Patents by Inventor Hideki Kitada

Hideki Kitada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190192036
    Abstract: An electronic device includes: a polymer film that is to melt at a predetermined temperature higher than a body temperature; at least one electronic component provided in the polymer film; and a first hydrophobic film provided on an opposite surface of the polymer film to a side of the polymer film to be attached to skin.
    Type: Application
    Filed: March 4, 2019
    Publication date: June 27, 2019
    Applicant: FUJITSU LIMITED
    Inventors: Taiji Sakai, Hideki Kitada, KOZO SHIMIZU
  • Patent number: 10319667
    Abstract: An electronic device includes: a substrate that includes a first penetration hole; a first electrode that is located on a first surface of the substrate so as to cover the first penetration hole; and a first penetrating electrode that is located in the first penetration hole and is in contact with or away from the first electrode depending on temperature.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: June 11, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Shoichi Miyahara, Aki Dote, Hideki Kitada
  • Publication number: 20190093729
    Abstract: An air spring includes an outer cylindrical member, an inner cylindrical member, a diaphragm, the diaphragm providing an internal space between the outer cylindrical member and the inner cylindrical member, a stopper assembly arranged in the internal space as being pivotable over the inner cylindrical member, a handle for pivoting the stopper assembly over the inner cylindrical member, a guide member attached to the handle as rising from the handle, a positioning member attached by insertion in a guide hole in the guide member for positioning of the handle, a positioning hole provided in the inner cylindrical member which can receive the positioning member, and a holding mechanism in the inner cylindrical member. A position of the stopper assembly with respect to the inner cylindrical member is determined by inserting the positioning member in the positioning hole.
    Type: Application
    Filed: October 17, 2016
    Publication date: March 28, 2019
    Applicants: Sumitomo Electric Industries, Ltd., KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Takayuki SAWA, Hideki KITADA, Yasuhiko URA, Takehiro NISHIMURA, Keiichiro KAMURA, Yoshi SATO
  • Publication number: 20190084594
    Abstract: An air spring includes an outer cylindrical member, an inner cylindrical member combined with the outer cylindrical member, a diaphragm coupling the outer cylindrical member and the inner cylindrical member to each other, the diaphragm providing an internal space between the outer cylindrical member and the inner cylindrical member, a first element located on a side of the internal space in at least one of the outer cylindrical member and the inner cylindrical member and defining a part of the internal space, a second element adjacent to the first element, the second element defining a part of the internal space, and a cover layer covering a boundary portion between the first element and the second element.
    Type: Application
    Filed: October 17, 2016
    Publication date: March 21, 2019
    Applicants: Sumitomo Electric Industries, Ltd., KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Takayuki SAWA, Hideki KITADA, Yasuhiko URA, Takehiro NISHIMURA, Keiichiro KAMURA, Yoshi SATO
  • Publication number: 20190084593
    Abstract: An air spring includes an outer cylindrical member, an inner cylindrical member combined with the outer cylindrical member, a diaphragm coupling the outer cylindrical member and the inner cylindrical member to each other, the diaphragm providing an internal space between the outer cylindrical member and the inner cylindrical member, a stopper assembly arranged in the internal space as being pivotable over the inner cylindrical member, the stopper assembly allowing suppression of movement of the outer cylindrical member toward the inner cylindrical member more than necessary, a pivoting mechanism pivoting the stopper assembly over the inner cylindrical member, and a space portion provided between the stopper assembly and the inner cylindrical member, the space portion allowing lowering in resistance in pivot of the stopper assembly.
    Type: Application
    Filed: October 17, 2016
    Publication date: March 21, 2019
    Applicants: Sumitomo Electric Industries, Ltd., KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Takayuki SAWA, Hideki KITADA, Yasuhiko URA, Takehiro NISHIMURA, Keiichiro KAMURA, Yoshi SATO
  • Publication number: 20180312174
    Abstract: An air spring according to the present disclosure includes: an inner cylindrical member; an outer cylindrical member provided on the inner cylindrical member; a diaphragm coupled with the outer cylindrical member and the inner cylindrical member; and a stopper provided rotatably with respect to a circumferential direction of the inner cylindrical member. The stopper has a raised portion raised towards the outer cylindrical member and moving on the inner cylindrical member in the circumferential direction. The outer cylindrical member has a plurality of raised portions raised toward the inner cylindrical member. The plurality of raised portions of the outer cylindrical member are different in height. At least one of the outer cylindrical member's raised portion and the stopper's raised portion is restorable against circumferential deformation.
