Abstract: A powder supply unit is disclosed, which includes a housing accommodating powder, a rotating member rotatably provided in the housing, a sheet-like transporting member fixed to the rotating member and having a free end at a side different from the fixed portion side and slidingly moved on an inner wall of the housing by the rotation of the rotating member to transport the powder in the axial direction of the rotating member, and a powder supplying hole provided on the downstream side in the transporting direction of the powder in the housing. The powder supply unit is constructed such that the transporting member, when not in use, is in a hold state in which the free end side thereof is bent in a direction opposite to the direction of bending when in use.

Abstract: A curable composition having a low viscosity and good workability which can give a mechanically strong cured product is provided. A curable composition comprising a curable resin component containing a polymer (A) having a polyoxyalkylene chain, a reactive silicon group and a urethane bond in the molecule and at least one silicate mineral (X) selected from the group consisting of a silicate mineral (B) represented by Al2O3.2SiO2.nH2O (wherein n is from 0 to 4) and a calcined silicate mineral (C) obtained by calcining the silicate mineral at 350 to 1,200° C.

Abstract: A probe polishing method is provided for polishing probes by brining a polishing member into slide-contact with probes through a mounting table having thereon the polishing member transferred from a first receiving part. The probe polishing method includes transferring the polishing member from the first receiving part to the mounting table; detecting a presence of foreign materials on a top surface of the polishing member mounted on the mounting table; transferring the polishing member from the mounting table to a second receiving part when the foreign materials are detected on the top surface of the polishing member; removing the foreign materials from the polishing member in the second receiving part; and transferring the polishing member from which the foreign materials are removed from the second receiving part to the first receiving part.

Abstract: An object is to provide a main wing whose weight can be reduced, taking into consideration the stress concentration at circumferential edges of access holes. A main wing (1) on which a tensile load is exerted in a longitudinal direction includes a holed structural member that is a composite material made of fiber reinforced plastic which extends in the longitudinal direction and in which access holes (5) are formed and that serves as a center portion (3b); and a front portion (3a) and a rear portion (3c) that are composite materials made of fiber reinforced plastic which extend in the longitudinal direction of the main wing 1 and which are connected to side portions of the center portion (3b). The tensile rigidity of the center portion (3b) in the longitudinal direction is set to be lower than the tensile rigidity of the front portion (3a) and the rear portion (3c) in the longitudinal direction.

Abstract: A semiconductor device includes: a semiconductor base; a hetero semiconductor region which is in contact with the semiconductor base and which has a band gap different from that of the semiconductor base; a first electrode connected to the hetero semiconductor region; and a second electrode forming an ohmic contact to the semiconductor base. The hetero semiconductor region includes a laminated hetero semiconductor region formed by laminating a plurality of semiconductor layers in which crystal alignment is discontinuous at a boundary between at least two layers.

Abstract: Image data stored in a server can be easily removed therefrom by use of a communication terminal. There are included a communication terminal for transmitting an acquired image data and a server for storing the image data received from the communication terminal. The communication terminal transmits an acquired image data to the server, displays abbreviated data which allows the image data to be identified and the data amount of which is smaller than the data amount of the image data. And, when having accepted, from the exterior, a removal of the image data instructed by designating the displayed abbreviated data, the communication terminal requests the server to remove the image data corresponding to the abbreviated data. The server stores, into a database provided therein, the image data received from the communication terminal. And, when having been requested, by the communication terminal, to remove the image data, the server removes the image data from the database.

Abstract: An aspect of the present invention provides a semiconductor device that includes a first conductivity type semiconductor body, a source region in contact with the semiconductor body, whose bandgap is different from that of the semiconductor body, and which formed heterojunction with the semiconductor body, a gate insulating film in contact with a portion of junction between the source region and the semiconductor body, a gate electrode in contact with the gate insulating film, a source electrode, a low resistance region in contact with the source electrode and the source region, and connected ohmically with the source electrode, and a drain electrode connected ohmically with the semiconductor body.

Abstract: Provided is an immunoassay method whereby all Haemophilus influenzae strains can be simultaneously detected at a high sensitivity. Specifically provided is a method for immunoassaying all Haemophilus influenzae strains characterized in that an antibody that recognizes P4 antigen or P6 antigen of influenza viruses is used.

Abstract: According to one embodiment, a magnetic disk includes a disk, a controller and an indicator module. The disk includes a plurality of data sectors. The controller is configured to control data rewrite for reading a first data block stored in the disk and writing a second data block corresponding to the read first data block to a write destination on the disk. The indicator module is configured to embed an indicator indicative of an attribute relating to data rewrite in each sector data in the second data block written to the write destination when the each sector data is written to the write destination.

Abstract: According to one embodiment, a data write control apparatus includes a magnetic disk, a write controller, and a retry controller. The magnetic disk includes a track in which data is recorded in sector unit. The write controller is configured to execute control to write a sector data block to a predetermined sector in the track. The retry controller is configured to execute control to retry a write process to a predetermined number of sectors to which data has been written and which include a first sector, and to manage the number of retries performed on each sector.

Abstract: According to one embodiment, a recording medium controller includes a recording medium, an input module, a reading module, and a writing module. The recording medium includes a write area and an escape area. The write area includes track groups. Each of the track groups is a unit for writing data and includes tracks. The input module receives a write command for data. The reading module reads data stored in the escape area and data from a first track group of the track groups. The writing module writes data received for the write command to the escape area, and writes merged data obtained by merging the data read from the escape area and the data read from the first track group to each track of a second track group of the track groups by using a shingle recording technique in which adjacent tracks are partly overlapped with each other.

