Patents by Inventor Hideo Arakawa

Hideo Arakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070125922
    Abstract: An article hanging system capable of easily changing an exhibit position and an exhibit height of an article such as a goods exhibited in a shop, a hanger and a display shelf comprises a ceiling rail assembly, a wire holder slidably retained to the ceiling rail assembly, a wire hanging down from the wire holder, a gripper fixably attachable at a desired position along the wire, a wire holder attached to a lower end of the wire and a floor rail assembly to which the wire holder is slidably retained. Each of the rail assemblies comprises longitudinal rails extending in a longitudinal direction (the Y-direction) and lateral rails slidable with respect to the longitudinal rail as being spanned between the longitudinal rails. Each of the wire holders are slidable along the lateral rail.
    Type: Application
    Filed: February 12, 2007
    Publication date: June 7, 2007
    Applicant: A.G.K. LTD.
    Inventor: Hideo Arakawa
  • Publication number: 20070125924
    Abstract: An article hanging system capable of easily changing an exhibit position and an exhibit height of an article such as a goods exhibited in a shop, a hanger and a display shelf comprises a ceiling rail assembly, a wire holder slidably retained to the ceiling rail assembly, a wire hanging down from the wire holder, a gripper fixably attachable at a desired position along the wire, a wire holder attached to a lower end of the wire and a floor rail assembly to which the wire holder is slidably retained. Each of the rail assemblies comprises longitudinal rails extending in a longitudinal direction (the Y-direction) and lateral rails slidable with respect to the longitudinal rail as being spanned between the longitudinal rails. Each of the wire holders are slidable along the lateral rail.
    Type: Application
    Filed: February 12, 2007
    Publication date: June 7, 2007
    Applicant: A.G.K. LTD.
    Inventor: Hideo Arakawa
  • Publication number: 20070125015
    Abstract: An article hanging system capable of easily changing an exhibit position and an exhibit height of an article such as a goods exhibited in a shop, a hanger and a display shelf comprises a ceiling rail assembly, a wire holder slidably retained to the ceiling rail assembly, a wire hanging down from the wire holder, a gripper fixably attachable at a desired position along the wire, a wire holder attached to a lower end of the wire and a floor rail assembly to which the wire holder is slidably retained. Each of the rail assemblies comprises longitudinal rails extending in a longitudinal direction (the Y-direction) and lateral rails slidable with respect to the longitudinal rail as being spanned between the longitudinal rails. Each of the wire holders are slidable along the lateral rail.
    Type: Application
    Filed: February 12, 2007
    Publication date: June 7, 2007
    Applicant: A.G.K. LTD.
    Inventor: Hideo Arakawa
  • Publication number: 20060243876
    Abstract: An article hanging system capable of easily changing an exhibit position and an exhibit height of an article such as a goods exhibited in a shop, a hanger and a display shelf comprises a ceiling rail assembly, a wire holder slidably retained to the ceiling rail assembly, a wire hanging down from the wire holder, a gripper fixably attachable at a desired position along the wire, a wire holder attached to a lower end of the wire and a floor rail assembly to which the wire holder is slidably retained. Each of the rail assemblies comprises longitudinal rails extending in a longitudinal direction (the Y-direction) and lateral rails slidable with respect to the longitudinal rail as being spanned between the longitudinal rails. Each of the wire holders are slidable along the lateral rail.
    Type: Application
    Filed: June 29, 2006
    Publication date: November 2, 2006
    Applicant: A.G.K. LTD.
    Inventor: Hideo Arakawa
  • Publication number: 20060000634
    Abstract: The electrical apparatus suspension unit 1 is provided with two power supply wires 20-1 and 20-2 by which the electrical apparatus 3 is conducted and suspended from the ceiling 5. Each of the wires 20 is connected to the hung member of the electrical apparatus 3 at the lower end by the a lower holder 40, and connected to the rail 9 laid on the ceiling 5 at the upper end by an upper holder 100. The power supply wire 20 comprises a core wire 21, an insulating layer 23 covering the core wire 21 and an outer layer 25 covering the insulating layer 23. The core wire 21 of the power supply wire 20-1 conducts to a grounded conductor cable W1 and the core wire 21 of another power supply wire 20-2 conducts to a voltage applied conductor cable W2. The power supply wires 20 having high tensile strength enables to suspend the electrical apparatus and also supply power thereto.