    Type: Application
    Filed: October 17, 2016
    Publication date: November 1, 2018
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Takayuki SAWA, Hideki KITADA, Yasuhiko URA
  • Publication number: 20180290669
    Abstract: An air spring includes: an outer cylindrical member; an inner cylindrical member; a diaphragm which couples the outer and inner cylindrical members and forms an internal space; a stopper assembly disposed in the internal space; and a pivoting mechanism which causes this stopper assembly to pivot on the inner cylindrical member. The stopper assembly has a stopper portion protruding towards the outer cylindrical member, and the outer cylindrical member has as a set four or more protrusion portions provided at a position to face the stopper portion and protruding toward the inner cylindrical member. Each of the protrusion portions belonging to the set is disposed successively and also different in height. Each of the protrusion portions belonging to the set is arranged without having a protrusion portion belonging to the set smallest in height adjacent to a protrusion portion belonging to the set largest in height.
    Type: Application
    Filed: October 17, 2016
    Publication date: October 11, 2018
    Applicants: Sumitomo Electric Industries, Ltd., Kawasaki Jukogyo Kabushiki Kaisha
    Inventors: Takayuki SAWA, Hideki KITADA, Yasuhiko URA, Takehiro NISHIMURA, Keiichiro KAMURA, Yoshi SATO
  • Publication number: 20180279476
    Abstract: An electronic apparatus includes a first circuit board, a stacked circuit that is provided on the first circuit board through first coupling terminals and has a structure in which arithmetic elements and memory elements are stacked through inter-element coupling terminals and to which a signal is inputted from the first circuit board, and a second circuit board that is provided on the stacked circuit through second coupling terminals and to which a result of processing is outputted from the stacked circuit, wherein a number of the first coupling terminals and a number of the second coupling terminals are smaller than that of the inter-element coupling terminals.
    Type: Application
    Filed: March 9, 2018
    Publication date: September 27, 2018
    Applicant: FUJITSU LIMITED
    Inventors: Taiki UEMURA, Taiji SAKAI, Hideki KITADA
  • Patent number: 10008436
    Abstract: A semiconductor device includes: a semiconductor substrate; a wiring layer provided on a front-surface side of the semiconductor substrate; a through-via that penetrates through the semiconductor substrate from a back-surface side of the semiconductor substrate and is coupled to a wire included in the wiring layer; and a stress relaxation part that protrudes toward a through-via side and is disposed on a section in the wire and coupled to the through-via, the stress relaxation part including at least one insulating portion containing an insulating material having a smaller thermal expansion coefficient than a material of the through-via.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: June 26, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Aki Dote, Takeshi Ishitsuka, Hideki Kitada
  • Publication number: 20180174906
    Abstract: A semiconductor device includes: a semiconductor substrate; a through silicon via which penetrates the semiconductor substrate; an insulating film which is provided between a side surface of the through silicon via and the semiconductor substrate; and a MOS transistor which is provided on the semiconductor substrate, wherein: the semiconductor substrate has a first crystal axis and a second crystal axis, and a propagation amount of stress occurring from the through silicon via is larger in a direction of the first crystal axis than in a direction of the second crystal axis; and the insulating film has a thickness in a direction of a diameter of the through silicon via being a thickness along the direction of the first crystal axis larger than a thickness along the direction of the second crystal axis.
    Type: Application
    Filed: November 27, 2017
    Publication date: June 21, 2018
    Applicant: FUJITSU LIMITED
    Inventors: Hiroko TASHIRO, Hideki KITADA
  • Publication number: 20180061740
    Abstract: An electronic device includes: a substrate that includes a first penetration hole; a first electrode that is located on a first surface of the substrate so as to cover the first penetration hole; and a first penetrating electrode that is located in the first penetration hole and is in contact with or away from the first electrode depending on temperature.
    Type: Application
    Filed: July 5, 2017
    Publication date: March 1, 2018
    Applicant: FUJITSU LIMITED
    Inventors: Shoichi Miyahara, Aki Dote, Hideki Kitada
  • Publication number: 20180012999
    Abstract: A semiconductor device includes a via and first and second transistors of the same channel type which are formed in a semiconductor substrate. The first and second transistors are located in a first lateral direction of the via and have their channel direction that matches the first lateral direction. A first stress relaxation region is formed in the semiconductor substrate between the via and the first transistor which is located closer to the via than the second transistor is. A second stress relaxation region smaller than the first stress relaxation region is formed in the semiconductor substrate between the first transistor and the second transistor which is located farther from the via than the first transistor is.
    Type: Application
    Filed: June 2, 2017
    Publication date: January 11, 2018
    Applicant: FUJITSU LIMITED
    Inventors: Hiroko Tashiro, Hideki Kitada
  • Publication number: 20170110369
    Abstract: An electronic device includes: a first insulating film; an interconnection trench on a surface of the first insulating film; an interconnection pattern composed of Cu, the interconnection trench being filled with the interconnection pattern; a metal film on a surface of the interconnection pattern, the metal film having a higher elastic modulus than Cu; a second insulating film on the first insulating film; and a via plug composed of Cu and arranged in the second insulating film, the via plug being in contact with the metal film.