Abstract: Methods of manufacturing a semiconductor device including a semiconductor substrate and a hetero semiconductor region including a semiconductor material having a band gap different from that of the semiconductor substrate and contacting a portion of a first surface of the semiconductor substrate are taught herein, as are the resulting devices. The method comprises depositing a first insulating film on exposed portions of the first surface of the semiconductor substrate and on exposed surfaces of the hetero semiconductor material and forming a second insulating film between the first insulating film and facing surfaces of the semiconductor substrate and the hetero semiconductor region by performing a thermal treatment in an oxidizing atmosphere.

Abstract: A fixing device by fixing an image on a recording material at a nip portion, includes: an air blower which blows air sent by a fan on the neighborhood of an exit of the nip portion; a pressure contact and separation switching section which switches from a separated state in which a pressure member is separated from a fixing member to a pressure contact state in which the pressure member is in contact with the heating member at a moment that is earlier by a predetermined period of time than a time when a leading edge of the recording material arrives at the nip portion; and a controller which controls the fan to start its rotation within a first time period between a time when a changeover from the separated state to the pressure contact state is started and a time when the leading edge of the recording material arrives at the nip portion.

Abstract: An aspect of the present invention provides a semiconductor device that includes a first conductivity type semiconductor body, a source region in contact with the semiconductor body, whose bandgap is different from that of the semiconductor body, and which formed heterojunction with the semiconductor body, a gate insulating film in contact with a portion of junction between the source region and the semiconductor body, a gate electrode in contact with the gate insulating film, a source electrode, a low resistance region in contact with the source electrode and the source region, and connected ohmically with the source electrode, and a drain electrode connected ohmically with the semiconductor body.

Abstract: A division line depicted on a road is detected. A beam-formed electromagnetic wave is repetitively at intervals transmitted toward the road viewed from a vehicle to scan in the vehicle width direction. Each beam-formed electromagnetic wave is radiated to a radiation area on the road, and the radiation areas made by transmitting the beam-formed electromagnetic wave a plurality of times virtually produces a scan area on the road. Every beam-formed electromagnetic wave, distance data indicative of a distance between a division line on the road and the vehicle is measured based on information about a reflected electromagnetic wave. The distance data measured is received to detect the division line based on characteristics of changes in a sequence of the distance data produced by mapping the received distance data in a scanning order of the beam-formed electromagnetic wave.

Abstract: An image-forming apparatus includes: image-forming units arranged along a direction inclined at an acute angle relative to a horizontal direction, each of the image-forming units forming an image with developer; developer-containing units positioned above the image-forming units and arranged along the horizontal direction or along a direction inclined relative to the horizontal direction at an angle smaller than the acute angle; and developer conveyance paths that connect the image-forming units to respective developer-containing units, each developer conveyance path having a tubular passage that defines a space through which the developer contained in the developer-containing unit is conveyed to the image-forming unit, wherein the tubular passage of a developer conveyance path connected to an image-forming unit located at a position higher than that of another image-forming unit has a vertically extending portion shorter than that of the tubular passage of a developer conveyance path connected to the another

Abstract: A method for easily making a barrier for preventing overflow of interlayer insulating resin in a cable-fitted multi-layer FPC that uses bumps for connecting the layers, and a barrier having a structure that can easily be made. In a method for manufacturing a multi-layer flexible printed circuit board including a circuit section, a cable section that is connected to the circuit section, the circuit section having a multi-layer structure of insulating resin arranged between multiple layers of metal foil, a barrier, that stops the insulating resin from overflowing, has a two-row configuration and is formed on a metal foil that constitutes an outermost conductive layer in the multi-layer flexible printed circuit board, and the metal foil and the insulating resin are laminated to form the multi-layer flexible printed circuit board.

Abstract: A semiconductor substrate made of a semiconductor material is prepared, and a hetero semiconductor region is formed on the semiconductor substrate to form a heterojunction in an interface between the hetero semiconductor region and the semiconductor substrate. The hetero semiconductor region is made of a semiconductor material having a bandgap different from that of the semiconductor material, and a part of the hetero semiconductor region includes a film thickness control portion whose film thickness is thinner than that of the other part thereof. By oxidizing the hetero semiconductor region with a thickness equal to the film thickness of the film thickness control portion, a gate insulating film adjacent to the heterojunction is formed. A gate electrode is formed on the gate insulating film. This makes it possible to manufacture a semiconductor device including the gate insulating film with a lower ON resistance, and with a higher insulating characteristic and reliability.

Abstract: Disclosed is a probing method including, when the probes are configured to make contact with a chip row including four chips continuously arranged in an oblique direction so that the probe card test four chips at a time, finding a first reference oblique chip row extending in the oblique direction and containing a center chip positioned at the center of the wafer and a plurality of first additional oblique chip rows arranged in parallel with the first reference oblique chip row at an upper side of the first reference oblique chip row, and setting contact positions between the probes and the first oblique chip rows wherein the contact positions are positions of the probes obtained by shifting the probes; setting contact positions between the probes and the second oblique chip rows in an opposite direction to a first step; and setting a plurality of index group and test order.

Abstract: A semiconductor substrate made of a semiconductor material is prepared, and a hetero semiconductor region is formed on the semiconductor substrate to form a heterojunction in an interface between the hetero semiconductor region and the semiconductor substrate. The hetero semiconductor region is made of a semiconductor material having a bandgap different from that of the semiconductor material, and a part of the hetero semiconductor region includes a film thickness control portion whose film thickness is thinner than that of the other part thereof. By oxidizing the hetero semiconductor region with a thickness equal to the film thickness of the film thickness control portion, a gate insulating film adjacent to the heterojunction is formed. A gate electrode is formed on the gate insulating film. This makes it possible to manufacture a semiconductor device including the gate insulating film with a lower ON resistance, and with a higher insulating characteristic and reliability.