Abstract: An insulated copper wire is an insulated copper wire having a copper wire and an insulating film coating a surface of the copper wire, in which the insulating film contains a polymer material having an amide bond, on a peeled surface formed on a surface of the insulated copper wire by peeling off the insulating film, there more copper atoms bonded to a nitrogen atom or a carbon atom than copper atoms bonded to an oxygen atom, an oxygen-containing layer containing 10 atom % or more of oxygen in a depth direction from the peeled surface is formed, and a film thickness of the oxygen-containing layer is in a range of 2 nm or more and 30 nm or less. An electric coil is formed by winding the above-described insulated copper wire.

Abstract: An electrodeposition dispersion of the present invention is formed of a dispersion medium and a solid content. The solid content includes polyimide-based resin particles and fluorine resin particles. Also, a content ratio of the fluorine resin particles in the solid content is 20 to 70% by mass. In addition, a median diameter of the polyimide-based resin particles is 50 to 400 nm.

Abstract: According to one embodiment, a method for cleaning a substrate includes first cleaning process and second cleaning process. The first cleaning process subjects a substrate to a first cleaning method. The second cleaning process subjects the substrate to a second cleaning method that is different from the first cleaning method and is subsequent to the first cleaning process. The first cleaning method includes at least one of acidic cleaning or alkaline cleaning. The second cleaning method includes freeze cleaning.

Abstract: Provided is an electrodeposition dispersion including a polyamide-imide resin, a polar solvent, water, a poor solvent, and a base, in which the polar solvent is an organic solvent having a boiling point of higher than 100° C. and D(S-P) represented by a formula (1) satisfying a relationship of D(S-P)<6, and a weight-average molecular weight of the polyamide-imide is 10×104 to 30×104 or a number-average molecular weight of the polyamide-imide is 2×104 to 5×104.

Abstract: According to one embodiment, a first liquid is supplied on a first face of a substrate. The first liquid has a pH with which a surface zeta potential of the substrate becomes negative and a surface zeta potential of a foreign substance attaching to the first face becomes positive. Then, a solidified layer in which at least part of the first liquid has been solidified is formed by cooling the substrate down to be equal to or lower than a solidification point of the first liquid. Thereafter, the solidified layer is melted.

Abstract: A method of manufacturing a template, has: preparing a substrate containing quartz and having a surface, the surface including a protrusion and a depression; and processing the depression. The processing of the depression includes: a first step of forming a film on the surface, the film including a first region and a second region, the first region being provided on the protrusion, and the second region being provided on a bottom of the depression and being thinner than the first region; a second step of removing the second region with the first region partly remaining to expose the bottom of the depression; and a third step of processing the exposed part of the depression using a mask made of the remainder of the first region.

Abstract: According to one embodiment, a substrate processing method includes supplying a liquid on a first face of a substrate, forming a solidified layer in which at least part of the liquid has been solidified by cooling the substrate down to be equal to or lower than a solidification point of the liquid, and melting the solidified layer. Forming the solidified layer, includes controlling a cooling parameter by monitoring an optical characteristic or acoustic wave characteristic of the solidified layer.

Abstract: According to one embodiment, a processing apparatus for processing substrates having different base shapes includes a stage comprising a first portion having a substrate facing surface and an opening extending therethough connected to a source of a cooling fluid, and a second portion located outwardly of the first portion, a substrate support, having a substrate support surface thereon, extending over the second portion, a process fluid outlet overlying the first portion, and a driving unit coupled to one of the stage and the first portion, wherein the driving unit is configured to move at least one of the substrate support surface and the substrate facing surface such that the relative locations of the substrate support surface and the substrate facing surface of the stage are changeable based on the shape of a substrate to be processed in the apparatus.

Abstract: According to one embodiment, a processing apparatus includes a chamber, a first gas introduction port that introduces a first gas into the chamber, a first gas discharge port that discharges the first gas from the chamber, and a stage that supports a processing object in the chamber. The processing apparatus has a plasma generating section with an electrode to generate a plasma in the chamber. The processing apparatus includes a shield at a first position that is between the plasma generating section and the stage. The shield is light transmissive, but blocks radicals and ions generated with plasma. In some examples, the shield may be moveable from the first position to another position that is not between the plasma generating section and the stage.

Abstract: There is provided an insulated electric wire comprising a conductor wire coated by an insulating film, in which the insulating film contains 5 to 20% by mass of a low boiling point component having a boiling point of less than 300° C. under normal pressure. The insulating film preferably has a thickness of 40 to 65 ?m. The conductor wire preferably has a cross-sectional shape in a rectangular shape or a square shape.

