Patents by Inventor Hidekazu Yoshihara

Hidekazu Yoshihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10584983
    Abstract: The present invention aims at providing a cover structure of a tactile sensor and a tactile sensor that can secure sufficient adhesion between a sensor body and a covering layer without providing an adhesive layer and have no possibility of causing a sensor to make detection error due to the covering layer formed thereon. A cover structure of a tactile sensor according to the present invention includes a sensor body 2 and a covering layer 3 made of elastic body molded on the sensor body 2. The covering layer 3 includes at least two layers of an outer layer 32 disposed as the outermost layer and an inner layer 31 disposed to come in contact with the sensor body 2 and having a higher adhesiveness and a lower hardness than those of the outer layer 32, and is integrally molded with the sensor body 2 by the cast molding.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: March 10, 2020
    Assignees: NOK CORPORATION, NIPPON MEKTRON, LTD.
    Inventors: Yuki Murota, Hiroshi Umebayashi, Toru Uda, Hidekazu Yoshihara, Taisuke Kimura, Keizo Toyama
  • Publication number: 20170343394
    Abstract: The present invention aims at providing a cover structure of a tactile sensor and a tactile sensor that can secure sufficient adhesion between a sensor body and a covering layer without providing an adhesive layer and have no possibility of causing a sensor to make detection error due to the covering layer formed thereon. A cover structure of a tactile sensor according to the present invention includes a sensor body 2 and a covering layer 3 made of elastic body molded on the sensor body 2. The covering layer 3 includes at least two layers of an outer layer 32 disposed as the outermost layer and an inner layer 31 disposed to come in contact with the sensor body 2 and having a higher adhesiveness and a lower hardness than those of the outer layer 32, and is integrally molded with the sensor body 2 by the cast molding.
    Type: Application
    Filed: January 29, 2016
    Publication date: November 30, 2017
    Applicants: NOK Corporation, Nippon Mektron, Ltd.
    Inventors: Yuki MUROTA, Hiroshi UMEBAYASHI, Toru UDA, Hidekazu YOSHIHARA, Taisuke KIMURA, Keizo TOYAMA
  • Patent number: 9635751
    Abstract: Provided is a highly reliable flexible circuit body in which a flexible wiring board is prevented from wear caused by rubbing, and a method for production of the flexible circuit body. A flexible circuit body includes a flexible wiring board having an insulating film, a wiring layer formed on the insulating film, and an insulating layer formed on the wiring layer. The flexible wiring board is coated with a thermoplastic elastomer.
    Type: Grant
    Filed: March 6, 2012
    Date of Patent: April 25, 2017
    Assignee: Nippon Mektron, Ltd.
    Inventors: Hidekazu Yoshihara, Akihiko Matsumaru, Taisuke Kimura, Atsushi Kajiya
  • Patent number: 9155193
    Abstract: A flexible circuit board and a method for production thereof in which in cases where elastic wiring in movable parts is required, the wiring can be made to expand and contract with a simple arrangement, and the circuit board is excellent in weight and size reduction, and breaking or disconnection and exfoliation of a wiring layer do not take place easily, even in cases where the circuit board is deformed in a repeated manner. The flexible circuit board which has an insulating film made of a thermoplastic resin, a wiring layer formed on the insulating film, and an insulating layer made of a thermoplastic resin and formed on the wiring layer. A spiral part shaped into a spiral shape is provided in at least a part of the flexible circuit board, and the flexible circuit board is constructed to be expandable and contractable, and/or torsionally deformable in the spiral part.
    Type: Grant
    Filed: December 24, 2010
    Date of Patent: October 6, 2015
    Assignee: Nippon Mektron, Ltd.
    Inventors: Atsushi Kajiya, Hidekazu Yoshihara
  • Patent number: 9024198
    Abstract: A flexible circuit board with high connection reliability and a manufacturing method thereof, wherein the flexible circuit board has a bent section formed thereon, can be deformed flexibly, and wherein a wiring layer will not be peeled off or ruptured even when deformation is repeated onto the flexible circuit board, heat is radiated from electronic parts, or minute wiring is formed on the flexible circuit board. The flexible circuit board is provided with an insulating film comprised of liquid crystal polymer, a wiring layer formed upon the insulating film, and an insulating layer comprised of liquid crystal polymer formed upon the wiring layer. The flexible circuit board has a bent section with a radius of curvature of R (mm) formed on at least one location thereof, and is made to be deformable in a state with the radius of curvature of the bent section maintained at R (mm).
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: May 5, 2015
    Assignee: Nippon Mektron, Ltd.
