Patents by Inventor Hidekazu Hirose

Hidekazu Hirose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12018128
    Abstract: A particle-dispersed polyimide precursor solution contains a polyimide precursor having a unit represented by the following formula (I), particles, and a solvent, in which the particle-dispersed polyimide precursor solution satisfies both the following conditions (1) and (2), (in the formula (I), A represents a tetravalent organic group, and B represents a divalent organic group represented by any of the following formulas (B1) to (B4)), (in the formulas (B1) to (B4), Ar1, Ar10, and Ar11 each independently represent a trivalent aromatic group which may have a substituent, Ar2, Ar4, Ar5, Ar7 and Ar8 each independently represent a divalent aromatic group which may have a substituent, Ar3 and Ar6 each independently represent a tetravalent aromatic group which may have a substituent or a group represented by the following formula (II), Ar9 represents a divalent aromatic group which may have a substituent or a group represented by the following formula (III), X1 to X7 each independently represent N
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: June 25, 2024
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Tomoya Sasaki, Hidekazu Hirose, Kosaku Yoshimura, Yasunobu Kashima, Hajime Sugahara, Kosuke Nakada, Tomoyo Okubo
  • Patent number: 11958939
    Abstract: A polyimide precursor solution contains: an aqueous solvent containing water; particles; and a polyimide precursor, wherein the polyimide precursor has a high molecular weight region A containing a high molecular weight side maximum value and a low molecular weight region B containing a low molecular weight side maximum value in an elution curve obtained by gel permeation chromatography, a weight average molecular weight in the high molecular weight region A is 50,000 or more, a weight average molecular weight in the low molecular weight region B is 10,000 or more and 30,000 or less, and a value of a/(a+b) is 0.60 or more and 0.98 or less in which a represents an area of the high molecular weight region A and b represents an area of the low molecular weight region B.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: April 16, 2024
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Kosuke Nakada, Shigeru Seitoku, Takeshi Iwanaga, Tomoyo Okubo, Hajime Sugahara, Hidekazu Hirose
  • Publication number: 20240010802
    Abstract: A porous polyimide film has a ratio of a cross-sectional average micro pore diameter (?m) to a first surface micro pore diameter (?m) on one surface (the cross-sectional average micro pore diameter/the first surface micro pore diameter) of equal to or more than 5 and equal to or less than 10.
    Type: Application
    Filed: January 19, 2023
    Publication date: January 11, 2024
    Applicant: FUJIFILM Business Innovation Corp.
    Inventors: Hajime SUGAHARA, Hidekazu Hirose, Kosaku Yoshimura, Shigeru Seitoku, Kosuke Nakada, Satoshi Yoshida
  • Patent number: 11787942
    Abstract: A polyimide precursor solution includes: a polyimide precursor; polyester resin particles containing a polyester resin and having a volume average particle diameter of from 3 ?m to 50 ?m inclusive and an average circularity of 0.970 or more; and a solvent.
    Type: Grant
    Filed: February 3, 2022
    Date of Patent: October 17, 2023
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Shigeru Seitoku, Kosuke Nakada, Takeshi Iwanaga, Hidekazu Hirose
  • Publication number: 20230192955
    Abstract: A polyimide precursor solution includes a polyimide precursor that is a polymer of an aromatic tetracarboxylic dianhydride and an aromatic diamine compound, resin particles, an aqueous solvent containing water, and an amine compound having a boiling point of equal to or higher than 250° C. and equal to or lower than 300° C., in which a ratio of a volume of the resin particles to a volume of the amine compound (volume of resin particles/volume of amine compound) is equal to or more than 0.22 and equal to or less than 0.61.
    Type: Application
    Filed: May 29, 2022
    Publication date: June 22, 2023
    Applicant: FUJIFILM Business Innovation Corp.
