Patents by Inventor Hideki Sawada

Hideki Sawada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6043851
    Abstract: An image and sound synchronizing reproduction apparatus includes a reference time calculation circuit for calculating a reference time in response to a data amount of decoded sound data, a delay detecting circuit calculating number of image frames to be processed practically in the decoding process in response to the reference time and comparing the number of image frames with number of frames practically processed in the decoding process, for detecting a delay of image decoding process, a frame-removing control circuit for performing a discriminating process of frames to be omitted the decoding process in response to the number of delay frames detected by the delay detecting circuit, and an image data input control circuit for performing an omission to read compressed image data corresponding to the frames discriminated by the frame-removing control circuit, controlling finely the image and sound synchronizing reproduction regardless of the structure of compressing coded data.
    Type: Grant
    Filed: January 13, 1998
    Date of Patent: March 28, 2000
    Assignee: NEC Corporation
    Inventors: Hideki Sawada, Takashi Sameshima, Masaru Terashima, Mitsumasa Tanaka
  • Patent number: 6018357
    Abstract: A printer including a light emitting body for emitting light along a main scanning direction. A photosensitive surface of a photosensitive body is sensitized by the light emitted from the light emitting body. The photosensitive surface is moved relative to the light emitting body at a predetermined distance along a sub scanning direction perpendicular to the main scanning direction. While the photosensitive surface is moved at the predetermined distance along the sub scanning direction, the light emitting body emits the lights at a predetermined period. The predetermined period is determined to be a time required for moving the photosensitive surface at a dimension of the light emitting body along the sub scanning direction.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: January 25, 2000
    Assignee: Rohm Co., Ltd.
    Inventors: Hideki Sawada, Hiromi Ogata, Hideo Taniguchi
  • Patent number: 5835814
    Abstract: Full color images are formed by electrophotography which utilizes a rotary member having an endless photosensitive surface which has a plurality of different band regions divided in a direction perpendicular to a rotational direction of the rotary member. The photosensitive surface is electrostatically charged, and the plural band regions are simultaneously irradiated each with light of a different color to electrostatically form a different latent image in each of the band regions. Then, the latent images of the respective band regions are developed to provide a set of differently colored images which are transcribed onto a recording medium. After the set of differently colored images is transcribed onto the recording medium, the recording medium is indexed in a direction perpendicular to the rotational direction of the rotary member.
    Type: Grant
    Filed: January 24, 1997
    Date of Patent: November 10, 1998
    Assignee: Rohm Co. Ltd.
    Inventor: Hideki Sawada
  • Patent number: 5767875
    Abstract: In a serial type printing apparatus which forms an image with a given dot pitch (P.sub.D) in the sheet feed direction, a print head is provided which includes a plurality (n) of dot marking parts arranged with an arrangement pitch (P.sub.N =M.sub.N P.sub.D) that is the dot pitch multiplied by an integer number (m.sub.N). After termination of one print scanning step by the print head, a sheet is fed with sheet feed pitches (P.sub.F1, P.sub.F2) that are larger than the arrangement pitch P.sub.N but smaller than a width ((n-1)P.sub.N) across which the plurality of dot marking parts are arranged, thus width also being the dot pitch multiplied by an integer number. According to such a printing method, the sheet feed can be equalized to suppress banding appearing as a seam extending in the scanning direction at the boundary between the adjacent printed areas due to the precision of a sheet feed mechanism.
    Type: Grant
    Filed: February 23, 1996
    Date of Patent: June 16, 1998
    Assignee: Rohm Co., Ltd.
    Inventor: Hideki Sawada
  • Patent number: 5763057
    Abstract: A narrow dummy pattern made of aluminum is formed between an identification area of a semiconductor chip and a dicing line to prevent film peeling in a dicing operation from reaching the identification area.
    Type: Grant
    Filed: December 29, 1992
    Date of Patent: June 9, 1998
    Assignee: Rohm Co., Ltd.
    Inventors: Hideki Sawada, Hiromi Ogata
  • Patent number: 5467036
    Abstract: An integrated circuit device comprises a first external reference voltage pin and a second external reference voltage pin. External reference voltages are applied to these pins to provide the supply voltage of a D/A converter and the output of the D/A converter is fed into a gate of a driving MOSFET via an inverting circuit and a logic gate. In one embodiment, resistors in a first resistor group have one end connected to first external reference voltage pins and resistors in a second resistor group have one end connected to second external reference voltage pins. The other ends of the first and second resistor groups are connected in common and the potential at the common connection point is applied via an inverting circuit and a gate circuit to a gate of a MOSFET.
    Type: Grant
    Filed: June 22, 1994
    Date of Patent: November 14, 1995
    Assignee: Rohm Co., Ltd.
    Inventor: Hideki Sawada
  • Patent number: 5430325
    Abstract: A plurality of semiconductor chips are formed on a wafer. By forming a dummy pattern of a linear shape on an insulating film formed on a semiconductor chip along dicing lines provided for separating the plurality of semiconductor chips into the individual semiconductor chips, when the separation of the semiconductor chips is performed along the dicing lines, an advancing of a film peeling to a recognition mark for bonding within the dummy pattern or elements is prevented to reduce both a recognition error of information at the time of bonding of the semiconductor chip and the number of defective elements.
    Type: Grant
    Filed: June 22, 1993
    Date of Patent: July 4, 1995
    Assignee: Rohm Co. Ltd.
    Inventors: Hideki Sawada, Hiromi Ogata