    Inventors: Atsushi Kajiya, Hidekazu Yoshihara, Toru Itani
  • Patent number: 9024184
    Abstract: A sealing structure to seal a housing for electronic equipment such as a cellular phone, and which provides reliable sealing for the housing, and at the same time can attain to improve design with a simple construction. A sealing structure, which seals a housing, is provided with a seal member mounted on the housing, a substrate integrally molded with the seal member, and having at least a part thereof lying in the inside of the housing in a state where the seal member is mounted on the housing, and a light source element arranged on the substrate board, wherein the seal member is transparent or translucent, and it is constructed such that the light source element is arranged in a region of hermetic sealing formed by the seal member, whereby at least a part of the seal member emits light by the light radiated from the light source element.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: May 5, 2015
    Assignee: Nippon Mektron, Ltd.
    Inventors: Atsushi Kajiya, Hidekazu Yoshihara
  • Publication number: 20140124257
    Abstract: Provided is a highly reliable flexible circuit body in which a flexible wiring board is prevented from wear caused by rubbing, and a method for production of the flexible circuit body. A flexible circuit body includes a flexible wiring board having an insulating film, a wiring layer formed on the insulating film, and an insulating layer formed on the wiring layer. The flexible wiring board is coated with a thermoplastic elastomer.
    Type: Application
    Filed: March 6, 2012
    Publication date: May 8, 2014
    Applicant: Nippon Mektron, Ltd.
    Inventors: Hidekazu Yoshihara, Akihiko Matsumaru, Taisuke Kimura, Atsushi Kajiya
  • Publication number: 20140102771
    Abstract: A flexible circuit board with high connection reliability and a manufacturing method thereof, wherein the flexible circuit board has a bent section formed thereon, can be deformed flexibly, and wherein a wiring layer will not be peeled off or ruptured even when deformation is repeated onto the flexible circuit board, heat is radiated from electronic parts, or minute wiring is formed on the flexible circuit board. The flexible circuit board is provided with an insulating film comprised of liquid crystal polymer, a wiring layer formed upon the insulating film, and an insulating layer comprised of liquid crystal polymer formed upon the wiring layer. The flexible circuit board has a bent section with a radius of curvature of R (mm) formed on at least one location thereof, and is made to be deformable in a state with the radius of curvature of the bent section maintained at R (mm).
    Type: Application
    Filed: July 16, 2010
    Publication date: April 17, 2014
    Applicant: Nippon Mektron, Ltd.
    Inventors: Atsushi Kajiya, Hidekazu Yoshihara, Toru Itani
  • Patent number: 8562177
    Abstract: A lighting device which can illuminate a large range with a simple configuration, and in which the LEDs or the mounting portions thereof are not likely to be damaged even when vibrations occur as a light source device which uses an LED as a light source, and a manufacturing method thereof are provided. The present invention includes a deformable flexible circuit board having an insulating film made of thermoplastic resin, a wiring layer formed on the insulating film, and an insulating layer formed on the wiring layer and made of thermoplastic resin, and in which a bent portion with a curvature radius “R” (mm) is formed at at least one position, and a plurality of LEDs mounted on the flexible circuit board.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: October 22, 2013
    Assignee: Nippon Mektron, Ltd.
    Inventors: Atsushi Kajiya, Hidekazu Yoshihara, Toru Itani
  • Patent number: 8545056
    Abstract: A lighting unit, e.g. an LED bulb or a straight LED luminaire, which illuminates a wide range and is configured with low cost. In a light-emitting diode lamp, a board assembly is disposed in a lamp main body, and light-emitting diodes are attached to the board assembly. The board assembly comprises a plurality of flexible printed circuit boards. Each flexible printed circuit board includes a base in the form of a flat plate, respective connections to a power supply portion of the light-emitting diode lamp are provided at two ends of the base, and the base is bent at a plurality of points of a middle portion to form a top surface portion and side surface portions. The flexible printed circuit boards are three-dimensionally assembled such that the top surface portions cross each other and such that one of the top surface portions lies on top of another.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: October 1, 2013
    Assignee: Nippon Mektron, Ltd.
    Inventors: Atsushi Kajiya, Hidekazu Yoshihara
  • Publication number: 20130194735
    Abstract: A sealing structure to seal a housing for electronic equipment such as a cellular phone, and which provides reliable sealing for the housing, and at the same time can attain to improve design with a simple construction. A sealing structure, which seals a housing, is provided with a seal member mounted on the housing, a substrate integrally molded with the seal member, and having at least a part thereof lying in the inside of the housing in a state where the seal member is mounted on the housing, and a light source element arranged on the substrate board, wherein the seal member is transparent or translucent, and it is constructed such that the light source element is arranged in a region of hermetic sealing formed by the seal member, whereby at least a part of the seal member emits light by the light radiated from the light source element.
