Patents by Inventor Hideaki Sakaguchi
Hideaki Sakaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10588533Abstract: A bioelectrode component includes an electrode member. The electrode member includes a metal plate, a coupling bar, and a needle part. The metal plate includes a first surface and a second surface opposite to the first surface, and includes an opening formed in the metal plate. The coupling bar extends inward from an inner wall of the opening. The needle part is arranged at a leading end of the coupling bar and protrudes toward the first surface of the metal plate.Type: GrantFiled: November 13, 2018Date of Patent: March 17, 2020Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Hideaki Sakaguchi, Yoshihiro Ihara
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Publication number: 20190143091Abstract: A bioelectrode component includes an electrode member. The electrode member includes a metal plate, a coupling bar, and a needle part. The metal plate includes a first surface and a second surface opposite to the first surface, and includes an opening formed in the metal plate. The coupling bar extends inward from an inner wall of the opening. The needle part is arranged at a leading end of the coupling bar and protrudes toward the first surface of the metal plate.Type: ApplicationFiled: November 13, 2018Publication date: May 16, 2019Inventors: Hideaki Sakaguchi, Yoshihiro Ihara
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Patent number: 10206283Abstract: An electronic device includes a first wiring substrate having a first main surface, first conductive contacts, each of which is provided upright on the first main surface, has a U-shape opening toward a side of the first wiring substrate, and comprises a first contact part extending toward the side of the first wiring substrate, a second wiring substrate having a second main surface, second conductive contacts, each of which is provided upright on the second main surface, has a U-shape opening toward a side of the second wiring substrate, and comprises a second contact part extending toward the side of the second wiring substrate and being in contact with the first contact part, and, third conductive contacts, each of which has a U-shape opening toward the conductive contacts and is configured to sandwich the first and second contact parts and to fix the first and second wiring substrates.Type: GrantFiled: September 11, 2018Date of Patent: February 12, 2019Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Hideaki Sakaguchi
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Patent number: 10134680Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.Type: GrantFiled: August 14, 2017Date of Patent: November 20, 2018Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai, Tsuyoshi Kobayashi, Tetsuya Koyama, Kiyoaki Iida, Tomoaki Mashima, Koichi Tanaka, Yuji Kunimoto, Takashi Yanagisawa
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Publication number: 20170365559Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.Type: ApplicationFiled: August 14, 2017Publication date: December 21, 2017Inventors: Takaharu YAMANO, Hajime IIZUKA, Hideaki SAKAGUCHI, Toshio KOBAYASHI, Tadashi ARAI, Tsuyoshi KOBAYASHI, Tetsuya KOYAMA, Kiyoaki IIDA, Tomoaki MASHIMA, Koichi TANAKA, Yuji KUNIMOTO, Takashi YANAGISAWA
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Patent number: 9768122Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.Type: GrantFiled: August 19, 2016Date of Patent: September 19, 2017Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai, Tsuyoshi Kobayashi, Tetsuya Koyama, Kiyoaki Iida, Tomoaki Mashima, Koichi Tanaka, Yuji Kunimoto, Takashi Yanagisawa
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Patent number: 9646924Abstract: Electrodes pads formed on device surfaces connect semiconductor chips to through electrodes of an intermediate substrate. A flow path is formed inside the intermediate substrate. A cooling medium flows through the flow path. Stoppers are attached to an inner surface of the flow path. The stoppers include metal abutment members, respectively. An end of each pipe abuts against the counterpart abutment member. Solder connects the pipes to the abutment members.Type: GrantFiled: June 23, 2014Date of Patent: May 9, 2017Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Hideaki Sakaguchi
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Patent number: 9591742Abstract: There is provided an interposer for cooling an electronic component. The interposer includes: a substrate body having a hollow cooling channel therein, wherein a cooling medium flows through the cooling channel, the cooling channel including: a plurality of main cooling channels extending in a certain direction and separated from each other; an inflow channel which is communicated with one end of the respective main cooling channels; and an outflow channel which is communicated with the other end of the respective main cooling channels, and a plurality of through electrode groups each comprising a plurality of through electrodes arranged in a line. Each of the though electrodes is formed through the substrate body to reach the first and second surfaces of the substrate body. The respective through electrode groups are partitioned by at least corresponding one of the main cooling channels.Type: GrantFiled: May 30, 2014Date of Patent: March 7, 2017Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Kei Murayama, Mitsutoshi Higashi, Koji Nagai, Hideaki Sakaguchi
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Publication number: 20160358858Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.Type: ApplicationFiled: August 19, 2016Publication date: December 8, 2016Inventors: Takaharu YAMANO, Hajime IIZUKA, Hideaki SAKAGUCHI, Toshio KOBAYASHI, Tadashi ARAI, Tsuyoshi KOBAYASHI, Tetsuya KOYAMA, Kiyoaki IIDA, Tomoaki MASHIMA, Koichi TANAKA, Yuji KUNIMOTO, Takashi YANAGISAWA
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Patent number: 9451702Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.Type: GrantFiled: July 1, 2014Date of Patent: September 20, 2016Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai, Tsuyoshi Kobayashi, Tetsuya Koyama, Kiyoaki Iida, Tomoaki Mashima, Koichi Tanaka, Yuji Kunimoto, Takashi Yanagisawa
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Patent number: 9434604Abstract: A cap for installing a semiconductor device that can send or receive a light having a predetermined wavelength, the cap including a recess for installing the semiconductor device, the recess being defined by a through-hole penetrating an upper surface of a silicon substrate and a lower surface of the silicon substrate, the through-hole having an upper end part of the through-hole on a side of the upper surface of the silicon substrate and a lower end part of the through-hole on a side of the lower surface of the silicon substrate, and a coating film formed to cover the upper surface of the silicon substrate and the upper end part of the through-hole, wherein the coating film that covers the upper end part of the through-hole is a window part that transmits the light having a predetermined wavelength.Type: GrantFiled: January 28, 2015Date of Patent: September 6, 2016Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Kosuke Fujihara, Hideaki Sakaguchi
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Publication number: 20150263238Abstract: A cap for installing a semiconductor device that can send or receive a light having a predetermined wavelength, the cap including a recess for installing the semiconductor device, the recess being defined by a through-hole penetrating an upper surface of a silicon substrate and a lower surface of the silicon substrate, the through-hole having an upper end part of the through-hole on a side of the upper surface of the silicon substrate and a lower end part of the through-hole on a side of the lower surface of the silicon substrate, and a coating film formed to cover the upper surface of the silicon substrate and the upper end part of the through-hole, wherein the coating film that covers the upper end part of the through-hole is a window part that transmits the light having a predetermined wavelength.Type: ApplicationFiled: January 28, 2015Publication date: September 17, 2015Inventors: Kosuke FUJIHARA, Hideaki SAKAGUCHI
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Patent number: 9052341Abstract: In one embodiment, a probe card is provided. The probe card includes: a substrate having a first surface and a second surface opposite to the first surface; a through hole formed through the substrate and extending between the first surface and the second surface; an elastic member formed in the through hole to extend to the first surface; a through electrode formed in through hole to extend to the second surface; a first trace on a surface of the elastic member to be electrically connected to the through electrode; and a contact bump on the elastic member via the first trace to be electrically connected to the first trace, wherein the contact bump is electrically connected to an electrode pad formed on a DUT (device under test) when an electrical testing is performed on the DUT using the probe card.Type: GrantFiled: February 23, 2012Date of Patent: June 9, 2015Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Akinori Shiraishi, Hideaki Sakaguchi, Mitsutoshi Higashi
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Patent number: 8922232Abstract: [Problems to be solved] To provide a test-use individual substrate capable of improving testing accuracy and connecting reliability. [Means for solving the Problems] A test-use individual substrate 30 which is used for testing a semiconductor wafer, comprises a main body portion 31, thin portions 321, 322 extending from the main body portion 31 and being relatively thinner than the main body portion, and bumps 33 provided on the thin portions 321, 322.Type: GrantFiled: August 18, 2011Date of Patent: December 30, 2014Assignees: Advantest Corporation, Shinko Electric Industries Co., Ltd.Inventors: Shigeru Matsumura, Kohei Kato, Katsushi Sugai, Koichi Shiroyama, Mitsutoshi Higashi, Akinori Shiraishi, Hideaki Sakaguchi
