Abstract: Wafers W are supported respectively on inner tables 52 of a table 13, and after a strip of sheet S is fed out to the upper surface side of the wafers W, a press roller 14 imparts a press force. The adhesive sheet S is cut along the outer periphery of the wafers by a cutter blade 63 mounted at the free-end side of a robot 15. The robot 15 has a function to exchange the cutter blade 63 with a suction arm 100, to transfer the wafer W from a magazine 200 to the table 13 and to transfer the wafer W stuck with the sheet to the next process.

Abstract: A cutting device that, after a sheet is stuck on a wafer on a sticking table, cuts the sheet along the outer edge of the wafer. The cutting device includes a robot body disposed besides the sticking table and a cutter blade supported by a tool holding chuck positioned at the front end of the robot body. The cutter blade is detachably attached to the tool holding chuck so as to be replaceable and is arranged so as to cut the sheet in a state that the posture thereof is adjusted along a preset movement track.

Abstract: A sheet cutting table 13, after sticking an adhesive sheet S to a semiconductor wafer W, for cutting the area outside the semiconductor wafer W as an unnecessary adhesive sheet S1 with a cutting device 15. The table 13 includes an inner table 52 which supports the semiconductor wafer W, and an outer table 51 corresponding to the unnecessary adhesive sheet S1 outside the semiconductor wafer W. The upper surface of the outer table 51 is provided with a non-adherable treatment surface 51A, and an adherable member formed with a ring member 53 or a plate member 63 for sticking the adhesive sheet S thereto.

Abstract: A sheet cutting apparatus includes a cutting device and at least one cutter blade to be mounted detachably on the cutting device. The cutter blade has a blade holder and a blade fixed to the blade holder. The apparatus further includes a stocking device for storing the at least one cutter blade. The stocking device includes a case body, a receiving section in the case body, and a heater. The receiving section has a blade holder receiving portion for storing the blade holder and a blade receiving portion for storing the blade. The heater is arranged for heating the blade holder and the blade of the cutter blade in the receiving section. The cutting device is arranged for using the cutter blade heated by the heater.

Abstract: A sheet sticking apparatus comprises a sheet feed-out unit 12 including a peel plate 22 for peeling off an adhesive sheet S from a release liner PS; and a press roller 14 for pressing the adhesive sheet S onto a wafer W supported by a table 13 to stick the sheet thereto, wherein the peel plate 22 is supported movably forward and backward by a cylinder 50. The peel plate 22 is arranged so that the initial position of the front end is adjusted forward/backward corresponding to the size of the wafer W or the size of the table 13 supporting the same.

Abstract: A sheet sticking apparatus 10 comprises a sheet feed-out unit 12 that feeds out an adhesive sheet S to a position facing a surface of a semiconductor wafer W and a press roller 14 that presses the adhesive sheet S to stick the adhesive sheet S onto the wafer W. The sheet feed-out unit 12 includes a tension measuring means 35 for measuring a tension of the adhesive sheet S between the sheet feed-out unit 12 and the press roller 14 and a sticking angle maintaining means 37 provided with a feed-out head 49 for maintaining a sticking angle ?. After measuring and adjusting the tension immediately before sticking the adhesive sheet S, the feed-out head 49 is lowered in proportion to the movement amount of the press roller 14, thereby the sticking angle ? is maintained, and thus the tension is maintained at a constant level.

Abstract: Wafers W are supported respectively on inner tables 52 of a table 13, and after a strip of sheet S is fed out to the upper surface side of the wafers W, a press roller 14 imparts a press force. The adhesive sheet S is cut along the outer periphery of the wafers by a cutter blade 63 mounted at the free-end side of a robot 15. The robot 15 has a function to exchange the cutter blade 63 with a suction arm 100, to transfer the wafer W from a magazine 200 to the table 13 and to transfer the wafer W stuck with the sheet to the next process.

Abstract: A sheet sticking apparatus 10 comprises a sheet feed-out unit 12 for feeding out an adhesive sheet S to a position facing a surface of a semiconductor wafer W, and a press roller 14 for imparting a press force to the adhesive sheet S to stick the adhesive sheet S to the wafer W. The sheet feed-out unit 12 includes a tension measuring means 35 for measuring the tension of the adhesive sheet S between a feed-out head 49 and the press roller 14. The tension measuring means 35 maintains the tension to a constant level to prevent catching of air bubbles between the adhesive sheet S and the wafer W as well as to prevent warp deformation of the wafer stuck with the sheet.

Abstract: A conveyance device (10) constructed from a multijoint robot having first to sixth arms (15A-15F) that are each numerically controlled. A suction arm (12) for sucking and holding a semiconductor wafer (W) is provided on the free end side of the conveyance device (10). The suction arm (12) has a suction section (12C) on the forward end side of the arm and is mounted so as to be movable in three perpendicular axes (X, Y, Z axes) through the arms (15A-15F) and so as to be rotatable in the direction tilting relative to an imaginary plane (S). Accordingly, even if the semiconductor wafer (W) is tilted relative to the imaginary plane (S), the suction section (12C) can be brought to intimate contact with the wafer (W) by changing the angle of the suction arm (12).

Abstract: Wafers W are supported respectively on inner tables 52 of a table 13, and after a strip of sheet S is fed out to the upper surface side of the wafers W, a press roller 14 imparts a press force. The adhesive sheet S is cut along the outer periphery of the wafers by a cutter blade 63 mounted at the free-end side of a robot 15. The robot 15 has a function to exchange the cutter blade 63 with a suction arm 100, to transfer the wafer W from a magazine 200 to the table 13 and to transfer the wafer W stuck with the sheet to the next process.