    Type: Application
    Filed: December 28, 2016
    Publication date: April 20, 2017
    Applicant: FUJITSU LIMITED
    Inventors: Tsuyoshi KANKI, Hideki KITADA
  • Publication number: 20160351474
    Abstract: A semiconductor device includes: a semiconductor substrate; a wiring layer provided on a front-surface side of the semiconductor substrate; a through-via that penetrates through the semiconductor substrate from a back-surface side of the semiconductor substrate and is coupled to a wire included in the wiring layer; and a stress relaxation part that protrudes toward a through-via side and is disposed on a section in the wire and coupled to the through-via, the stress relaxation part including at least one insulating portion containing an insulating material having a smaller thermal expansion coefficient than a material of the through-via.
    Type: Application
    Filed: March 25, 2016
    Publication date: December 1, 2016
    Applicant: FUJITSU LIMITED
    Inventors: Aki Dote, Takeshi ISHITSUKA, Hideki Kitada
  • Publication number: 20160351499
    Abstract: A semiconductor device includes a semiconductor substrate, a through hole via which pierces the semiconductor substrate, and a wiring layer (multilayer wirings) disposed under the semiconductor substrate and including plural layers of a group of lands disposed under the through hole via. The group of lands includes a land in a first layer which is disposed on an under surface of the through hole via and which is equal in external size to or smaller in external size than the through hole via in planar view and a land in a second layer which is disposed under the land in the first layer and which is larger in external size than the land in the first layer in the planar view. The lands in the first and second layers suppress concentration of stress transmitted by pop-ups from the through hole via to the group of lands and prevent cracks.
    Type: Application
    Filed: May 18, 2016
    Publication date: December 1, 2016
    Applicant: FUJITSU LIMITED
    Inventor: Hideki Kitada
  • Patent number: 9202752
    Abstract: A semiconductor device includes a first semiconductor substrate including a first integrated circuit, a second semiconductor substrate mounted over the first semiconductor substrate, the second semiconductor substrate including a second integrated circuit, a post made of an inorganic substance and formed over the first semiconductor substrate, an adhesive layer made of an organic substance arranged between the first and the second semiconductor substrates, and a substrate-through-via made of an electrical conductor extending through the second semiconductor substrate and the post, the substrate-through-via extending to the first semiconductor substrate.
    Type: Grant
    Filed: March 5, 2010
    Date of Patent: December 1, 2015
    Assignee: FUJITSU LIMITED
    Inventor: Hideki Kitada
  • Patent number: 8836122
    Abstract: A semiconductor device has: a semiconductor substrate formed with a plurality of semiconductor elements, a plurality of interlevel insulating films laminated above the semiconductor substrate, including a first and a second interlevel insulating films adjacent to each other; a first wiring trench formed in the first interlevel insulating film; and a first damascene wiring including: a first barrier metal film having a diffusion preventive function, formed covering inner surface of the first wiring trench and defining a first main wiring trench; and a first main wiring layer filling the first main wiring trench, formed of first metal element, and added with second metal element having migration suppressing function, at spatially different concentration.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: September 16, 2014
    Assignee: Fujitsu Limited
    Inventor: Hideki Kitada
  • Patent number: 8540220
    Abstract: The invention offers an air spring for obtaining a vehicle that renders good comfortableness even at the time of the curved-track running. The air spring for a vehicle has an upper board, a lower board, a diaphragm, and a stopper rubber placed between the lower board and a lower plate. The air spring is provided with a mechanism for restraining the displacement of the stopper rubber, the mechanism having a first restraining member placed on either one of the lower plate and the lower board and a second restraining member placed on the other.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: September 24, 2013
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takayuki Sawa, Hideki Kitada, Toshihisa Adachi, Hirokazu Haraguchi
  • Publication number: 20130093092
    Abstract: An electronic device includes: a first insulating film; an interconnection trench on a surface of the first insulating film; an interconnection pattern composed of Cu, the interconnection trench being filled with the interconnection pattern; a metal film on a surface of the interconnection pattern, the metal film having a higher elastic modulus than Cu; a second insulating film on the first insulating film; and a via plug composed of Cu and arranged in the second insulating film, the via plug being in contact with the metal film.
    Type: Application
    Filed: September 13, 2012
    Publication date: April 18, 2013
    Applicant: FUJITSU LIMITED
    Inventors: Tsuyoshi Kanki, Hideki Kitada
  • Patent number: 8383509
    Abstract: (a) A copper alloy film containing at least two types of metal elements in addition to copper is formed on the surface of an insulator containing oxygen and formed on a semiconductor substrate. (b) A metal film made of pure copper or copper alloy is formed on the copper alloy film. (c) After the step (a) or (b), heat treatment is performed under the condition that a metal oxide film is formed on a surface of the insulator through reaction between the oxygen in the insulator and the metal elements in the copper alloy film.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: February 26, 2013
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Yumiko Koura, Hideki Kitada, Kiyoshi Ozawa