    Type: Application
    Filed: October 20, 2003
    Publication date: January 5, 2006
    Applicant: A. G. K. LTD
    Inventor: Hideo Arakawa
  • Patent number: 6909185
    Abstract: A composite material is provided, which has a low thermal expansivity, a high thermal conductivity, and a good plastic workability, which composite material may be applied to semiconductor devices and many other uses. The composite material is composed of metal and inorganic particles having a smaller coefficient of thermal expansion than the metal. It is characterized in that the inorganic particles are dispersed in such a way that 95% or more of them (in terms of their area in cross-section) form aggregates of complex configuration joined together. The composite material contains 20-80 vol % of copper oxide, with the remainder being copper. It has a coefficient of thermal expansion of 5×10?6 to 14×10?6/° C. and thermal conductivity of 30-325 W/m·K in the range of room temperature to 300° C. It is suitable for the radiator plate of semiconductor devices and the dielectric plate of electrostatic attractors.
    Type: Grant
    Filed: December 7, 1998
    Date of Patent: June 21, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Yasuo Kondo, Junya Kaneda, Tasuhisa Aono, Teruyoshi Abe, Masahisa Inagaki, Ryuichi Saito, Yoshihiko Koike, Hideo Arakawa
  • Patent number: 6833617
    Abstract: It is an object of the present invention to provide a composite material having low thermal expansivity, high thermal conductivity, and good plastic workability, which is applied to semiconductor devices and many other uses. The composite material is composed of metal and inorganic particles having a smaller coefficient of thermal expansion than said metal. It is characterized in that said inorganic particles disperse in such a way that 95% or more of them (in terms of their area in cross-section) form aggregates of complex configuration joining together. The composite material contains 20-80 vol % of copper oxide, with the remainder being copper. It has a coefficient of thermal expansion of 5×10−6 to 14×10−6/° C. and thermal conductivity of 30-325 W/m·K in the range of room temperature to 300° C. It is suitable for the radiator plate of semiconductor devices and the dielectric plate of electrostatic attractors.
    Type: Grant
    Filed: February 12, 2003
    Date of Patent: December 21, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Yasuo Kondo, Junya Kaneda, Tasuhisa Aono, Teruyoshi Abe, Masahisa Inagaki, Ryuichi Saito, Yoshihiko Koike, Hideo Arakawa
  • Publication number: 20040227047
    Abstract: An article hanging system (1) capable of easily changing an exhibit position and an exhibit height of an article such as a goods exhibited in a shop, a hanger and a display shelf comprises a ceiling rail assembly (10), a wire holder (50) slidably retained to the ceiling rail assembly (10), a wire (100) hanging down from the wire holder (50), a gripper (120) fixably attachable at a desired position along the wire (100), a wire holder (70) attached to a lower end of the wire (100) and a floor rail assembly (40) to which the wire holder (70) is slidably retained. Each of the rail assemblies (10), (40) comprises longitudinal rails (21), (11Y) extending in a longitudinal direction (the Y-direction) and lateral rails (11), (11X) slidable with respect to the longitudinal rail as being spanned between the longitudinal rails. Each of the wire holders (50), (70) are slidable along the lateral rail.
    Type: Application
    Filed: May 11, 2004
    Publication date: November 18, 2004
    Applicant: A. G. K. LTD.
    Inventor: Hideo Arakawa
  • Publication number: 20030146498
    Abstract: It is an object of the present invention to provide a composite material having low thermal expansivity, high thermal conductivity, and good plastic workability, which is applied to semiconductor devices and many other uses.
    Type: Application
    Filed: February 12, 2003
    Publication date: August 7, 2003
    Inventors: Yasuo Kondo, Junya Kaneda, Tasuhisa Aono, Teruyoshi Abe, Masahisa Inagaki, Ryuichi Saito, Yoshihiko Koike, Hideo Arakawa
  • Publication number: 20030146499
    Abstract: It is an object of the present invention to provide a composite material having low thermal expansivity, high thermal conductivity, and good plastic workability, which is applied to semiconductor devices and many other uses.
