Patents by Inventor Hideaki Nonaka

Hideaki Nonaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process and apparatus for nickel plating and nickel-plated product
    Publication number: 20010041267
    Abstract: According to the present invention, Ni-B is electrolessly deposited on an object and then Ni-P is electrolessly deposited on the surface of the Ni-B layer formed on the object. In this process, if any dry area is present on the Ni-B layer where moisture has been evaporated after the Ni-B depositing step and before the Ni-P depositing step, it is difficult to form a uniform Ni-P layer on the Ni-B layer in such area. Accordingly, an additional step is provided for preventing the Ni-B layer formed on the object from drying after the Ni-B plating step and before the Ni-P plating step. In this way, a uniform Ni-P layer can be electrolessly deposited on the electrolessly deposited Ni-B layer.
    Type: Application
    Filed: March 22, 2001
    Publication date: November 15, 2001
    Applicant: Toshiba TEC Kabushiki Kaisha
    Inventors: Takashi Harakawa, Hideaki Nonaka