Abstract: A link actuation device includes: a parallel link mechanism including a proximal-side link hub, a distal-side link hub, and three or more link mechanisms coupling the distal-side link hub to the proximal-side link hub such that a posture of the distal-side link hub can be changed with respect to the proximal-side link hub; actuators for changing the posture; and a teaching unit including a conversion unit configured to calculate coordinates (Wt (=Xt, Yt, Zt)) of a distal-side link center of the distal-side link hub, which are expressed in orthogonal coordinates, from rotation angles (?n; n=1, 2, . . . ) of the end link members. A normal vector is applied to equations of a plane and of a sphere, and the equations are rearranged and used in the conversion unit.

Abstract: A link actuation apparatus that actuates a parallel link mechanism where a spherical drive mechanism is constructed includes a controller configured to calculate, based on spherical trigonometry, an attitude of a second link hub from angles ?A1 and ?A2 that represent the attitude of a first end link member with respect to a first link hub in two of at least three link mechanisms. The link actuation apparatus capable of performing forward transformation in real time is thus provided.

Abstract: A parallel link mechanism includes a proximal end member and three or more link mechanisms. Three or more link mechanisms connect the proximal end member to a distal end member. In three or more link mechanisms, a first center axis of a first revolute pair unit and a second center axis of a second revolute pair unit intersect at a spherical link center point. Fifth center axes of respective fifth revolute pair units of three or more link mechanisms overlap each other and intersect with the spherical link center point.

Abstract: A link actuation apparatus that actuates a parallel link mechanism where a spherical drive mechanism is constructed includes a controller configured to calculate, based on spherical trigonometry, an attitude of a second link hub from angles ?A1 and ?A2 that represent the attitude of a first end link member with respect to a first link hub in two of at least three link mechanisms. The link actuation apparatus capable of performing forward transformation in real time is thus provided.

Abstract: A parallel link mechanism includes a proximal end-side link hub, three link mechanisms, a rotating body, and a distal end-side link hub. The rotating body is connected to one link mechanism among the three link mechanisms. The rotating body is rotatably coupled to the proximal end-side link hub. In the link mechanism, a first center axis of a first revolute pair portion intersects with a second center axis of a second revolute pair portion at a spherical link center point. The rotation center axis of the rotating body intersects with the spherical link center point.

Abstract: A parallel link mechanism includes a proximal end member and three or more link mechanisms. Three or more link mechanisms connect the proximal end member to a distal end member. In three or more link mechanisms, a first center axis of a first revolute pair unit and a second center axis of a second revolute pair unit intersect at a spherical link center point. Fifth center axes of respective fifth revolute pair units of three or more link mechanisms overlap each other and intersect with the spherical link center point.

Abstract: A link actuation device includes: a parallel link mechanism including a proximal-side link hub, a distal-side link hub, and three or more link mechanisms coupling the distal-side link hub to the proximal-side link hub such that a posture of the distal-side link hub can be changed with respect to the proximal-side link hub; actuators for changing the posture; and a teaching unit including a conversion unit configured to calculate coordinates (Wt (=Xt, Yt, Zt)) of a distal-side link center of the distal-side link hub, which are expressed in orthogonal coordinates, from rotation angles (?n; n=1, 2, . . . ) of the end link members. A normal vector is applied to equations of a plane and of a sphere, and the equations are rearranged and used in the conversion unit.

Abstract: A lead frame includes a first lead frame including a first lead; a second lead frame including a second lead, the second lead frame being stacked on the first lead frame so that a space is formed between the first lead frame and the second lead frame, and the second lead being bonded to the first lead; and a resin portion provided in the space formed between the first lead frame and the second lead frame, wherein each of the first lead and the second lead includes an embedded portion embedded in the resin portion, and a protruding portion protruded from the resin portion, and wherein the embedded portion of the first lead and the embedded portion of the second lead are bonded in the resin portion.

Abstract: A lead frame includes a first lead frame including a first lead; a second lead frame including a second lead, the second lead frame being stacked on the first lead frame so that a space is formed between the first lead frame and the second lead frame, and the second lead being bonded to the first lead; and a resin portion provided in the space formed between the first lead frame and the second lead frame, wherein each of the first lead and the second lead includes an embedded portion embedded in the resin portion, and a protruding portion protruded from the resin portion, and wherein the embedded portion of the first lead and the embedded portion of the second lead are bonded in the resin portion.

Abstract: A casing and a lid which are supplied to a casing/lid supply machine are fed to a main assembly line where a light-shielding sheet is mounted on the casing and a film cover supplied from a film cover assembly line is mounted in the casing. Pressers supplied from a presser assembly line are mounted on the lid. The casing and the lid are combined with each other, completing a film case. The film case manufacturing system is capable of efficiently manufacturing highly accurate film cases and is relatively compact in structure.

Abstract: Continuous photo film includes a support of resin film having a back surface. A photosensitive layer of photographic emulsion is disposed on a surface of the support opposite to the back surface. A conveying roller conveys the continuous photo film. The conveying roller includes a roller body of metal. A hardness reinforcer layer is formed on a surface of the roller body by thermal spraying of ceramic or cermet, so that the roller body surface is prevented from being scratched or ground by the back surface of the film.

