Patents by Inventor Hideaki Komoda
Hideaki Komoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8356118Abstract: A storage device is removably connectable to a host computer. The storage device includes: a storage unit on which one or more storage areas are allocatable to a plurality of users; and a control unit. The control unit is operable to, when the storage deice receives authentication success information indicating that authentication for one of the users is succeeded from the host computer or other external device, simulatively mount the storage area allocated to the authenticated user and unmount the storage area allocated to another user.Type: GrantFiled: September 11, 2008Date of Patent: January 15, 2013Assignee: Buffalo Inc.Inventor: Hideaki Komoda
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Patent number: 7754321Abstract: A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.Type: GrantFiled: September 11, 2003Date of Patent: July 13, 2010Assignee: Panasonic CorporationInventors: Shigeru Yamane, Eiji Kawamoto, Hideaki Komoda, Takeshi Suzuki, Toshihiro Nishii, Shinji Nakamura
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Publication number: 20090089460Abstract: A storage device is removably connectable to a host computer. The storage device includes: a storage unit on which one or more storage areas are allocatable to a plurality of users; and a control unit. The control unit is operable to, when the storage deice receives authentication success information indicating that authentication for one of the users is succeeded from the host computer or other external device, simulatively mount the storage area allocated to the authenticated user and unmount the storage area allocated to another user.Type: ApplicationFiled: September 11, 2008Publication date: April 2, 2009Applicant: Buffalo Inc.Inventor: Hideaki Komoda
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Patent number: 7356916Abstract: A circuit board with reliable electrical connections is provided. An insulated board material, having connections for connecting a layer to another layer, includes a reinforcing member. A thickness of the entire insulated board material is at least equal to and not more than 1.5 times of a thickness of the reinforcing member.Type: GrantFiled: July 16, 2002Date of Patent: April 15, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshihiro Nishii, Yasuharu Fukui, Kiyohide Tatsumi, Yoshihiro Kawakita, Shinji Nakamura, Hideaki Komoda
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Patent number: 7105277Abstract: The present invention aims to provide a printing plate capable of preventing paste of high viscosity adhering to an edge of a squeegee from being transferred to and left on a through hole of a printed circuit board when the paste is being filled by a squeegeeing method. The printing plate has a metal sheet (3) provided with a squeegee cleaning section (7) formed thereon and fixed to the back surface of a slanting area (5) of mask (2) attached to a plate framework (1). The through hole of the printed circuit board is filled with paste only after paste of high viscosity adhering to the edge of the squeegee is removed by the squeegee cleaning section (7), to prevent the paste from being left on the through hole, and thereby achieving the printed circuit board of excellent quality.Type: GrantFiled: September 19, 2003Date of Patent: September 12, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshiaki Takenaka, Toshihiro Nishii, Hideaki Komoda, Toshikazu Kondo, Shinji Nakamura
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Patent number: 7018672Abstract: A method of manufacturing multi-layer circuit board comprising: a hole forming step for forming through-holes or blind-holes in a plate-form or sheet-form board material, and a filling step for filling a paste into through-holes or blind-holes formed in the hole forming step by using a filling means. A second paste is supplied to the paste in the filling process by using a paste supplying means to stabilized a viscosity of the paste and the paste is reliably filled into the through-holes or the blind-holes.Type: GrantFiled: December 4, 2001Date of Patent: March 28, 2006Assignee: Matushita Electric Industrial Co., Ltd.Inventors: Toshiaki Takenaka, Toshihiro Nishii, Yuichiro Sugita, Shinji Nakamura, Hideaki Komoda, Toshikazu Kondo
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Patent number: 6993836Abstract: A circuit board having stable connection resistance can be obtained. The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.Type: GrantFiled: August 27, 2003Date of Patent: February 7, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshiaki Takenaka, Toshihiro Nishii, Shigeru Yamane, Shinji Nakamura, Hideaki Komoda, Kunio Kishimoto
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Publication number: 20050249933Abstract: A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.Type: ApplicationFiled: September 11, 2003Publication date: November 10, 2005Inventors: Shigeru Yamane, Eiji Kawamoto, Hideaki Komoda, Takeshi Suzuki, Toshihiro Nishii, Shinji Nakamura
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Patent number: 6833042Abstract: A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.Type: GrantFiled: October 9, 2002Date of Patent: December 21, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shigeru Yamane, Eiji Kawamoto, Hideaki Komoda, Takeshi Suzuki, Toshihiro Nishii, Shinji Nakamura
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Publication number: 20040248041Abstract: The present invention aims to provide a printing plate capable of preventing paste of high viscosity adhering to an edge of a squeegee from being transferred to and left on a through hole of a printed circuit board when the paste is being filled by a squeegeeing method. The printing plate has a metal sheet (3) provided with a squeegee cleaning section (7) formed thereon and fixed to the back surface of a slanting area (5) of mask (2) attached to a plate framework (1). The through hole of the printed circuit board is filled with paste only after paste of high viscosity adhering to the edge of the squeegee is removed by the squeegee cleaning section (7), to prevent the paste from being left on the through hole, and thereby achieving the printed circuit board of excellent quality.Type: ApplicationFiled: March 23, 2004Publication date: December 9, 2004Inventors: Toshiaki Takenaka, Toshihiro Nishii, Hideaki Komoda, Toshikazu Kondo, Shinji Nakamura