Abstract: A cutting device 15 that, after a sheet S is stuck on a wafer W on a sticking table 13, cuts the sheet S along the outer edge of the wafer. The cutting device 15 comprises a robot body 62 disposed beside the sticking table 13 and a cutter blade 63 supported by a tool holding chuck 69 positioned at the front end of the robot body 62. The cutter blade 63 is detachably attached to the tool holding chuck 69 so as to be replaceable and is arranged so as to cut the sheet S in a state that the posture thereof is adjusted along a preset movement track.

Abstract: There is provided a method of cutting a sheet S stuck on a semiconductor wafer W having a notch N in an outer circumferential portion in accordance with a plane shape of the semiconductor wafer W. The cutting operation is carried out by using a sheet cutting device 10 mounted with a cutter blade 13 on its free-end side. The cutter blade is arranged so as to be positioned at a first insertion depth via a displacement mechanism when cutting the sheet S in an area other than an area formed with a notch N; and at a second insertion depth shallower than the first insertion depth to cut the sheet S in an area formed with the notch N.

Abstract: A sheet sticking apparatus 10 comprises a sheet feed-out unit 12 that feeds out an adhesive sheet S to a position facing a surface of a semiconductor wafer W and a press roller 14 that presses the adhesive sheet S to stick the adhesive sheet S onto the wafer W. The sheet feed-out unit 12 includes a tension measuring means 35 for measuring a tension of the adhesive sheet S between the sheet feed-out unit 12 and the press roller 14 and a sticking angle maintaining means 37 provided with a feed-out head 49 for maintaining a sticking angle ?. After measuring and adjusting the tension immediately before sticking the adhesive sheet S, the feed-out head 49 is lowered in proportion to the movement amount of the press roller 14, thereby the sticking angle ? is maintained, and thus the tension is maintained at a constant level.

Abstract: A sheet sticking apparatus comprises a sheet feed-out unit 12 including a peel plate 22 for peeling off an adhesive sheet S from a release liner PS; and a press roller 14 for pressing the adhesive sheet S onto a wafer W supported by a table 13 to stick the sheet thereto, wherein the peel plate 22 is supported movably forward and backward by a cylinder 50. The peel plate 22 is arranged so that the initial position of the front end is adjusted forward/backward corresponding to the size of the wafer W or the size of the table 13 supporting the same.

Abstract: A sheet cutting table 13, after sticking an adhesive sheet S to a semiconductor wafer W, for cutting the area outside the semiconductor wafer W as an unnecessary adhesive sheet S1 with a cutting device 15. The table 13 includes an inner table 52 which supports the semiconductor wafer W, and an outer table 51 corresponding to the unnecessary adhesive sheet S1 outside the semiconductor wafer W. The upper surface of the outer table 51 is provided with a non-adherable treatment surface 51A, and an adherable member formed with a ring member 53 or a plate member 63 for sticking the adhesive sheet S thereto.

Abstract: A cutting device 15 that, after a sheet S is stuck on a wafer W on a sticking table 13, cuts the sheet S along the outer edge of the wafer. The cutting device 15 comprises a robot body 62 disposed beside the sticking table 13 and a cutter blade 63 supported by a tool holding chuck 69 positioned at the front end of the robot body 62. The cutter blade 63 is detachably attached to the tool holding chuck so as to be replaceable and is arranged so as to cut the sheet S in a state that the posture thereof is adjusted along a preset movement track.

Abstract: A stock device 11 for storing cutter blades 21 for a cutting device 10, which includes a case body 40 provided with a receiving section 41 for the cutter blades 21. Within the case body 40, engagement surfaces 43A are provided so as, when the cutter blades 21 are stored in the receiving section 41, to ensure the orientation of the cutter blades 21 to a constant direction when a cutter blade 21 is mounted onto the cutting device 10. Also, the case body 40 stores organic solvent L therein for washing the cutter blades 21, and is arranged so as to be able to dissolve and remove adhesive and the like adhered to a blade 21B with the organic solvent L.

Abstract: A sheet sticking apparatus 10 comprises a sheet feed-out unit 12 for feeding out an adhesive sheet S to a position facing a surface of a semiconductor wafer W, and a press roller 14 for imparting a press force to the adhesive sheet S to stick the adhesive sheet S to the wafer W. The sheet feed-out unit 12 includes a tension measuring means 35 for measuring the tension of the adhesive sheet S between a feed-out head 49 and the press roller 14. The tension measuring means 35 maintains the tension to a constant level to prevent catching of air bubbles between the adhesive sheet S and the wafer W as well as to prevent warp deformation of the wafer stuck with the sheet.

Abstract: Wafers W are supported respectively on inner tables 52 of a table 13, and after a strip of sheet S is fed out to the upper surface side of the wafers W, a press roller 14 imparts a press force. The adhesive sheet S is cut along the outer periphery of the wafers by a cutter blade 63 mounted at the free-end side of a robot 15. The robot 15 has a function to exchange the cutter blade 63 with a suction arm 100, to transfer the wafer W from a magazine 200 to the table 13 and to transfer the wafer W stuck with the sheet to the next process.

Abstract: According to the present invention, Ni—B is electrolessly deposited on an object and then Ni—P is electrolessly deposited on the surface of the Ni—B layer formed on the object. In this process, if any dry area is present on the Ni—B layer where moisture has been evaporated after the Ni—B depositing step and before the Ni—P depositing step, it is difficult to form a uniform Ni—P layer on the Ni—B layer in such area. Accordingly, an additional step is provided for preventing the Ni—B layer formed on the object from drying after the Ni—B plating step and before the Ni—P plating step. In this way, a uniform Ni—P layer can be electrolessly deposited on the electrolessly deposited Ni—B layer.