Abstract: In a lead frame, a die-pad is delimited for a semiconductor element to be mounted thereon, a plurality of leads are arranged along the periphery of an area to be ultimately separated as a semiconductor device for the die-pad, and furthermore, a conductor portion for power/ground terminal is formed around the die-pad in the area between the die-pad and the leads corresponding to the die-pad. The die-pad, the leads, and the conductor portion for power/ground terminal are supported by an adhesive tape. The conductor portion for power/ground terminal is formed in the form of a single or double rings around the corresponding die-pad, or formed to partially surround the corresponding die-pad. The conductor portion for power/ground terminal is connected to at least one lead among the plurality of leads.

Abstract: A casing and a lid which are supplied to a casing/lid supply machine are fed to a main assembly line where a light-shielding sheet is mounted on the casing and a film cover supplied from a film cover assembly line is mounted in the casing. Pressers supplied from a presser assembly line are mounted on the lid. The casing and the lid are combined with each other, completing a film case. The film case manufacturing system is capable of efficiently manufacturing highly accurate film cases and is relatively compact in structure.

Abstract: A leadframe used for a leadless package (a semiconductor device) such as a quad flat non-leaded package (QFN) includes a die-pad portion disposed in a center of an opening defined by a frame portion, and a plurality of lead portions extending from the frame portion toward the die-pad portion in a comb shape. A lead width of a portion along a circumference of a region to be ultimately divided as a semiconductor device, of each of the lead portions, is formed narrower than that of the other portion of the corresponding lead portions. In the leadframe, a plurality of die-pad portions are disposed, the frame portion is provided so as to surround each of the die-pad portions, and a plurality of lead portions corresponding to each of the die-pad portions extend from the frame portion surrounding the corresponding die-pad portion toward the corresponding die-pad portion. Moreover, an adhesive tape is attached to one surface of the leadframe.

Abstract: In a lead frame which comprises lead portions extended from a frame portion toward an inside like a teeth of a comb and each having a top end portion, a center portion, and a base portion connected to the frame portion, the top end portion and the center portion are connected via a first constriction portion, and the center portion and the base portion are connected via a second constriction portion, and thickness of both side surface portions of the center portion and the top end portion of each lead portion are set thinner than thickness of remaining portions of each lead portion.

Abstract: A casing and a lid which are supplied to a casing/lid supply machine are fed to a main assembly line where a light-shielding sheet is mounted on the casing and a film cover supplied from a film cover assembly line is mounted in the casing. Pressers supplied from a presser assembly line are mounted on the lid. The casing and the lid are combined with each other, completing a film case. The film case manufacturing system is capable of efficiently manufacturing highly accurate film cases and is relatively compact in structure.

Abstract: A leadframe for use in a leadless package (a semiconductor device) such as a quad flat non-leaded package (QFN) includes a base frame having a die-pad demarcated severally to correspond to each semiconductor element to be mounted thereon and a plurality of leads arranged around the corresponding die-pad, and an adhesive tape attached to the base frame so as to cover one surface side of each die-pad and the plurality of leads arranged around the corresponding die-pad. The plurality of leads corresponding to each die-pad extend with a comb shape from the corresponding die-pad to an outward direction, with being separated severally from the die-pad, inside a region to be ultimately divided into a semiconductor device. The leadframe further includes a plurality of support bars severally linked to each die-pad. The support bars are supported by the adhesive tape, and extend close to a peripheral portion of the region to be ultimately divided into the semiconductor device.

Abstract: A leadframe used for a leadless package (a semiconductor device) such as a quad flat non-leaded package (QFN) includes a die-pad portion disposed in a center of an opening defined by a frame portion, and a plurality of lead portions extending from the frame portion toward the die-pad portion in a comb shape. A lead width of a portion along a circumference of a region to be ultimately divided as a semiconductor device, of each of the lead portions, is formed narrower than that of the other portion of the corresponding lead portions. In the leadframe, a plurality of die-pad portions are disposed, the frame portion is provided so as to surround each of the die-pad portions, and a plurality of lead portions corresponding to each of the die-pad portions extend from the frame portion surrounding the corresponding die-pad portion toward the corresponding die-pad portion. Moreover, an adhesive tape is attached to one surface of the leadframe.

Abstract: In a lead frame which comprises lead portions extended from a frame portion toward an inside like a teeth of a comb and each having a top end portion, a center portion, and a base portion connected to the frame portion, the top end portion and the center portion are connected via a first constriction portion, and the center portion and the base portion are connected via a second constriction portion, and thickness of both side surface portions of the center portion and the top end portion of each lead portion are set thinner than thickness of remaining portions of each lead portion.

Abstract: Continuous photo film includes a support of resin film having a back surface. A photosensitive layer of photographic emulsion is disposed on a surface of the support opposite to the back surface. A conveying roller conveys the continuous photo film. The conveying roller includes a roller body of metal. A hardness reinforcer layer is formed on a surface of the roller body by thermal spraying of ceramic or cermet, so that the roller body surface is prevented from being scratched or ground by the back surface of the film.