Abstract: A micro device transfer apparatus and a micro device transfer method are provided. The micro device transfer apparatus comprises a stage unit including a stage where a target substrate is to be disposed, a plurality of transfer head units disposed above the stage, and a transfer head unit moving part configured to move the plurality of transfer head units, wherein, the transfer head unit comprises a carrier substrate fastening part configured to fasten a carrier substrate where a plurality of micro devices are disposed, a mask unit disposed above the carrier substrate fastening part, the mask unit comprising a mask including an opening part and a shielding part, a light emitting part disposed on the mask unit, and a housing formed around the carrier substrate fastening part, the mask unit, and the light emitting part.

Abstract: A laser machining apparatus includes, a processing chamber, a window disposed in a surface of the processing chamber, a substrate carrier disposed inside the processing chamber and facing the window, a laser irradiator which irradiates a laser onto the substrate carrier through the window, a protector supplier disposed on a side of the processing chamber, a protector retriever disposed on an opposite side of the processing chamber opposite to the side of the processing chamber, and a protector which connects the protector supplier with the protector retriever, where at least a portion of the protector is disposed between the substrate carrier and the window in the processing chamber.

Abstract: A micro device transfer apparatus and a micro device transfer method are provided. The micro device transfer apparatus comprises a stage unit including a stage where a target substrate is to be disposed, a plurality of transfer head units disposed above the stage, and a transfer head unit moving part configured to move the plurality of transfer head units, wherein, the transfer head unit comprises a carrier substrate fastening part configured to fasten a carrier substrate where a plurality of micro devices are disposed, a mask unit disposed above the carrier substrate fastening part, the mask unit comprising a mask including an opening part and a shielding part, a light emitting part disposed on the mask unit, and a housing formed around the carrier substrate fastening part, the mask unit, and the light emitting part.

Abstract: A micro device transfer apparatus and a micro device transfer method are provided. The micro device transfer apparatus comprises a stage unit including a stage where a target substrate is to be disposed, a plurality of transfer head units disposed above the stage, and a transfer head unit moving part configured to move the plurality of transfer head units, wherein, the transfer head unit comprises a carrier substrate fastening part configured to fasten a carrier substrate where a plurality of micro devices are disposed, a mask unit disposed above the carrier substrate fastening part, the mask unit comprising a mask including an opening part and a shielding part, a light emitting part disposed on the mask unit, and a housing formed around the carrier substrate fastening part, the mask unit, and the light emitting part.

Abstract: A micro device transfer apparatus and a micro device transfer method are provided. The micro device transfer apparatus comprises a stage unit including a stage where a target substrate is to be disposed, a plurality of transfer head units disposed above the stage, and a transfer head unit moving part configured to move the plurality of transfer head units, wherein, the transfer head unit comprises a carrier substrate fastening part configured to fasten a carrier substrate where a plurality of micro devices are disposed, a mask unit disposed above the carrier substrate fastening part, the mask unit comprising a mask including an opening part and a shielding part, a light emitting part disposed on the mask unit, and a housing formed around the carrier substrate fastening part, the mask unit, and the light emitting part.

Abstract: A method of manufacturing a display device is provided. A method of manufacturing a display device comprises preparing a thin film forming apparatus including a crucible, which stores a source material for forming a thin film, and a front heatsink, which is disposed on the crucible and includes a reflective plate, wherein the reflective plate has a first surface with a first reflectivity and a second surface with a second reflectivity, which is different from the first reflectivity; and forming a thin film on a substrate by evaporating the source material of the thin film forming apparatus.

Abstract: A method of manufacturing a display device is provided. A method of manufacturing a display device comprises preparing a thin film forming apparatus including a crucible, which stores a source material for forming a thin film, and a front heatsink, which is disposed on the crucible and includes a reflective plate, wherein the reflective plate has a first surface with a first reflectivity and a second surface with a second reflectivity, which is different from the first reflectivity; and forming a thin film on a substrate by evaporating the source material of the thin film forming apparatus.

Abstract: A display device includes a timing controller for controlling the display of an image. The timing controller forms a frame for an image signal based on a main frame, a compensation frame, and at least one blank frame. The timing controller also determines a driving method for the display pixels to generate output image data. The main frame serves to display the image signal. The compensation frame serves to compensate luminance of the main frame. The blank frame serves to express a black gray scale value.

Abstract: Exemplary embodiments of the present invention relate to a pixel circuit comprising an organic light emitting diode (OLED), an RS trigger comprising a first terminal connected to a scan line, a second terminal connected to an enable line, and a third terminal connected to a data line, the RS trigger configured to generate an output signal according to an enable signal, a data signal, and a scan signal respectively received via the enable line, the data line, and the scan line, and a driving transistor comprising a first electrode connected to a first power source, a second electrode connected to an anode of the OLED, and a gate electrode connected to an output terminal of the RS trigger, the driver transistor configured to control a current flowing through the OLED in response to the output signal of the RS trigger.

Abstract: A pixel circuit includes: an organic light emitting diode (“OLED”); a threshold circuit which generates an output signal based on an input signal, where the threshold circuit has a hysteresis characteristic with respect to the input signal; a first transistor including a first electrode connected to a data line, a second electrode connected to an input terminal of the threshold circuit, and a gate electrode connected to a scan line; and a second transistor including a first electrode connected to a first power, a second electrode connected to an anode of the organic light emitting diode, and a gate electrode connected to an output terminal of the threshold circuit, where the second transistor controls a current amount that flows to the organic light emitting diode from the first power based on the output signal of the threshold circuit.

