Abstract: The present invention provides a plating solution containing chromium sulfate and formic acid at a concentration of Cr3+ ions of 0.1 mol/L or more and 1 mol/L or less and a concentration of formic acid of 0.05 mol/L or more and 0.2 mol/L or less.

Abstract: According to the present invention, a circuit board having a further-microfabricated circuit pattern that can be manufactured in further simplified steps is obtained. For such purpose, a mold 10, which has protrusions 11 formed in a pattern corresponding to a circuit pattern, is used to apply a conductive material layer (metal paste) 13 to head portions of the protrusions 11 of the mold 10. The mold is heat- and pressure-welded to the surface of a substrate 20 that is made of a resin film or the like. Accordingly, a pattern comprising the protrusions 11 and the conductive material layer (metal paste) 13 are transferred to the substrate 20. After transfer, the resin substrate (resin molding 30) is immersed in a copper sulfate plating bath for electrolytic plating treatment. Copper ions in the plating bath were deposited inside each recess 31 while the conductive material layer 13 is used as a base material for the formation of a metal wiring 32.

Abstract: A method of forming a metal film and a metal wiring pattern is described a step of forming an organic film by applying and polymerizing an undercoat composition for forming a metal film containing an addition-polymerizable monomer having an acidic group and a polymerization initiator on a substrate or film, a step of converting the acidic group into a metal (M1) salt by treating the organic film with an aqueous solution containing a metal (M1) ion, a step of converting the metal (M1) salt into a metal (M2) salt by treating the organic film with an aqueous solution containing a metal (M2) ion having an ionization tendency lower than the metal (M1) ion, and a step of forming a metal film on the organic film surface by reducing the metal (M2) ion.

Abstract: To develop stable, non-cyanide silver and silver alloy plating baths. The present invention is a silver and silver alloy plating bath, comprises: (A) a soluble salt, comprising a silver salt or a mixture of a silver salt and a salt of a metal selected from the group consisting of tin, bismuth, cobalt, antimony, iridium, indium, lead, copper, iron, zinc, nickel, palladium, platinum, and gold; and (B) at least one aliphatic sulfide compound comprising a functionality selected from the group consisting of an ether oxygen atom, a 3-hydroxypropyl group, and a hydroxypropylene group, with the proviso that the aliphatic sulfide compound does not comprise a basic nitrogen atom.

Abstract: According to the present invention, a circuit board having a further-microfabricated circuit pattern that can be manufactured in further simplified steps is obtained. For such purpose, a mold 10, which has protrusions 11 formed in a pattern corresponding to a circuit pattern, is used to apply a conductive material layer (metal paste) 13 to head portions of the protrusions 11 of the mold 10. The mold is heat- and pressure-welded to the surface of a substrate 20 that is made of a resin film or the like. Accordingly, a pattern comprising the protrusions 11 and the conductive material layer (metal paste) 13 are transferred to the substrate 20. After transfer, the resin substrate (resin molding 30) is immersed in a copper sulfate plating bath for electrolytic plating treatment. Copper ions in the plating bath were deposited inside each recess 31 while the conductive material layer 13 is used as a base material for the formation of a metal wiring 32.

Abstract: A method of forming a metal film and a metal wiring pattern is described a step of forming an organic film by applying and polymerizing an undercoat composition for forming a metal film containing an addition-polymerizable monomer having an acidic group and a polymerization initiator on a substrate or film, a step of converting the acidic group into a metal (M1) salt by treating the organic film with an aqueous solution containing a metal (M1) ion, a step of converting the metal (M1) salt into a metal (M2) salt by treating the organic film with an aqueous solution containing a metal (M2) ion having an ionization tendency lower than the metal (M1) ion, and a step of forming a metal film on the organic film surface by reducing the metal (M2) ion.

Abstract: To develop stable, non-cyanide silver and silver alloy plating baths. The present invention is a silver and silver alloy plating bath, comprises: (A) a soluble salt, comprising a silver salt or a mixture of a silver salt and a salt of a metal selected from the group consisting of tin, bismuth, cobalt, antimony, iridium, indium, lead, copper, iron, zinc, nickel, palladium, platinum, and gold; and (B) at least one aliphatic sulfide compound comprising a functionality selected from the group consisting of an ether oxygen atom, a 3-hydroxypropyl group, and a hydroxypropylene group, with the proviso that the aliphatic sulfide compound does not comprise a basic nitrogen atom.

