Patents by Inventor Hideaki Sakurai

Hideaki Sakurai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240300245
    Abstract: A liquid storage container including a positioning configuration contributing to downsizing is provided. The container capable of storing liquid therein includes a fitting portion including a communication port establishing communication between an inside and an outside, wherein a supply member supplying liquid is fitted and can supply the inside with liquid via the communication port; a first positioning portion positioning the supply member at one point; and a second positioning portion including a guide provided in the fitting portion and capable of guiding the supply member to a position where the supply member is fitted into the fitting portion when the supply member is fitted into the fitting portion while being positioned by the first positioning portion and a restriction portion restricting movement of the supply member using the first positioning portion as a rotation axis in the position where the supply member is fitted into the fitting portion.
    Type: Application
    Filed: January 18, 2024
    Publication date: September 12, 2024
    Inventors: TAKASHI HAYASAKA, KEISUKE IINUMA, TATSUO NANJO, WATARU TAKAHASHI, HIROMASA TSUTSUMI, HIDEAKI MATSUMURA, YUSUKE NARATANI, TSUYOSHI SAEKI, TAIJI MARUYAMA, SHOTA ASADA, NORIO SAKURAI
  • Publication number: 20240096601
    Abstract: A target processing method includes: importing a target into a processing chamber; forming a film including carbon on the target using at least one of first ion including carbon and a first plasma including carbon; and removing the film by a reaction between a second plasma and the film, wherein the forming of the film and the removing of the film are alternately performed a number of times in the processing chamber without removing the target from the processing chamber.
    Type: Application
    Filed: February 3, 2023
    Publication date: March 21, 2024
    Inventors: Takeharu MOTOKAWA, Noriko SAKURAI, Hideaki SAKURAI
  • Patent number: 11931923
    Abstract: A method of manufacturing a template, has: preparing a substrate containing quartz and having a surface, the surface including a protrusion and a depression; and processing the depression. The processing of the depression includes: a first step of forming a film on the surface, the film including a first region and a second region, the first region being provided on the protrusion, and the second region being provided on a bottom of the depression and being thinner than the first region; a second step of removing the second region with the first region partly remaining to expose the bottom of the depression; and a third step of processing the exposed part of the depression using a mask made of the remainder of the first region.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: March 19, 2024
    Assignee: Kioxia Corporation
    Inventors: Takeharu Motokawa, Hideaki Sakurai, Noriko Sakurai, Ryu Komatsu
  • Patent number: 11789365
    Abstract: A method for processing a substrate includes forming a pattern on a substrate, supplying water to cover the pattern, and after the supplying the water, irradiating the pattern with light having a wavelength longer that which causes dissociation of water. A substrate processing apparatus of an embodiment includes a transfer chamber to receive a patterned substrate, a water supplying chamber to cover the pattern with water, and an irradiating chamber to irradiate a portion of the pattern with near-field light.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: October 17, 2023
    Assignee: Kioxia Corporation
    Inventors: Ryu Komatsu, Takeharu Motokawa, Noriko Sakurai, Hideaki Sakurai
  • Publication number: 20230307233
    Abstract: An example of an etching method according to the present disclosure, includes: performing a first process which includes forming a first layer containing halogen or holding the substrate in a gas atmosphere containing halogen; and performing a second process which includes removing a portion of the first layer and a portion of the substrate under the portion of the first layer by supplying the portion of the first layer with ions sourced from a solid material.
    Type: Application
    Filed: September 8, 2022
    Publication date: September 28, 2023
    Applicant: Kioxia Corporation
    Inventors: Noriko SAKURAI, Takeharu MOTOKAWA, Hideaki SAKURAI
  • Publication number: 20230296979
    Abstract: A template according to the present embodiment includes a substrate, a light transmissive film, and a plurality of convex parts. The substrate has a first surface. The light transmissive film is provided on the first surface, has a second surface on a side opposite to the substrate, and has a composition different from the composition of the substrate. The plurality of convex parts are provided on the second surface and have different heights.