Abstract: An exemplary embodiment described technology relates generally to an organic light emitting diode (OLED) display and a manufacturing method thereof. The organic light emitting diode (OLED) display according to an exemplary embodiment includes: a substrate; an encapsulation member; an organic light emitting element between the substrate and the encapsulation member; a middle sealing member including one side disposed between the substrate and the encapsulation member and another side extended from the one side to be bent and enclosing an edge of the encapsulation member; a first sealant sealing and combining the one side of the middle sealing member and the substrate to each other; a second sealant sealing and combining the other side of the middle sealing member and the encapsulation member to each other; and a getter at the one side of the middle sealing member and the encapsulation member.

Abstract: A controller for a display panel may include a first supply circuit to output first and second driving voltages to a sub-pixel of a first color; and a second supply circuit to output third and fourth driving voltages to a sub-pixel of a second color. The first driving voltage may be greater than the second driving voltage, and the third driving voltage may be greater than the fourth driving voltage. Also, at least three of the first, second, third, and fourth driving voltages may be different from one another.

Abstract: An exemplary embodiment described technology relates generally to an organic light emitting diode (OLED) display and a manufacturing method thereof. The organic light emitting diode (OLED) display according to an exemplary embodiment includes: a substrate; an encapsulation member; an organic light emitting element between the substrate and the encapsulation member; a middle sealing member including one side disposed between the substrate and the encapsulation member and another side extended from the one side to be bent and enclosing an edge of the encapsulation member; a first sealant sealing and combining the one side of the middle sealing member and the substrate to each other; a second sealant sealing and combining the other side of the middle sealing member and the encapsulation member to each other; and a getter at the one side of the middle sealing member and the encapsulation member.

Abstract: A display device includes a display unit including pixels, each of which emits light according to data voltages, respectively; and a timing controller which divides an area of the display unit into an upper, center and bottom portions, divides one frame time into light emission sub-frames of a light emission period and a blank sub-frame of a blank period in which is supplied a black data signal, divides the upper, center and the bottom portions into groups, differentiates a scan start time of a light emission sub-frame and a scan start time of the blank sub-frame of each group, and increases the light emission period and decreases the blank period in proportional to an increase ratio of the light emission period as a group is closer to a middle of the center portion.

Abstract: An exemplary embodiment described technology relates generally to an organic light emitting diode (OLED) display and a manufacturing method thereof. The organic light emitting diode (OLED) display according to an exemplary embodiment includes: a substrate; an encapsulation member; an organic light emitting element between the substrate and the encapsulation member; a middle sealing member including one side disposed between the substrate and the encapsulation member and another side extended from the one side to be bent and enclosing an edge of the encapsulation member; a first sealant sealing and combining the one side of the middle sealing member and the substrate to each other; a second sealant sealing and combining the other side of the middle sealing member and the encapsulation member to each other; and a getter at the one side of the middle sealing member and the encapsulation member.

Abstract: Provided is a sputtering apparatus which deposits a metal catalyst on an amorphous silicon layer at an extremely low concentration in order to crystallize amorphous silicon, and particularly minimizes non-uniformity of the metal catalyst caused by a pre-sputtering process without reducing process efficiency. This sputtering apparatus improves the uniformity of the metal catalyst deposited on the amorphous silicon layer at an extremely low concentration. The sputtering apparatus includes a process chamber having first and second regions, a metal target located inside the process chamber, a target transfer unit moving the metal target and having a first shield for controlling a traveling direction of a metal catalyst discharged from the metal target, and a substrate holder disposed in the second region to be capable of facing the metal target.

Abstract: A method of manufacturing an organic light emitting diode display according to an exemplary embodiment of the present invention includes: forming a first electrode on a substrate; forming an insulation layer on the first electrode; etching the insulation layer to expose the first electrode so as to form a pixel defining layer having the same height as the first electrode; forming an organic layer including one or more emission layers on the first electrode of a sub-pixel region defined by the pixel defining layer by applying a laser-induced thermal imaging (LITI) method; and forming a second electrode on the organic layer.

Abstract: Provided is a sputtering apparatus which deposits a metal catalyst on an amorphous silicon layer at an extremely low concentration in order to crystallize amorphous silicon, and particularly minimizes non-uniformity of the metal catalyst caused by a pre-sputtering process without reducing process efficiency. This sputtering apparatus improves the uniformity of the metal catalyst deposited on the amorphous silicon layer at an extremely low concentration. The sputtering apparatus includes a process chamber having first and second regions, a metal target located inside the process chamber, a target transfer unit moving the metal target and having a first shield for controlling a traveling direction of a metal catalyst discharged from the metal target, and a substrate holder disposed in the second region to be capable of facing the metal target.

Abstract: A display device includes a timing controller for controlling the display of an image. The timing controller forms a frame for an image signal based on a main frame, a compensation frame, and at least one blank frame. The timing controller also determines a driving method for the display pixels to generate output image data. The main frame serves to display the image signal. The compensation frame serves to compensate luminance of the main frame. The blank frame serves to express a black gray scale value.

Abstract: Exemplary embodiments of the present invention relates to a pixel circuit for displaying an image of uniform luminance. The pixel circuit comprising an organic light emitting diode (OLED), an RS trigger comprising a first terminal connected to a scan line, a second terminal connected to an enable line, and a third terminal connected to a data line, the RS trigger configured to generate an output signal according to an enable signal, a data signal, and a scan signal respectively received via the enable line, the data line, and the scan line, and a driving transistor comprising a first electrode connected to a first power source, a second electrode connected to an anode of the OLED, and a gate electrode connected to an output terminal of the RS trigger, the driver transistor configured to control a current flowing through the OLED in response to the output signal of the RS trigger.