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Publication number: 20040058136Abstract: A circuit board ensuring electrical connections is provided. An insulated board material, having connecting means for connecting a layer to another layer, includes a reinforcing member. A thickness of the entire insulated board material is at least equal to or not more than 1.5 times of a thickness of the reinforcing member.Type: ApplicationFiled: July 29, 2003Publication date: March 25, 2004Inventors: Toshihiro Nishii, Yasuharu Fukui, Kiyohide Tatsumi, Yoshihiro Kawakita, Shinji Nakamura, Hideaki Komoda
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Patent number: 6700071Abstract: A circuit board having stable connection resistance can be obtained . The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.Type: GrantFiled: August 14, 2001Date of Patent: March 2, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshiaki Takenaka, Toshihiro Nishii, Shigeru Yamane, Shinji Nakamura, Hideaki Komoda, Kunio Kishimoto
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Publication number: 20040035604Abstract: A circuit board having stable connection resistance can be obtained. The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.Type: ApplicationFiled: August 27, 2003Publication date: February 26, 2004Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Toshiaki Takenaka, Toshihiro Nishii, Shigeru Yamane, Shinji Nakamura, Hideaki Komoda, Kunio Kishimoto
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Publication number: 20030138553Abstract: A method of manufacturing multi-layer circuit board comprising: a hole forming step for forming through-holes or blind-holes in a plate-form or sheet-form board material, and a filling step for filling a paste into through-holes or blind-holes formed in the hole forming step by using a filling means. A second paste is supplied to the paste in the filling process by using a paste supplying means to stabilized a viscosity of the paste and the paste is reliably filled into the through-holes or the blind-holes.Type: ApplicationFiled: November 21, 2002Publication date: July 24, 2003Inventors: Toshiaki Takenaka, Toshihiro Nishii, Yuichiro Sugita, Shinji Nakamura, Hideaki Komoda, Toshikazu Kondo
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Publication number: 20030091787Abstract: A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.Type: ApplicationFiled: October 9, 2002Publication date: May 15, 2003Inventors: Shigeru Yamane, Eiji Kawamoto, Hideaki Komoda, Takeshi Suzuki, Toshihiro Nishii, Shinji Nakamura
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Patent number: 6528733Abstract: An inner layer circuit board with a convex inner layer circuit pattern having a predetermined thickness, a prepreg sheet having conductive material disposed in a plurality of through-holes and metallic foil are laminated to a substrate, and the laminated board is heated under pressures. After that, a laminated circuit pattern is formed by machining the metallic foil. In such multi-layer circuit board, a smoothing layer is disposed on a concave portion where no inner layer circuit pattern of the inner layer circuit board is formed. In this way, the conductive materials disposed in a plurality of through-holes are uniformly compressed. As a result, the connection resistance between the inner circuit pattern and the laminated circuit pattern becomes stabilized.Type: GrantFiled: July 12, 2001Date of Patent: March 4, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshiaki Takenaka, Toshihiro Nishii, Shigeru Yamane, Shinji Nakamura, Hideaki Komoda, Kunio Kishimoto
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Publication number: 20020189856Abstract: A circuit board having stable connection resistance can be obtained . The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.Type: ApplicationFiled: August 14, 2001Publication date: December 19, 2002Inventors: Toshiaki Takenaka, Toshihiro Nishii, Shigeru Yamane, Shinji Nakamura, Hideaki Komoda, Kunio Kishimoto
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Publication number: 20020020548Abstract: An inner layer circuit board with a convex inner layer circuit pattern having a predetermined thickness, a prepreg sheet having conductive material disposed in a plurality of through-holes and metallic foil are laminated to a substrate, and the laminated board is heated under pressures. After that, a laminated circuit pattern is formed by machining the metallic foil. In such multi-layer circuit board, a smoothing layer is disposed on a concave portion where no inner layer circuit pattern of the inner layer circuit board is formed. In this way, the conductive materials disposed in a plurality of through-holes are uniformly compressed. As a result, the connection resistance between the inner circuit pattern and the laminated circuit pattern becomes stabilized.Type: ApplicationFiled: July 12, 2001Publication date: February 21, 2002Inventors: Toshiaki Takenaka, Toshihiro Nishii, Shigeru Yamane, Shinji Nakamura, Hideaki Komoda, Kunio Kishimoto
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Patent number: 5501896Abstract: In the magnetic recording medium, the non-magnetic substrate has an under-coat layer including the first flake powder of non-magnetic material on its surface and further has a back-coat film including the second flake powder of non-magnetic material on the opposite face on the non-magnetic substrate to the one face coated by the magnetic film; thereby splendid property of running durability and electromagnetic transducing characteristics is achieved in spite of thinning the total thickness of the magnetic recording medium.Type: GrantFiled: September 20, 1994Date of Patent: March 26, 1996Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yasuhiro Ueyama, Keiichi Ochiai, Tetsuo Satake, Hideaki Komoda, Hideo Hatanaka
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Patent number: 5114801Abstract: Disclosed herein is a magnetic recording medium having a magnetic layer comprising hexagonal ferrite magnetic particles each expressed as BaO.multidot.Fe.sub.12-x-y Sn.sub.x Mg.sub.y O.sub.18 (where, 0.55.ltoreq.x.ltoreq.0.88, 0.71.ltoreq.y.ltoreq.1.05). The hexagonal ferrite magnetic particles contained in this magnetic layer each have Sn and Mg partially substituted for Fe, the Sn and Mg being perfectly solid-soluble, thus being capable of providing hexagonal ferrite magnetic particles which are superior in crystalline properties and small in variation of composition. As a result, the coercivity distribution can be made further sensitive, both the self demagnetization and recording demagnetization in the short wave-length range can be reduced, and a higher reproducing output characteristic is attainable in the high density recording range.Type: GrantFiled: August 21, 1990Date of Patent: May 19, 1992Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Nobuyuki Aoki, Keiichi Ochiai, Hideaki Komoda