    Type: Application
    Filed: July 28, 2011
    Publication date: August 1, 2013
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Atsushi Kajiya, Hidekazu Yoshihara
  • Publication number: 20130056248
    Abstract: A flexible circuit board and a method for production thereof in which in cases where elastic wiring in movable parts is required, the wiring can be made to expand and contract with a simple arrangement, and the circuit board is excellent in weight and size reduction, and breaking or disconnection and exfoliation of a wiring layer do not take place easily, even in cases where the circuit board is deformed in a repeated manner. The flexible circuit board which has an insulating film made of a thermoplastic resin, a wiring layer formed on the insulating film, and an insulating layer made of a thermoplastic resin and formed on the wiring layer. A spiral part shaped into a spiral shape is provided in at least a part of the flexible circuit board, and the flexible circuit board is constructed to be expandable and contractable, and/or torsionally deformable in the spiral part.
    Type: Application
    Filed: December 24, 2010
    Publication date: March 7, 2013
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Atsushi Kajiya, Hidekazu Yoshihara
  • Publication number: 20130058824
    Abstract: Provided is a method for producing a decorative sintered metallic article and the same, used in jewelry goods, ornaments, clothing accessories, by combining a copper paste and a silver paste. The method comprises the steps of: producing a patterned piece by alternately arranging the copper paste containing an organic binder and water in 10 to 35 wt % and one or more kinds of copper powders selected from a copper powder and a copper alloy powder, and the silver paste similarly prepared to the copper paste; forming patterned pastes by drawing a pattern through deforming at least rows on the upper surface of the alternately arranged copper and silver pastes; drying the patterned pastes to produce a patterned piece; shaping a decorative object by processing the produced patterned piece; and firing the decorative object to produce a decorative sintered object.
    Type: Application
    Filed: November 4, 2010
    Publication date: March 7, 2013
    Applicant: AIDA CHEMICAL INDUSTRIES CO., LTD.
    Inventors: Masashi Hirama, Hidekazu Yoshihara, Toshie Ito
  • Publication number: 20120287614
    Abstract: A lighting unit, e.g. an LED bulb or a straight LED luminaire, which illuminates a wide range and is configured with low cost. In a light-emitting diode lamp, a board assembly is disposed in a lamp main body, and light-emitting diodes are attached to the board assembly. The board assembly comprises a plurality of flexible printed circuit boards. Each flexible printed circuit board includes a base in the form of a flat plate, respective connections to a power supply portion of the light-emitting diode lamp are provided at two ends of the base, and the base is bent at a plurality of points of a middle portion to form a top surface portion and side surface portions. The flexible printed circuit boards are three-dimensionally assembled such that the top surface portions cross each other and such that one of the top surface portions lies on top of another.
    Type: Application
    Filed: December 16, 2011
    Publication date: November 15, 2012
    Applicant: Nippon Mektron, Ltd.
    Inventors: Atsushi Kajiya, Hidekazu Yoshihara
  • Publication number: 20120281411
    Abstract: A lighting device which can illuminate a large range with a simple configuration, and in which the LEDs or the mounting portions thereof are not likely to be damaged even when vibrations occur as a light source device which uses an LED as a light source, and a manufacturing method thereof are provided. The present invention includes a deformable flexible circuit board having an insulating film made of thermoplastic resin, a wiring layer formed on the insulating film, and an insulating layer formed on the wiring layer and made of thermoplastic resin, and in which a bent portion with a curvature radius “R” (mm) is formed at at least one position, and a plurality of LEDs mounted on the flexible circuit board.
    Type: Application
    Filed: July 23, 2010
    Publication date: November 8, 2012
    Inventors: Atsushi Kajiya, Hidekazu Yoshihara, Toru Itani
  • Publication number: 20120107561
    Abstract: Provided are a method for producing a decorative metallic article with a wood grain metal pattern and the decorative metallic article with the wood grain metal pattern; the decorative metallic article comprising a sintered copper part produced by sintering a plastic copper containing clay compound, and a sintered silver part produced by sintering a plastic silver containing clay compound.
    Type: Application
    Filed: September 27, 2010
    Publication date: May 3, 2012
    Applicant: AIDA CHEMICAL INDUSTRIES CO., LTD
    Inventors: Masashi Hirama, Hidekazu Yoshihara, Ryota Mitsuhashi, Tomoaki Kasukawa, Akiyoshi Yatsugi
  • Patent number: D661265
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: June 5, 2012
    Assignee: Nippon Mektron, Ltd.
    Inventors: Atsushi Kajiya, Hidekazu Yoshihara
  • Patent number: D669045
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: October 16, 2012
    Assignee: Nippon Mektron, Ltd.
    Inventors: Atsushi Kajiya, Hidekazu Yoshihara
  • Patent number: D669046
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: October 16, 2012
    Inventors: Atsushi Kajiya, Hidekazu Yoshihara
  • Patent number: D687397
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: August 6, 2013
    Assignee: Nippon Mektron, Ltd.
    Inventors: Atsushi Kajiya, Hidekazu Yoshihara