Abstract: According to one embodiment, a pattern forming method includes forming a resist film including a first core material pattern and a second core material pattern, on a first film laminated on a substrate; forming a second film at least on sidewalls of the first and second core material patterns; removing the first core material pattern while not removing the second core material pattern and the second film; and processing the first film by using, as a mask, the second core material pattern and the second film.

Abstract: A method for processing a substrate includes forming a pattern on a substrate, supplying water to cover the pattern, and after the supplying the water, irradiating the pattern with light having a wavelength longer that which causes dissociation of water. A substrate processing apparatus of an embodiment includes a transfer chamber to receive a patterned substrate, a water supplying chamber to cover the pattern with water, and an irradiating chamber to irradiate a portion of the pattern with near-field light.

Abstract: A method of manufacturing an insulated superconducting wire material comprising the steps of: removing a flux (S01) by heating a superconducting wire material at a temperature equals to or higher than a flux volatilization temperature and equals to or lower than a heatproof temperature of the superconducting wire material, the superconducting wire material comprising a channel with a channel groove and a superconducting core wire material accommodated in the channel groove of the channel, and the channel groove and the superconducting core wire material being bonded with a solder including the flux; and forming an insulated superconducting wire material (S02) of forming an insulating film on a surface of the superconducting wire material.

Abstract: A method of manufacturing an insulated conductor wire material having a flat surface (12) with a groove (11, 51) formed on the flat surface (13) and coated with an insulating film, comprising: an electrodeposition step of dipping the conductor wire material in an electrodeposition dispersion (62) and forming an insulating layer (13) on a surface of the conductor wire material; an electrodeposition dispersion removal step of removing the electrodeposition dispersion (62) on the insulating layer (13) by taking out the conductor wire material from the electrodeposition dispersion (62) and by blowing a gas on a side of the flat surface (62) with the groove (11, 51); a baking step of coating the conductor wire material with an insulating film by heating the conductor wire material with the insulating layer (13) formed thereon and by baking the insulating layer (13) onto the conductor wire material.

Abstract: A freeze cleaning apparatus includes a table for supporting a processing target substrate having a first surface and a second surface opposite to the first surface, a liquid supply unit positioned to supply a cleaning liquid onto the second surface of the processing target substrate that is placed such that the first surface faces the table, and a cooling gas discharge unit in the table to supply a cooling gas to the first surface side of the processing target substrate. A gap between the table and the processing target substrate is set such that the cooling gas flows as a laminar flow between the table and the processing target substrate.

Abstract: A water treatment tank includes: a tank body including a bottom surface extending in a horizontal direction; an overflow wall partitioning the inside of the tank body into an upstream tank into which treatment water having absorbed sulfur from an exhaust gas is introduced and a downstream tank into which the treatment water overflowing from the upstream tank is introduced to flow therein; and an inclined part that is provided between the bottom surface of the tank body and the overflow wall in the downstream tank and is inclined downward as it goes from the overflow wall toward a downstream side inside the downstream tank to be connected to the bottom surface of the tank body.

Abstract: An insulated conductor of the present invention is an insulated conductor having a conductor and an insulating film provided on a surface of the conductor, in which the insulating film has a low-concentration fluorine layer disposed on a surface side of the conductor and a high-concentration fluorine layer disposed on at least a part of an outside surface of the low-concentration fluorine layer, the low-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively lower than that of the high-concentration fluorine layer, and the high-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively higher than that of the low-concentration fluorine layer.

Abstract: A water treatment tank includes: a tank body including a bottom surface extending in a horizontal direction; and an overflow wall installed in the tank body to partition an inside space of the tank body into a seawater intake upstream tank into which treatment water having absorbed sulfur from an exhaust gas is introduced and a seawater intake downstream tank into which treatment water overflowing the seawater intake upstream tank is introduced to flow therein. The treatment water flowing into the seawater intake downstream tank is divided by the overflow wall in the width direction of the overflow wall so as to form a waterfall region and a non-waterfall region.

Abstract: There is provided an insulated flat rectangular conductor including: a flat rectangular conductor; and an insulating film coating the flat rectangular conductor, in which the flat rectangular conductor has a first surface and a second surface opposite to the first surface, and the first surface is rougher than the second surface.

Abstract: A resin for forming an insulating film includes at least one of a modified polyamide-imide having a terminal OH group or a terminal SH group and a modified polyimide having a terminal OH group or a terminal SH group. A varnish includes the resin for forming an insulating film and a solvent. An electrodeposition dispersion includes the resin for forming an insulating film, a polar solvent, water, a poor solvent, and a base. A method for producing an insulated conductor includes: a step of applying the varnish or electrodepositing the electrodeposition dispersion to a surface of a conductor to form a coating layer or an electrodeposition layer on the surface of the conductor; and a step of heating the coating layer or the electrodeposition layer to produce an insulating film and bake the insulating film on the conductor.