    Inventors: Kosuke NAKADA, Hidekazu HIROSE, Kosaku YOSHIMURA, Shigeru SEITOKU, Hajime SUGAHARA, Satoshi YOSHIDA
  • Patent number: 11680140
    Abstract: A particle-dispersed polyimide precursor solution contains: a polyimide precursor consisting of a polymer of a tetracarboxylic dianhydride and a diamine containing a fluorene-based diamine having a fluorene skeleton; particles; and an aqueous solvent containing water.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: June 20, 2023
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Hajime Sugahara, Hidekazu Hirose, Kosaku Yoshimura, Tomoya Sasaki, Yasunobu Kashima, Kosuke Nakada, Tomoyo Okubo
  • Patent number: 11680156
    Abstract: A polyimide precursor-containing aqueous composition contains at least one polymer material selected from the group consisting of a water-insoluble fibrous organic substance and a polyalkylene oxide having a viscosity-average molecular weight of 5 million or more, a polyimide precursor, particles, and water.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: June 20, 2023
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Yasunobu Kashima, Kosaku Yoshimura, Tomoya Sasaki, Kosuke Nakada, Hidekazu Hirose
  • Patent number: 11673999
    Abstract: A polyimide precursor solution includes: a polyimide precursor; a resin particle having 55% by weight or more of a structural unit derived from a styrene derivative; and a mixed solvent containing a first organic solvent (S1) and a second organic solvent (S2), wherein the polyimide precursor solution satisfies the following conditions (1) to (4), condition (1): a weight ratio (S1/S2) of the first organic solvent (S1) to the second organic solvent (S2) is from 50/50 to 90/10, condition (2): a HSP distance between the first organic solvent (S1) and the resin particle is 11 or more and less than 16, condition (3): a HSP distance between the second organic solvent (S2) and the resin particle is 16 or more, and condition (4): a HSP distance between the mixed solvent and the polyimide precursor is 12 or less.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: June 13, 2023
    Assignee: FUJIFILM BUSINESS INNOVATION CORP.
    Inventors: Tomoya Sasaki, Hidekazu Hirose
  • Publication number: 20230077397
    Abstract: A polyimide precursor solution includes an aqueous solvent including water, a polyimide precursor, resin particles, and an ionization agent X having a boiling point of 100° C. or more and 130° C. or less and an ionization agent Y having a boiling point of 250° C. or more and 300° C. or less.
    Type: Application
    Filed: March 23, 2022
    Publication date: March 16, 2023
    Applicant: FUJIFILM Business Innovation Corp.
    Inventors: Takeshi IWANAGA, Shigeru SEITOKU, Kosuke NAKADA, Hidekazu HIROSE
  • Publication number: 20230080755
    Abstract: A polyimide precursor solution includes: a polyimide precursor; polyester resin particles containing a polyester resin and having a volume average particle diameter of from 3 ?m to 50 ?m inclusive and an average circularity of 0.970 or more; and a solvent.
    Type: Application
    Filed: February 3, 2022
    Publication date: March 16, 2023
    Applicant: FUJIFILM Business Innovation Corp.
    Inventors: Shigeru SEITOKU, Kosuke NAKADA, Takeshi IWANAGA, Hidekazu HIROSE
  • Publication number: 20230076583
    Abstract: A polyimide precursor solution includes: a polyimide precursor that is a polymer of a tetracarboxylic dianhydride and a diamine compound; particles; a solvent; and a compound having at least four carboxy groups per molecule.
    Type: Application
    Filed: February 3, 2022
    Publication date: March 9, 2023
    Applicant: FUJIFILM Business Innovation Corp.
    Inventors: Kosuke NAKADA, Shigeru SEITOKU, Takeshi IWANAGA, Hidekazu HIROSE
  • Patent number: 11584837
    Abstract: There is provided a porous polyimide film in which the pore distribution width A represented by the following formula is 1.15 or less, the average pore diameter is within a range of 0.50 ?m to 3.0 ?m, and the air permeation speed is 30 seconds or less: A=(D84/D16)1/2 wherein D16 is the pore diameter at 16% cumulation from the small diameter side of pores, and D84 is the pore diameter at 84% cumulation from the small diameter side of pores.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: February 21, 2023
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Yasunobu Kashima, Kosaku Yoshimura, Hajime Sugahara, Hidekazu Hirose
  • Patent number: 11495863
    Abstract: A porous polyimide film has plural pores, in which an average flattening of the plural pores is within a range of 0.1 to 0.7, a coefficient of variation of a distance between adjacent pores is within a range of 0.10 to 0.40, and a front surface and aback surface communicate with each other through the plural pores.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: November 8, 2022
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Kosuke Nakada, Hidekazu Hirose, Yasunobu Kashima, Kosaku Yoshimura, Tomoya Sasaki
  • Publication number: 20220306895
    Abstract: A polyimide precursor solution contains a polyimide precursor, particles, and a water-based solvent that contains an amine compound (A), an organic solvent (B) other than the amine compound (A) and amide compounds, and water, in which a boiling point of the organic solvent (B) is higher than a boiling point of the amine compound (A), and is 200° C. or higher and 300° C. or lower.
    Type: Application
    Filed: March 21, 2022
    Publication date: September 29, 2022
    Applicant: FUJIFILM BUSINESS INNOVATION CORP.