    Type: Application
    Filed: June 16, 2022
    Publication date: September 21, 2023
    Applicant: Kioxia Corporation
    Inventors: Takeharu MOTOKAWA, Noriko SAKURAI, Hideaki SAKURAI
  • Publication number: 20230290619
    Abstract: According to one embodiment, a plasma treatment apparatus includes a first chamber, an electrode provided in the first chamber and having a surface, and a conveyance mechanism that places a carrier structure holding a treatment target in the first chamber such that a ferromagnetic body of the carrier structure is disposed between the surface of the electrode and the treatment target. The ferromagnetic body has a single polarity within a plane substantially parallel to the surface of the electrode.
    Type: Application
    Filed: September 2, 2022
    Publication date: September 14, 2023
    Inventors: Takeharu MOTOKAWA, Noriko Sakurai, Hideaki Sakurai
  • Publication number: 20230260780
    Abstract: According to one embodiment, a method including supplying a liquid onto a substrate, solidifying the liquid on the substrate to form a solidified body, and melting the solidified body of the liquid on the substrate is provided. When solidifying the liquid, an internal pressure of the liquid on the substrate is varied.
    Type: Application
    Filed: April 6, 2023
    Publication date: August 17, 2023
    Inventors: Minako INUKAI, Hideaki SAKURAI, Kyo OTSUBO, Tetsuo TAKEMOTO
  • Patent number: 11682566
    Abstract: According to one embodiment, a processing apparatus for processing substrates having different base shapes includes a stage comprising a first portion having a substrate facing surface and an opening extending therethough connected to a source of a cooling fluid, and a second portion located outwardly of the first portion, a substrate support, having a substrate support surface thereon, extending over the second portion, a process fluid outlet overlying the first portion, and a driving unit coupled to one of the stage and the first portion, wherein the driving unit is configured to move at least one of the substrate support surface and the substrate facing surface such that the relative locations of the substrate support surface and the substrate facing surface of the stage are changeable based on the shape of a substrate to be processed in the apparatus.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: June 20, 2023
    Assignee: Kioxia Corporation
    Inventors: Kosuke Takai, Mana Tanabe, Hideaki Sakurai
  • Patent number: 11651953
    Abstract: According to one embodiment, a method including supplying a liquid onto a substrate, solidifying the liquid on the substrate to form a solidified body, and melting the solidified body of the liquid on the substrate is provided. When solidifying the liquid, an internal pressure of the liquid on the substrate is varied.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: May 16, 2023
    Assignee: Kioxia Corporation
    Inventors: Minako Inukai, Hideaki Sakurai, Kyo Otsubo, Tetsuo Takemoto
  • Publication number: 20230105202
    Abstract: This punched-workpiece with the insulating film includes a punched-workpiece having a cut surface, a plating layer formed on at least the cut surface of the punched-workpiece, and an insulating film formed on the surface of the plating layer.
    Type: Application
    Filed: February 24, 2021
    Publication date: April 6, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Nagisa Shishinai, Hideaki Sakurai
  • Patent number: 11581127
    Abstract: There is provided an insulated electric wire formed by covering a rectangular conductor wire having a rectangular cross-sectional shape with an insulating film. The insulating film is formed of an inner layer covering a surface of the rectangular conductor wire, and an outer layer covering a surface of the inner layer. A thickness (t1) of a section of the inner layer, which covers one short side of two facing short sides of the same length of a rectangular cross section of the rectangular conductor wire, is greater than a thickness (t2) (including that t2=0) of a section of the inner layer which covers the other short side. An elastic modulus and/or a yield stress of the inner layer are less than an elastic modulus and/or a yield stress of the outer layer.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: February 14, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Makoto Urushihara, Yasuhiko Kudo, Shintaro Iida, Hideaki Sakurai
  • Patent number: 11555254
    Abstract: An insulated conductor of the present invention is an insulated conductor having a conductor and an insulating film provided on a surface of the conductor, in which the insulating film has a low-concentration fluorine layer disposed on a surface side of the conductor and a high-concentration fluorine layer disposed on at least a part of an outside surface of the low-concentration fluorine layer, the low-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively lower than that of the high-concentration fluorine layer, and the high-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively higher than that of the low-concentration fluorine layer.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: January 17, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Shintaro Iida, Hideaki Sakurai