    Type: Application
    Filed: February 12, 2003
    Publication date: August 7, 2003
    Inventors: Yasuo Kondo, Junya Kaneda, Tasuhisa Aono, Teruyoshi Abe, Masahisa Inagaki, Ryuichi Saito, Yoshihiko Koike, Hideo Arakawa
  • Patent number: 5914658
    Abstract: A crime prevention display device is disclosed which includes a casing (21) provided therein with a chuck mechanism (20) for gripping a wire (W) inserted therethrough, a crime prevention alarm circuit (3) connected to the casing and a load detection means (40, 66, 25) for detecting a variation in load applied from an exhibit to the device. The load detection means (40) detects that removal of the exhibit held on the display device causes the device to be unloaded, so that the crime prevention alarm circuit (3) generates an alarm, leading to warning of the abnormality. Also, the crime prevention alarm circuit (3) generates an alarm sound, which is then collected by a sound wave receiver, followed by inputting of the alarm sound to a centralized control equipment (13), so that it may positively exhibit a crime prevention alarm function without causing any malfunction.
    Type: Grant
    Filed: June 9, 1997
    Date of Patent: June 22, 1999
    Inventor: Hideo Arakawa
  • Patent number: 5638049
    Abstract: A crime prevention display device is disclosed which includes a casing (21) provided therein with a chuck mechanism (20) for gripping a wire (W) inserted therethrough, a crime prevention alarm circuit (3) connected to the casing and a load detection means (40, 66, 25) for detecting a variation in load applied from an exhibit to the device. The load detection means (40) detects that removal of the exhibit held on the display device causes the device to be unloaded, so that the crime prevention alarm circuit (3) generates an alarm, leading to warning of the abnormality. Also, the crime prevention alarm circuit (3) generates an alarm sound, which is then collected by a sound wave receiver, followed by inputting of the alarm sound to a centralized control equipment (13), so that it may positively exhibit a crime prevention alarm function without causing any malfunction.
    Type: Grant
    Filed: November 9, 1994
    Date of Patent: June 10, 1997
    Assignee: Arakawa & Co., Ltd.
    Inventor: Hideo Arakawa
  • Patent number: 5417400
    Abstract: A wire holder capable of facilitating adjustment and/or variation of a length and tension of the wire. The wire holder includes a wire grip and a connector. The connector is formed on an outer surface thereof with a groove longitudinally extending from an upper end portion thereof to an intermediate portion thereof and laterally extending from a substantially central portion of the connector to the outer surface of the connector in the manner that a bottom surface of the groove is smoothly curved so as to gradually decrease a depth of the groove toward a lower end portion of the connector and toward the outer surface of the connector.
    Type: Grant
    Filed: November 18, 1991
    Date of Patent: May 23, 1995
    Assignee: Arakawa & Co., Ltd.
    Inventor: Hideo Arakawa
  • Patent number: 5103173
    Abstract: Permeameter suited for measuring permeability of a small, non-magnetic (i.e., the permeability value is close to 1) object. The probe of the permeameter is of the differential transformer type with an exciting coil and two detecting coils placed at both ends of the exciting coil. The difference in the outputs of the detecting coils is analyzed and the effect of the eddy current is effectively eliminated, whereby the signal representing the permeability of the object is extracted from the difference signal by the phase shift analysis. By reducing the distance between the two detecting coils, the influence of the disturbance of the eddy current at the boundary of the object sample is minimized and the permeameter can measure a small object sample without sacrificing accuracy and sensitivity.
    Type: Grant
    Filed: March 4, 1991
    Date of Patent: April 7, 1992
    Assignees: Aichi Steel Works Ltd., Kebushiki Kaisha Toyota Chuo Kenkyusho
    Inventors: Yoshinobu Honkura, Hideki Fujii, Hideo Arakawa, Kazumasa Sumi
  • Patent number: 5097318
    Abstract: A cavity-down type package for a semiconductor device comprises an insulating base substrate on which the semiconductor device and another insulating cap substrate with plural outer connection terminals on its outer surface and with electrodes provided on conductive layers for electric conduction on its inner surface. The electrodes on the insulating base substrate and those on the insulating cap substrate are connected with each other by using conductive material such as bumps.
