Abstract: A silicon nitride film forming method includes accommodating a workpiece within a reaction chamber, forming a silicon nitride film on the workpiece accommodated within the reaction chamber, carbon-terminating a surface of the silicon nitride film by supplying a hydrocarbon compound having an unsaturated bond into the reaction chamber accommodating the workpiece on which the silicon nitride film is formed, and unloading the workpiece, on which the silicon nitride film having a carbon-terminated surface is formed, out of the reaction chamber.

Abstract: Provided is a method of protecting a component of a film forming apparatus, which includes forming a film having a rough surface on a surface of a component which is provided in the interior of the processing chamber of a film forming apparatus such that the surface of the component is coated with the film having the rough surface, the component being exposed to a film forming atmosphere during a film forming process. Forming a film having a rough surface on a surface of the component is in some embodiments performed before or after the film forming process is performed on target substrate and in some cases both before and after.

Abstract: In order to improve the charging efficiency of a charging apparatus including a photovoltaic generator such as a solar battery, a charging apparatus includes: a battery which is rechargeable; a photovoltaic generator generating electric power in response to received light; and a generative charging portion supplying the electric power generated by the photovolaic generator to the battery. The generative charging portion includes: a control portion which controls current in the direction from the battery to the photovoltaic generator; and a voltage regulation portion which regulates voltage of the electric power supplied from the photovoltaic generator to the battery and is connected to the control portion in series.

Abstract: In order to improve the charging efficiency of a charging apparatus including a photovoltaic generator such as a solar battery, a charging apparatus includes: a battery which is rechargeable; a photovoltaic generator generating electric power in response to received light; and a generative charging portion supplying the electric power generated by the photovolaic generator to the battery. The generative charging portion includes: a control portion which controls current in the direction from the battery to the photovoltaic generator; and a voltage regulation portion which regulates voltage of the electric power supplied from the photovoltaic generator to the battery and is connected to the control portion in series.

Abstract: In a semiconductor device manufacturing method, at least a semiconductor element is arranged in a cavity of a resin molding die. A resin is supplied to a resin reservoir in direct contact with the cavity and is then injected in order to substantially fill the cavity. The resin filled in the cavity forms a resin seal for encapsulating the semiconductor element. The resin seal has a recess or a protrusion as a remainder of the resin reservoir.

Abstract: In a semiconductor device manufacturing method, at least a semiconductor element is arranged in a cavity of a resin molding die. A resin is supplied to a resin reservoir in direct contact with the cavity and is then injected in order to substantially fill the cavity. The resin filled in the cavity forms a resin seal for encapsulating the semiconductor element. The resin seal has a recess or a protrusion as a remainder of the resin reservoir.

Abstract: In a semiconductor device manufacturing method, at least a semiconductor element is arranged in a cavity of a resin molding die. A resin is supplied to a resin reservoir in direct contact with the cavity and is then injected in order to substantially fill the cavity. The resin filled in the cavity forms a resin seal for encapsulating the semiconductor element. The resin seal has a recess or a protrusion as a remainder of the resin reservoir.

Abstract: A chase is arranged on a heating plate of a die set. Semiconductor packages are arranged, as products to be heated, in cavities of the chase. A runner is provided in the surface of the chase to feed a molten resin into the cavities. The heating plate has a hole for a rod-like heater and a hole for a temperature monitoring sensor. The rod-like heater is inserted into the heater insertion hole and the sensor is inserted into the sensor insertion hole. The heater has a plurality of mutually independent heat generation areas in its axial direction. The sensor detects temperature at the heat generation areas of the heater. A control section monitors the temperature near the respective heat generation areas of the rod-like heater and sets the temperature at the respective heat generation areas of the rod-like heater to a predetermined level.

Abstract: A cooling system for an internal combustion engine has a water jacket connected to a radiator with upper and lower radiator passages for cooling coolant leaving the engine and a water pump in the lower radiator passage for circulating coolant through the water jacket. A bypass passage connects the upper radiator passage to the lower radiator passage for the circulation of coolant through the water jacket bypassing the radiator. A first thermostat valve in the upper radiator passage closes the upper radiator passage and opens the bypass passage when the coolant is lower than a predetermined low temperature and the engine is operated in a low engine load range so as to permit the circulation of coolant through the bypass passage bypassing the bypass passage.