Abstract: A silver and silver alloy plating bath, includes (A) a soluble salt, having a silver salt or a mixture of a silver salt and a salt of a metal such as tin, bismuth, indium, lead, and the like; and (B) a particular aliphatic sulfide compound, such as thiobis(diethyleneglycol), dithiobis(triglycerol), 3,3?-thiodipropanol, thiodiglycerin, 3,6-dithiooctane-1,8-diol, and the like, which contain at least one or more of an ether oxygen atom, a 1-hydroxypropyl group, a hydroxypropylene group, or two or more of a sulfide bond in the molecule, and not containing a basic nitrogen atom.

Abstract: The present invention provides a method for producing a polyamic acid containing ultrafine metal particles, which contains the steps of contacting an aqueous solution containing a water-soluble metal compound with fine polyamic acid particles to adsorb metal ions to the fine polyamic acid particles, and then performing a reduction treatment; and a conductive adhesive which contains as an active ingredient the polyamic acid containing ultrafine metal particles. The conductive adhesive of the present invention has excellent performance which enables the adhesive to be used as an alternative to high-temperature lead solders.

Abstract: The present invention provides a process for producing a metal nanoparticle composite film, which is capable of independently controlling the particle diameter and the volume filling ratio of metal nanoparticles in the metal nanoparticle composite film. The process comprises the steps of (a) treating a polyimide resin film with an alkali aqueous solution to thereby introduce a carboxyl group, (b) bringing the resin film into contact with a solution containing metal ions, to thereby dope the metal ions in the resin film, and (c) performing thermal reduction treatment in a reducing gas, thereby producing the metal nanoparticle composite film containing the metal nanoparticles dispersed in the polyimide resin film, wherein the volume filling ratio of the metal nanoparticles in the composite film is controlled by regulating the thickness of a nanoparticle dispersed layer formed in the polyimide resin film with the thermal reduction treatment in the reducing gas in the step (c).

Abstract: A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided. The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components (I), (II) and (III): (I) silver colloidal particles, (II) one or more ions selected from an ion of a metal having an electric potential which can reduce a silver ion to metal silver in the solution and an ion oxidized at the time of reduction of the silver ion, and (III) one or more ions selected from a hydroxycarboxylate ion, a condensed phosphate ion and an amine carboxylate ion, the silver colloidal particles (I) being produced by the ion of the metal (II) having an electric potential which can reduce a silver ion to metal silver. When an object to be plated is pretreated by use of the pretreatment solution, provision of an effective catalyst for electroless plating is achieved.

Abstract: The present invention provides 1. A method for forming an inorganic thin film pattern on a polyimide resin, which has: (1) a step of forming an alkali-resistant protective film having a thickness of 0.01 to 10 ?m on a surface of a polyimide resin; (2) a step of removing the alkali-resistant protective film and a superficial portion of the polyimide resin at the site where an inorganic thin film pattern is formed to form a concave part; (3) a step of contacting an alkaline aqueous solution to the polyimide resin in the concave part to cleave an imide ring of the polyimide resin so as to produce a carboxyl group whereby a polyimide resin having the carboxyl group is formed; (4) a step of contacting a solution containing a metal ion to the polyimide resin having the carboxyl group so as to produce a metal salt of the carboxyl group; and (5) a step of separating the metal salt as a metal, a metal oxide or a semiconductor on the surface of the polyimide resin so as to form the inorganic thin film pattern.

