInventors: Ralph G. Nuzzo, John A. Rogers, Etienne Menard, Keon Jae Lee, Dahl-Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu, Heung Cho Ko, Shawn Mack
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Publication number: 20120327608Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.Type: ApplicationFiled: April 6, 2012Publication date: December 27, 2012Inventors: John A. ROGERS, Matthew Meitl, Yugang Sun, Heung Cho Ko, Andrew Carlson, Won Mook Choi, Mark Stoykovich, Hanging Jiang, Yonggang Huang, Ralph G. Nuzzo, Zhengtao Zhu, Etienne Menard, Dahl-Young Khang
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Patent number: 8217381Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.Type: GrantFiled: September 6, 2007Date of Patent: July 10, 2012Assignee: The Board of Trustees of the University of IllinoisInventors: John A. Rogers, Matthew Meitl, Yugang Sun, Heung Cho Ko, Andrew Carlson, Won Mook Choi, Mark Stoykovich, Hanqing Jiang, Yonggang Huang, Ralph G. Nuzzo, Keon Jae Lee, Zhengtao Zhu, Etienne Menard, Dahl-Young Khang, Seong Jun Kang, Jong Hyun Ahn, Hoon-sik Kim
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Publication number: 20120083099Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.Type: ApplicationFiled: October 11, 2011Publication date: April 5, 2012Applicant: The Board of Trustees of the University of IllinoisInventors: Ralph G. NUZZO, John A. ROGERS, Etienne MENARD, Keon Jae LEE, Dahl-Young KHANG, Yugang SUN, Matthew MEITL, Zhengtao ZHU, Heung Cho KO, Shawn MACK
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Publication number: 20110316120Abstract: Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.Type: ApplicationFiled: September 8, 2011Publication date: December 29, 2011Applicant: The Board of Trustees of the University of IllinoisInventors: John A. ROGERS, Ralph G. NUZZO, Matthew MEITL, Heung Cho KO, Jongseung YOON, Etienne MENARD, Alfred J. BACA
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Publication number: 20110266561Abstract: The present invention provides optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: ApplicationFiled: May 4, 2011Publication date: November 3, 2011Inventors: John ROGERS, Ralph NUZZO, Matthew MEITL, Etienne MENARD, Alfred J. BACA, Michael MOTALA, Jong-Hyun AHN, Sang-Il PARK, Chang-Jae YU, Heung-Cho KO, Mark STOYKOVICH, Jongseung YOON
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Patent number: 8039847Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.Type: GrantFiled: July 27, 2010Date of Patent: October 18, 2011Assignee: The Board of Trustees of the University of IllinoisInventors: Ralph G. Nuzzo, John A. Rogers, Etienne Menard, Keon Jae Lee, Dahl-Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu, Heung Cho Ko, Shawn Mack
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Publication number: 20110171813Abstract: Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.Type: ApplicationFiled: March 24, 2011Publication date: July 14, 2011Applicant: The Board of Trustees of the University of IllinoisInventors: John A. ROGERS, Ralph G. Nuzzo, Matthew Meitl, Heung Cho Ko, Jongseung Yoon, Etienne Menard, Alfred J. Baca
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Patent number: 7972875Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: GrantFiled: October 31, 2007Date of Patent: July 5, 2011Assignee: The Board of Trustees of the University of IllinoisInventors: John Rogers, Ralph Nuzzo, Matthew Meitl, Etienne Menard, Alfred J. Baca, Michael Motala, Jong-Hyun Ahn, Sang-II Park, Chang-Jae Yu, Heung-Cho Ko, Mark Stoykovich, Jongseung Yoon
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Patent number: 7932123Abstract: Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.Type: GrantFiled: September 20, 2007Date of Patent: April 26, 2011Assignee: The Board of Trustees of the University of IllinoisInventors: John A. Rogers, Ralph G. Nuzzo, Matthew Meitl, Heung Cho Ko, Jongseung Yoon, Etienne Menard, Alfred J. Baca
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Publication number: 20100289124Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.Type: ApplicationFiled: July 27, 2010Publication date: November 18, 2010Applicant: The Board of Trustees of the University of IllinoisInventors: Ralph G. NUZZO, John A. ROGERS, Etienne MENARD, Keon Jae LEE, Dahl-Young KHANG, Yugang SUN, Matthew MEITL, Zhengtao ZHU, Heung Cho KO, Shawn MACK
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Publication number: 20100283069Abstract: The present invention provides optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: ApplicationFiled: October 31, 2007Publication date: November 11, 2010Inventors: John Rogers, Ralph Nuzzo, Matthew Meitl, Etienne Menard, Alfred J. Baca, Michael Motala, Jong-Hyun Ahn, Sang-Il Park, Chang-Jae Yu, Heung-Cho Ko, Mark Stoykovich, Jongseung Yoon
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Patent number: 7799699Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.Type: GrantFiled: June 1, 2006Date of Patent: September 21, 2010Assignee: The Board of Trustees of the University of IllinoisInventors: Ralph G. Nuzzo, John A. Rogers, Etienne Menard, Keon Jae Lee, Dahl-Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu, Heung Cho Ko, Shawn Mack
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Publication number: 20100002402Abstract: Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.Type: ApplicationFiled: March 5, 2009Publication date: January 7, 2010Inventors: John A. Rogers, Yonggang Huang, Heung Cho Ko, Mark Stoykovich, Won Mook Choi, Jizhou Song, Jong Hyun Ahn, Dae Hyeong Kim
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Patent number: 7446166Abstract: The present invention relates to pyrrole derivatives and photosensitive film using the same and more particularly, the pyrrole derivatives consist of pyrrole units to allow polymerization chemically and electrochemically and a perylene diimide unit to absorb light so that perylene diimide film can be produced by crosslinking the pyrrole units by irradiation of visible light having wavelengths longer than 500 nm and become insoluble in most solvents. Such perylene diimide films can be widely used in the manufacture of electrical, electronical and optical devices such as photo diodes, solar batteries, liquid crystal displays, and luminescent diodes, etc.Type: GrantFiled: October 21, 2005Date of Patent: November 4, 2008Assignee: Industry - University Cooperation Foundation Sogang UniversityInventors: Hoosung Lee, Bongjin Moon, Heung Cho Ko, Woonghyun Choi, Suk-ho Kim
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Publication number: 20080157235Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.Type: ApplicationFiled: September 6, 2007Publication date: July 3, 2008Inventors: John A. Rogers, Matthew Meitl, Yugang Sun, Heung Cho Ko, Andrew Carlson, Won Mook Choi, Mark Stoykovich, Hanqing Jiang, Yonggang Huang
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Publication number: 20080108171Abstract: Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.Type: ApplicationFiled: September 20, 2007Publication date: May 8, 2008Inventors: John Rogers, Ralph Nuzzo, Matthew Meitl, Heung Cho Ko, Jongseung Yoon, Etienne Menard, Alfred Baca