  • Patent number: 11493846
    Abstract: According to one embodiment, a pattern forming method includes forming a resist film including a first core material pattern and a second core material pattern, on a first film laminated on a substrate; forming a second film at least on sidewalls of the first and second core material patterns; removing the first core material pattern while not removing the second core material pattern and the second film; and processing the first film by using, as a mask, the second core material pattern and the second film.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: November 8, 2022
    Assignee: Kioxia Corporation
    Inventors: Takeharu Motokawa, Noriko Sakurai, Ryu Komatsu, Hideaki Sakurai
  • Patent number: 11450452
    Abstract: There is provided an insulated flat rectangular conductor including: a flat rectangular conductor; and an insulating film coating the flat rectangular conductor, in which the flat rectangular conductor has a first surface and a second surface opposite to the first surface, and the first surface is rougher than the second surface.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: September 20, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Makoto Urushihara, Hideaki Sakurai
  • Publication number: 20220291581
    Abstract: A template according to an embodiment includes a substrate and a first layer. The substrate includes a first face having a pattern, and contains a first element. The first layer is in contact with the first face, and contains a compound having the first element and a second element different from the first element, the density of the compound in the first layer being higher than the density of the compound in the substrate.
    Type: Application
    Filed: September 7, 2021
    Publication date: September 15, 2022
    Applicant: Kioxia Corporation
    Inventors: Takeharu MOTOKAWA, Noriko SAKURAI, Hideaki SAKURAI
  • Patent number: 11430585
    Abstract: An insulated conductor having a conductor and an insulating film provided on a surface of the conductor, in which the insulating film has a fluorine-containing resin composition layer including a cured product of a thermosetting resin and a fluororesin and a fluorine concentration gradient layer which is disposed between the conductor and the fluorine-containing resin composition layer. The fluorine-containing resin composition layer includes a cured product of a thermosetting resin and a fluororesin, and is provided with a concentration gradient in which a fluorine atom content decreases from the fluorine-containing resin composition layer side toward the conductor.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: August 30, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Shintaro Iida, Hideaki Sakurai
  • Publication number: 20220206382
    Abstract: According to one embodiment, a pattern formation method includes patterning a first film on a substate to have a plurality of lines extending in a first direction and a second pattern portion extending in a second direction intersecting the first direction. Each line having at least a first width and being spaced from an adjacent line in the second direction by a least three times the first width and spaced from ends of the lines in the first direction by twice or less the first width. A conformal film is then formed on the patterned first film. The conformal film having a thickness equal to the first width. The patterned first film is then removed while leaving portions of the conformal film that were previously on sidewalls of the plurality of lines behind.
    Type: Application
    Filed: August 31, 2021
    Publication date: June 30, 2022
    Inventors: Noriko SAKURAI, Takeharu MOTOKAWA, Ryu KOMATSU, Hideaki SAKURAI
  • Publication number: 20220148757
    Abstract: An insulated copper wire is an insulated copper wire having a copper wire and an insulating film coating a surface of the copper wire, in which the insulating film contains a polymer material having an amide bond, on a peeled surface formed on a surface of the insulated copper wire by peeling off the insulating film, there more copper atoms bonded to a nitrogen atom or a carbon atom than copper atoms bonded to an oxygen atom, an oxygen-containing layer containing 10 atom % or more of oxygen in a depth direction from the peeled surface is formed, and a film thickness of the oxygen-containing layer is in a range of 2 nm or more and 30 nm or less. An electric coil is formed by winding the above-described insulated copper wire.
    Type: Application
    Filed: February 17, 2020
    Publication date: May 12, 2022
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Makoto Urushihara, Hideaki Sakurai
  • Patent number: 11286576
    Abstract: An electrodeposition dispersion of the present invention is formed of a dispersion medium and a solid content. The solid content includes polyimide-based resin particles and fluorine resin particles. Also, a content ratio of the fluorine resin particles in the solid content is 20 to 70% by mass. In addition, a median diameter of the polyimide-based resin particles is 50 to 400 nm.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: March 29, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Shintaro Iida, Hideaki Sakurai