Abstract: The present invention provides a method for forming an inorganic thin film on a polyimide resin, which includes: (1) a step of applying an alkaline aqueous solution on a polyimide resin at the site where an inorganic thin film is formed to cleave an imide ring of the polyimide resin so as to produce a carboxyl group and to reform the polyimide resin to a polyamic acid whereby a reformed portion including the polyamic acid having the carboxyl group is formed; (2) a step of contacting a solvent in which the polyamic acid is soluble to the reformed portion to remove a part of the reformed portion so as to form a concave part; (3) a step of contacting a solution containing a metal ion to the reformed portion, which is near the concave part, so as to produce a metal salt of the carboxyl group; and (4) a step of separating the metal salt as a metal, a metal oxide or a semiconductor on the surface of the polyimide resin so as to form the inorganic thin film.

Abstract: The present invention provides a method for forming a protective film selectively on metal interconnects, such as copper interconnects, of a substrate having an embedded interconnect structure, without causing the problem of contamination of the interconnects with an-alkali metal. The method for forming a protective film according to the present invention comprises: providing a substrate having embedded interconnects formed in a surface of the substrate; and bringing the surface of the substrate into contact with an electroless plating bath, thereby forming a protective film having a film thickness of 0.1 to 500 nm selectively on the exposed surface of the embedded interconnects; wherein the electroless plating bath contains cobalt ions, phosphinate ions and a complexing agent, uses cobalt phosphinate as a main supply source of the cobalt ions and the phosphinate ions, and does not substantially contain alkali metal ions.

Abstract: This invention offers a composite material with improved binding strength and a method for its manufacture. In particular, the invention offers a composite material having metal at the surface of a resin base, obtained by subjecting the surface of a resin base to an ion exchange group introduction treatment, treating the surface of said resin base with liquid containing metal ions, and then reducing said metal ions, where the aforementioned composite material resin is characterized in that the resin base and metal of said composite material are hot-pressed. Said composite material has superior binding strength between resin base and metal relative to composite materials obtained by electroless plating which have inferior binding strength between resin base and metal. Moreover, said composite material is readily manufactured because hot-press methods can be used in the formation of said composite material.

Abstract: This invention offers a method for forming a resin composite material, containing the steps of: (1) treating the surface of a carrier resin to treatment introduce ion exchange groups, (2) introducing metal ions to treat the carrier resin surface by treating the surface of said carrier resin with a solution containing metal ions, (3) converting said metal ions to a component containing a metal element, (4) forming a metal foil on top of said component containing a metal element, and (5) transferring said metal foil to a resin substrate by heating said metal foil. This method provides a carrier resin substrate having a metal foil of any desired thickness laminated or cast onto it. In this way a carrier resin containing a metal foil, particularly a copper foil, having a thickness, such as 8 ?m or less, can be prepared that is otherwise difficult to prepare using conventional methods.

Abstract: A resin composite material which comprises a resin base and a metal-element-containing ingredient disposed on the surface of the base and is obtained by a wet process, characterized by having no catalyst layers. The resin composite material is superior in adhesion between the resin base and the metal-element-containing ingredient and in evenness of the thickness of the metal-element-containing coating film to the resin composite materials obtained by conventional wet processes. The formation of the resin composite material necessitates neither etching nor electroless plating unlike the conventional wet processes. Consequently, the resin composite material can be easily produced without causing pollution attributable to these treatments, such as working atmosphere worsening and the pollution of the global environment.

Abstract: A composite material having metal at the surface of a resin base is obtained by subjecting the surface of a resin base to ion exchange group introduction treatment, treating the surface of said resin base with liquid containing metal ions to introduce metal ions, introducing photocatalyst into the resin base containing said introduced metal ions, and then irradiating the resin base with electromagnetic radiation after said photocatalyst introduction. Said composite material is useful for composite materials that require fine metal patterns.

Abstract: This invention offers a composite material with improved binding strength and a method for its manufacture. In particular, the invention offers a composite material having metal at the surface of a resin base, obtained by subjecting the surface of a resin base to an ion exchange group introduction treatment, treating the surface of said resin base with liquid containing metal ions, and then reducing said metal ions, where the aforementioned composite material resin is characterized in that the resin base and metal of said composite material are hot-pressed. Said composite material has superior binding strength between resin base and metal relative to composite materials obtained by electroless plating which have inferior binding strength between resin base and metal. Moreover, said composite material is readily manufactured because hot-press methods can be used in the formation of said composite material.

Abstract: A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided.