Abstract: A circuit device includes a circuit component electrically connected to a conductor and a first heat dissipation member includes an insulation member interposed between the conductor and the attachment surface. A control element outputs a control signal, a circuit board is spaced apart from the first heat dissipation member and the conductor. A housing member includes a housing chamber housing the circuit component and the circuit board, a heat dissipation chamber through which air flows while being in contact with a heat dissipation surface of a second heat dissipation member, and a partition plate has a plurality of communication holes placing the heat dissipation chamber and the housing chamber in communication with each other. A portion of the first heat dissipation member excluding the attachment surface and a portion of the second heat dissipation member excluding the heat dissipation surface are in contact with air outside the circuit device.

Abstract: It is an object of the present invention to develop a virus preparation comprising an oncolytic HSV having, in vivo, more effective cancer cell-killing activity than the antitumor effects of existing oncolytic HSVs. Specifically, the present invention relates to a virus preparation for the treatment of a cancer, comprising an HSV (herpes simplex virus) having a receptor-retargeted gD mutation and at least one membrane fusion activity-promoting region on the genome, and a method for treating cancer using the aforementioned virus preparation.

Abstract: Provided is a circuit board assembly including an electronic component that generates heat, and a thermistor that is mounted on a circuit board that is spaced apart from the electronic component and that detects the temperature of the electronic component. The circuit board assembly further includes a heat conductive pattern formed surrounding the thermistor, and a heat conductive member that conducts heat from the electronic component to the heat conductive pattern.

Abstract: Provided is a circuit assembly that can prevent a switching element from overheating. Included is a first conductive portion that is plate-shaped and elongated in one direction, a second conductive portion that is plate-shaped, elongated along a lengthwise direction of the first conductive portion, and is arranged to be separated from the first conductive portion by a predetermined distance, and a plurality of switching elements that are arranged straddling the first conductive portion and the second conductive portion, and are lined up in the lengthwise direction, wherein width of the first conductive portion or the second conductive portion at one end portion in the lengthwise direction is different from a width at the other end portion in the lengthwise direction.

Abstract: A case is provided with a drainage channel that smoothly drains water while also being able to suppress the intrusion of water into a housing space. The case includes a first case body in which a channel extending from a region serving as the housing space is formed. The channel includes a first channel portion having one end side connected to a first outlet and another end side connected to a second outlet, and a second channel portion connects the first channel portion and the housing space. Out of the opening edges of the second channel portion that face the first channel portion, a second-side opening edge, which is the edge on the second outlet side of the first channel portion, is located nearer to the housing space than a first-side opening edge, which is the edge on the first outlet side of the first channel portion, is.

Abstract: A circuit device includes a circuit component electrically connected to a conductor and a first heat dissipation member includes an insulation member interposed between the conductor and the attachment surface. A control element outputs a control signal, a circuit board is spaced apart from the first heat dissipation member and the conductor. A housing member includes a housing chamber housing the circuit component and the circuit board, a heat dissipation chamber through which air flows while being in contact with a heat dissipation surface of a second heat dissipation member, and a partition plate has a plurality of communication holes placing the heat dissipation chamber and the housing chamber in communication with each other. A portion of the first heat dissipation member excluding the attachment surface and a portion of the second heat dissipation member excluding the heat dissipation surface are in contact with air outside the circuit device.

Abstract: Provided is a substrate unit that has a simple structure and is able to prevent water that has entered the inside from reaching a mounting surface of the substrate. The substrate unit includes: a substrate, a first casing member that supports the substrate, and a second casing member that is integrated into one piece with the first casing member and is provided on a mounting surface side of the substrate, wherein the second casing member is provided with a protruding portion that protrudes into a housing space that is defined by the first casing member and the second casing member and houses the substrate, and intersects a plane that extends along the mounting surface of the substrate.

Abstract: A conductor is placed on a first placement portion of a heat dissipation member with an insulation member interposed therebetween. An FET is electrically connected to the conductor. When current flows between the drain and the source of the FET, the FET generates heat. A second placement portion of a circuit board is placed on the conductor. The conductor and the insulation member are sandwiched between the first placement portion and the second placement portion. In the heat dissipation member, a first extension portion extends from the first placement portion, and in the circuit board, a second extension portion extends from the second placement portion. The first extension portion is located opposite to and is spaced apart from the second extension portion, and a microcomputer is placed on an upper surface of the second extension portion. The microcomputer outputs a control signal for turning the FET ON or OFF.

Abstract: A conductor is placed on a first placement portion of a heat dissipation member with an insulation member interposed therebetween. An FET is electrically connected to the conductor. When current flows between the drain and the source of the FET, the FET generates heat. A second placement portion of a circuit board is placed on the conductor. The conductor and the insulation member are sandwiched between the first placement portion and the second placement portion. In the heat dissipation member, a first extension portion extends from the first placement portion, and in the circuit board, a second extension portion extends from the second placement portion. The first extension portion is located opposite to and is spaced apart from the second extension portion, and a microcomputer is placed on an upper surface of the second extension portion. The microcomputer outputs a control signal for turning the FET ON or OFF.

Abstract: Provided is a circuit assembly that can prevent a switching element from overheating. Included is a first conductive portion that is plate-shaped and elongated in one direction, a second conductive portion that is plate-shaped, elongated along a lengthwise direction of the first conductive portion, and is arranged to be separated from the first conductive portion by a predetermined distance, and a plurality of switching elements that are arranged straddling the first conductive portion and the second conductive portion, and are lined up in the lengthwise direction, wherein width of the first conductive portion or the second conductive portion at one end portion in the lengthwise direction is different from a width at the other end portion in the lengthwise direction.