    Inventors: Shigeru SEITOKU, Kosaku YOSHIMURA, Hidekazu HIROSE, Hajime SUGAHARA, Kosuke NAKADA, Satoshi YOSHIDA
  • Publication number: 20220306806
    Abstract: A polyimide precursor film contains a polyimide precursor, in which a total content of a solvent containing water and a solvent other than water in the polyimide precursor film is 5 mass % or more and 40 mass % or less, and a mass ratio of water to the solvent other than water in the polyimide precursor film is 0 or more and 2.5 or less.
    Type: Application
    Filed: August 3, 2021
    Publication date: September 29, 2022
    Applicant: FUJIFILM Business Innovation Corp.
    Inventors: Tomoyo OKUBO, Takeshi IWANAGA, Hidekazu HIROSE, Kosuke NAKADA, Hajime SUGAHARA, Shigeru SEITOKU
  • Publication number: 20220305739
    Abstract: A polyimide porous film includes: a polyimide porous film body; and at least one of resin particles and a resin porous film, the at least one of the resin particles and the resin porous film adhering to one surface or both surfaces of the polyimide porous film body, and containing a fluorine-based resin or containing a fluorine-based resin and an acrylic resin.
    Type: Application
    Filed: July 26, 2021
    Publication date: September 29, 2022
    Applicant: FUJIFILM BUSINESS INNOVATION CORP.
    Inventors: Takeshi IWANAGA, Shigeru SEITOKU, Kosuke NAKADA, Tomoyo OKUBO, Hidekazu HIROSE
  • Publication number: 20220267527
    Abstract: A polyimide precursor solution contains: an aqueous solvent containing water; particles; and a polyimide precursor, wherein the polyimide precursor has a high molecular weight region A containing a high molecular weight side maximum value and a low molecular weight region B containing a low molecular weight side maximum value in an elution curve obtained by gel permeation chromatography, a weight average molecular weight in the high molecular weight region A is 50,000 or more, a weight average molecular weight in the low molecular weight region B is 10,000 or more and 30,000 or less, and a value of a/(a+b) is 0.60 or more and 0.98 or less in which a represents an area of the high molecular weight region A and b represents an area of the low molecular weight region B.
    Type: Application
    Filed: August 16, 2021
    Publication date: August 25, 2022
    Applicant: FUJIFILM Business Innovation Corp.
    Inventors: Kosuke NAKADA, Shigeru SEITOKU, Takeshi IWANAGA, Tomoyo OKUBO, Hajime SUGAHARA, Hidekazu HIROSE
  • Publication number: 20220119596
    Abstract: A particle-dispersed polyimide precursor solution contains a polyimide precursor having a unit represented by the following formula (I), particles, and a solvent, in which the particle-dispersed polyimide precursor solution satisfies both the following conditions (1) and (2), (in the formula (I), A represents a tetravalent organic group, and B represents a divalent organic group represented by any of the following formulas (B1) to (B4)), (in the formulas (B1) to (B4), Ar1, Ar10, and Ar11 each independently represent a trivalent aromatic group which may have a substituent, Ar2, Ar4, Ar5, Ar7 and Ar8 each independently represent a divalent aromatic group which may have a substituent, Ar3 and Ar6 each independently represent a tetravalent aromatic group which may have a substituent or a group represented by the following formula (II), Ar9 represents a divalent aromatic group which may have a substituent or a group represented by the following formula (III), X1 to X7 each independently represent N
    Type: Application
    Filed: July 20, 2021
    Publication date: April 21, 2022
    Applicant: FUJIFILM Business Innovation Corp.
    Inventors: Tomoya SASAKI, Hidekazu HIROSE, Kosaku YOSHIMURA, Yasunobu KASHIMA, Hajime SUGAHARA, Kosuke NAKADA, Tomoyo OKUBO
  • Publication number: 20220089829
    Abstract: A polyimide precursor solution, includes: a polyimide precursor; resin particles having a volume average particle diameter of 5 nm or more and 100 nm or less, and having a volume particle size distribution wherein a ratio of a volume frequency of resin particles having a particle diameter of 150 nm or more to a volume frequency of all of the resin particles in the polyimide precursor solution is 5% or less; and an aqueous solvent containing water.
    Type: Application
    Filed: December 21, 2020
    Publication date: March 24, 2022
    Applicant: FUJIFILM BUSINESS INNOVATION CORP.
    Inventors: Tomoyo OKUBO, Shunsuke NOZAKI, Tomoya SASAKI, Hidekazu HIROSE
  • Publication number: 20220073743
    Abstract: A polyimide precursor solution contains a polyimide precursor, resin particles having a core and a coating resin layer, the coating resin layer contains a melamine resin, and a solvent.
    Type: Application
    Filed: May 21, 2021
    Publication date: March 10, 2022
    Applicant: FUJIFILM Business Innovation Corp.
    Inventors: Mieko SEKI, Hidekazu HIROSE