    Type: Grant
    Filed: April 3, 1989
    Date of Patent: March 17, 1992
    Assignee: Hitachi, Ltd.
    Inventors: Akira Tanaka, Kazuji Yamada, Hirokazu Inoue, Hideo Arakawa, Masahide Okamoto
  • Patent number: 5095359
    Abstract: A semiconductor package for use in computers includes a insulating substrate onto which a semiconductor device is mounted, an insulating cap which shuts out outside air and seals said semiconductor device, power-source lines which provide power to the semiconductor device, and signal lines which transmit output signals from the semiconductor device to external circuits. The signal lines are arranged perpendicularly to the insulating substrate so that they are prevented from the dielectric constant of the insulating substrate, while the power-source lines are formed within the insulating substrate and connected through conductive layers parallel to the surface onto which the semiconductor is mounted to external leads.
    Type: Grant
    Filed: September 28, 1989
    Date of Patent: March 10, 1992
    Assignee: Hitachi, Ltd.
    Inventors: Akira Tanaka, Hirokazu Inoue, Kazuji Yamada, Kunio Miyazaki, Osamu Miura, Hideo Arakawa, Hiroshi Yokoyama, Yoshio Naganuma, Atsushi Morihara, Katsunori Ouchi
  • Patent number: 5058847
    Abstract: A hanging holder capable of being readily mounted or removed with respect to a wire at any desired time and without dismounting a hung structural assembly previously formed. The hanging holder includes a holder body, a slide lock sleeve, a bottom cover and a lock member which are formed with slits so as to vertically extend therethrough and laterally extend to their vertical through-holes, respectively, in such a manner that the slits of the holder body, slide lock sleeve and bottom cover are arranged so as to be aligned with one another and communicate with one another and the slit of the lock member is arranged so as not to be aligned with the slits of the holder body, slide lock sleeve and bottom cover when the lock member is threadedly fitted on the slide lock sleeve. The hanging holder also includes at least one support provided on the holder body for supporting an article to be hung therethrough on the holder body. Also, a hanging structure is provided which includes such a hanging holder.
    Type: Grant
    Filed: June 19, 1990
    Date of Patent: October 22, 1991
    Assignee: Arakawa & Co., Ltd.
    Inventor: Hideo Arakawa
  • Patent number: 5045922
    Abstract: An installation structure of integrated circuit devices, in which two or more types of integrated circuit devices of different base materials are installed onto the same installation substrate. Since the installation structure has a construction according to different characteristics such as a thermal conductivity, heat generation amount, thermal expansion coefficient and the like of the integrated circuit devices made of different materials, the reliability of each device and its connection and the reduction of the costs required for the cooling method can be presented.
    Type: Grant
    Filed: September 17, 1990
    Date of Patent: September 3, 1991
    Assignee: Hitachi, Ltd.
    Inventors: Hironori Kodama, Satoru Ogihara, Hideo Arakawa, Hirokazu Inoue, Yoshiyuki Yasutomi, Tadahiko Miyoshi
  • Patent number: 4998159
    Abstract: The present invention provides a ceramic laminated circuit substrate which is less in fluctuation of degree of shrinkage at firing and is less in voids and is suitable for formation of functional modules. This substrate comprises a conductor layer and a plurality of ceramic insulating layers wherein said ceramic insulating layers include at least one fiber-containing composite ceramic insulating layer. The present invention further provides a method for making this substrate which comprises preparing fiber-containing composite green sheets by adding to a green sheet raw material at least one of whiskers, glass filaments and chopped strands as fibers, laminating these fiber-containing composite green sheets in such direction that their casting directions are different together with green sheets containing no fibers to form a laminate and firing this laminate.
    Type: Grant
    Filed: June 8, 1989
    Date of Patent: March 5, 1991
    Assignee: Hitachi, Ltd.
    Inventors: Hiroichi Shinohara, Hideo Suzuki, Satoru Ogihara, Hideo Arakawa
  • Patent number: D531014
    Type: Grant
    Filed: August 23, 2004
    Date of Patent: October 31, 2006
    Assignee: A.G.K. Ltd.
    Inventor: Hideo Arakawa