Abstract: A substrate unit includes a circuit board, a connector portion installed at the front end portion of the upper side of the circuit board, a busbar connected to the circuit board and fixed to the lower side of the circuit board, a bottom portion including a recessed portion overlapping the front end portion of the circuit board and arranged on the lower side of the busbar, and a bonding layer fixing the busbar to the bottom portion. The busbar includes a non-bonding region that faces the recessed portion. A bonding region includes the bonding layer surrounding three sides other than a front side, namely a left side, a right side, and a rear side, of the non-bonding region. Notches are located on a left side and a right side of the front end portion and overlap extension lines of boundary between the non-bonding and the bonding region.

Abstract: A substrate unit includes a circuit board, a connector portion installed at the front end portion of the upper side of the circuit board, a busbar connected to the circuit board and fixed to the lower side of the circuit board, a bottom portion including a recessed portion overlapping the front end portion of the circuit board and arranged on the lower side of the busbar, and a bonding layer fixing the busbar to the bottom portion. The busbar includes a non-bonding region that faces the recessed portion. A bonding region includes the bonding layer surrounding three sides other than a front side, namely a left side, a right side, and a rear side, of the non-bonding region. Notches are located on a left side and a right side of the front end portion and overlap extension lines of boundary between the non-bonding and the bonding region.

Abstract: Provided is a substrate unit configured to improve heat dissipation efficiency while preventing workability from degrading at the time of assembly. A substrate unit includes: a substrate that has one surface on having a conductive pattern, and includes an opening; a conductive member that includes a main portion is fixed to the other surface of the substrate, and at least one terminal of an electronic component is electrically connected via the opening; and a heat dissipation member is fixed to a surface of the conductive member opposite a substrate side surface thereof, wherein the conductive member is provided with an extension portion that extends from the main portion of the conductive member and to which an external device is to be electrically connected, the extension portion intersecting a plane that extends along the heat dissipation member.

Abstract: A switching board includes: a control circuit board that has, on a first surface thereof, a control circuit, a connection circuit, a first mounting window, and a second mounting window; a circuit structure including an input bus bar and an output bus bar are arranged on a second surface of the control circuit board; and a first and second semiconductor switching element. The first semiconductor switching element is arranged inside the first mounting window. The drain terminal, the source terminal, and the gate terminal of the first semiconductor switching element are connected respectively to the input bus bar, the connection circuit, and the control circuit. The second semiconductor switching element is arranged inside the second mounting window. The drain terminal, the source terminal, and the gate terminal of the second semiconductor switching element are connected respectively to the output bus bar, the connection circuit, and the control circuit.

Abstract: A switching board is provided with a control circuit board including a control circuit, first mounting windows and second mounting windows, a circuit constituent including an input busbar, an output busbar and a connection busbar arranged on one surface of the control circuit board, and first and second semiconductor switching elements. The first semiconductor switching elements are arranged inside the first mounting windows and have drain terminals connected to the input busbar, source terminals connected to the connection busbar and gate terminals connected to the control circuit. The second semiconductor switching elements are arranged inside the second mounting windows and have drain terminals connected to the output busbar, source terminals connected to the connection busbar and gate terminals connected to the control circuit.

Abstract: Provided is a substrate unit that has a simple structure and is able to prevent water that has entered the inside from reaching a mounting surface of the substrate. The substrate unit includes: a substrate, a first casing member that supports the substrate, and a second casing member that is integrated into one piece with the first casing member and is provided on a mounting surface side of the substrate, wherein the second casing member is provided with a protruding portion that protrudes into a housing space that is defined by the first casing member and the second casing member and houses the substrate, and intersects a plane that extends along the mounting surface of the substrate.

Abstract: Provided is a substrate unit configured to improve heat dissipation efficiency while preventing workability from degrading at the time of assembly. A substrate unit includes: a substrate that has one surface on having a conductive pattern, and includes an opening; a conductive member that includes a main portion is fixed to the other surface of the substrate, and at least one terminal of an electronic component is electrically connected via the opening; and a heat dissipation member is fixed to a surface of the conductive member opposite a substrate side surface thereof, wherein the conductive member is provided with an extension portion that extends from the main portion of the conductive member and to which an external device is to be electrically connected, the extension portion intersecting a plane that extends along the heat dissipation member.

Abstract: Provided is a substrate unit that has an excellent heat dissipation capability. A substrate unit includes: a substrate having a conductive pattern formed on one surface thereof, the substrate being provided with an opening; a conductive member that includes a main portion that is fixed to the other surface of the substrate, and to which at least one terminal of an electronic component is electrically connected via the opening that is formed in the substrate; and a heat dissipation member with which an extension portion that extends from the main portion of the conductive member is in contact.

Abstract: A case is provided with a drainage channel that smoothly drains water while also being able to suppress the intrusion of water into a housing space. The case includes a first case body in which a channel extending from a region serving as the housing space is formed. The channel includes a first channel portion having one end side connected to a first outlet and another end side connected to a second outlet, and a second channel portion connects the first channel portion and the housing space. Out of the opening edges of the second channel portion that face the first channel portion, a second-side opening edge, which is the edge on the second outlet side of the first channel portion, is located nearer to the housing space than a first-side opening edge, which is the edge on the first outlet side of the first channel portion, is.

Abstract: The present invention provides a case having a simple structure capable of suppressing the intrusion of water through a drainage channel. The case includes a first case body in which a channel that extends from a region serving as a first space is formed, and a second case body that is integrated with the first case body. A slit is formed in an outer wall portion of the second case body, and the channel formed in the first case body is continuous with at least a portion of the slit formed in the second case body. A lock piece portion for integration with the first case is formed on the outer wall portion of the second case body, and the lock piece portion has a cantilevered shape due to being defined by the slit.