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Patent number: 8922234Abstract: A probe card for conducting an electrical test on a test subject includes a substrate body including a first surface, which faces toward the test subject, and a second surface, which is opposite to the first surface. A through electrode extends through the substrate body between the first surface and the second surface. A contact bump is formed in correspondence with the electrode pad and electrically connected to the through electrode. An elastic body is filled in an accommodating portion, which is formed in the substrate body extending from the first surface toward the second surface. The contact bump is formed on the elastic body.Type: GrantFiled: October 30, 2013Date of Patent: December 30, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventors: Akinori Shiraishi, Hideaki Sakaguchi, Mitsutoshi Higashi
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Publication number: 20140376189Abstract: Electrodes pads formed on device surfaces connect semiconductor chips to through electrodes of an intermediate substrate. A flow path is formed inside the intermediate substrate. A cooling medium flows through the flow path. Stoppers are attached to an inner surface of the flow path. The stoppers include metal abutment members, respectively. An end of each pipe abuts against the counterpart abutment member. Solder connects the pipes to the abutment members.Type: ApplicationFiled: June 23, 2014Publication date: December 25, 2014Inventor: Hideaki SAKAGUCHI
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Publication number: 20140362552Abstract: There is provided an interposer for cooling an electronic component. The interposer includes: a substrate body having a hollow cooling channel therein, wherein a cooling medium flows through the cooling channel, the cooling channel including: a plurality of main cooling channels extending in a certain direction and separated from each other; an inflow channel which is communicated with one end of the respective main cooling channels; and an outflow channel which is communicated with the other end of the respective main cooling channels, and a plurality of through electrode groups each comprising a plurality of through electrodes arranged in a line. Each of the though electrodes is formed through the substrate body to reach the first and second surfaces of the substrate body. The respective through electrode groups are partitioned by at least corresponding one of the main cooling channels.Type: ApplicationFiled: May 30, 2014Publication date: December 11, 2014Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Kei Murayama, Mitsutoshi Higashi, Koji Nagai, Hideaki Sakaguchi
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Publication number: 20140313681Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.Type: ApplicationFiled: July 1, 2014Publication date: October 23, 2014Inventors: Takaharu YAMANO, Hajime IIZUKA, Hideaki SAKAGUCHI, Toshio KOBAYASHI, Tadashi ARAI, Tsuyoshi KOBAYASHI, Tetsuya KOYAMA, Kiyoaki IIDA, Tomoaki MASHIMA, Koichi TANAKA, Yuji KUNIMOTO, Takashi YANAGISAWA
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Patent number: 8810007Abstract: A wiring board provided with a silicon substrate including a through hole that communicates a first surface and a second surface of the silicon substrate. A capacitor is formed on an insulating film, which is applied to the silicon substrate, on the first surface and a wall surface defining the through hole. A capacitor part of the capacitor includes a first electrode, a dielectric layer, and a second electrode that are sequentially deposited on the insulating film on the first surface and the wall surface of the through hole. A penetration electrode is formed in the through hole covered by the first electrode, the dielectric layer, and the second electrode of the capacitor part.Type: GrantFiled: April 17, 2012Date of Patent: August 19, 2014Assignees: Shinko Electric Industries Co., Ltd., Taiyo Yuden Co., Ltd.Inventors: Akihito Takano, Masahiro Sunohara, Hideaki Sakaguchi, Mitsutoshi Higashi, Kenichi Ota, Yuichi Sasajima
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Patent number: 8793868Abstract: A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.Type: GrantFiled: June 23, 2011Date of Patent: August 5, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventors: Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai, Tsuyoshi Kobayashi, Tetsuya Koyama, Kiyoaki Iida, Tomoaki Mashima, Koichi Tanaka, Yuji Kunimoto, Takashi Yanagisawa