Abstract: A photodiode that includes a first semiconductor region of a first conductive type and a second semiconductor region of a second conductive type opposite to the first conductive type, a third semiconductor region of the first conductive type holding a charge supplied from the first conductive region, a transistor that includes a gate connected to a node including the third semiconductor region, a fourth semiconductor region of the first conductive type as a drain, and a fifth semiconductor region of the first conductive type as a source, and a switch connecting the node and the drain are included, and one of the second and fifth semiconductor regions is a p-type semiconductor region supplied with first potential, the other of the second and fifth semiconductor regions is an n-type semiconductor region supplied with second potential, and the second potential is higher than the first potential.

Abstract: An imaging device includes: a lens-side suppression unit that moves an anti-vibration lens, which is provided in an interchangeable imaging lens mounted on an imaging device body including an imaging element, to a position, which is determined according to a detection result of a detection unit detecting vibration applied to a device, to suppress an influence of the vibration on a subject image; an imaging element-side suppression unit that moves the imaging element to suppress a shift in an angle of view caused by the movement of the anti-vibration lens; and a control unit that performs control on the lens-side suppression unit to limit a movable range of the anti-vibration lens, which is moved by the lens-side suppression unit, on the basis of the amount of the maximum shift in the angle of view caused by the movement of the imaging element performed by the imaging element-side suppression unit.

Abstract: An embodiment includes: a semiconductor substrate including a pixel well region and a peripheral well region; a pixel ground line arranged above the pixel well region; a pixel well contact between the pixel ground line and the pixel well region; pixels arranged to form columns in the pixel well region; a reference signal generation circuit arranged in the peripheral well region; and comparator units arranged in the peripheral well region, provided to respective columns, and each configured to receive the pixel signal from the pixels on a corresponding column and the reference signal. Each comparator unit includes a comparator having a first input node that receives the pixel signal and a second input node that receives the reference signal, a first capacitor unit between the reference signal generation circuit and the second input node, and a second capacitor unit between the second input node and the pixel ground line.

Abstract: Photoelectric conversion device includes stacked first and second substrates. The first substrate includes pixel array, first joint portion arranged in the pixel array and connected to pixels in the pixel array, and power supply pad connected to the first joint portion. The second substrate includes readout circuit to read signal from the pixel array via signal line, and second joint portion jointed to the first joint portion. The readout circuit includes limiter circuit to limit amplitude of potential of the signal line. Power supply terminal of the limiter circuit is connected to the second joint portion, and power supply potential applied to the power supply pad is supplied to the pixels and supplied to the power supply terminal of the limiter circuit via the first and second joint portions.

Abstract: A photoelectric conversion device includes: pixels forming columns and each configured to output a pixel signal; and comparator units provided to respective columns and each configured to receive the pixel signal from the pixels on a corresponding column and the reference signal. Each comparator unit includes a comparator having a first input node that receives the pixel signal and a second input node that receives the reference signal, a first capacitor that connects a reference signal line and the second input node, a second capacitor whose one electrode is connected to the second input node, and a select unit that connects the other electrode of the second capacitor to either the reference signal line or a reference voltage line. The other electrode of the second capacitor is connected to the reference signal line during first mode AD conversion and connected to the reference voltage line during second mode AD conversion.

Abstract: An analog-to-digital conversion device of the embodiment includes a comparator and a logic circuit including a switch unit and a logic gate unit that receives a signal output from a comparator. The logic gate unit and the switch unit are connected to each other in series between a power supply node and a ground node.

Abstract: In a state in which a position sensor for focusing is viewed in the direction of an optical axis, a line connecting the position sensor for focusing to the optical axis is set as a first reference line and a line orthogonal to the first reference line and passing through the optical axis is set as a second reference line. The position sensor for focusing is disposed in a first region of the first region and a second region partitioned by the second reference line. An X-direction VCM and a Y-direction VCM are arranged in the second region. The influence of magnetism from the X-direction VCM and the Y-direction VCM on the position sensor for focusing is suppressed.

Abstract: A photoelectric conversion apparatus, comprising: a pixel array; a first and a second signal line groups; a first and a second readout circuit groups; a first multiplexer group that selects one of at least two first signal lines, and connects the selected first signal line to one first readout circuit; and a second multiplexer group that selects one of at least two second signal lines, and connects the selected second signal line to one second readout circuit, a number of the first readout circuits is more than a number of the first signal lines, a number of the second readout circuits is more than a number of the second signal lines, the selection operations by the first and second multiplexer groups are executable independently from each other, the selection operation of the first multiplexer group is controlled collectively, and the selection operation of the second multiplexer group is controlled collectively.

Abstract: An image pickup device according to an embodiment includes pixels each configured to output an analog signal based on electric charges produced in a photoelectric conversion unit and a control unit configured to control a gain applied to the analog signal to be at least a first gain and a second gain greater than the first gain in accordance with a signal value of the analog signal. Each of the pixels outputs, as the analog signal, a first signal and a second signal based on electric charges produced in the photoelectric conversion unit in a first exposure period and a second exposure period shorter than the first exposure period. The control unit controls the gain applied to the analog signal by selecting one from the first gain and the second gain in accordance with the signal value, for at least one of the first signal and the second signal.

Abstract: A semiconductor apparatus according to the present invention includes: a semiconductor component including a cell array and a plurality of wirings; and a semiconductor component including a plurality of pads connected to the semiconductor component including the cell array. A first row pad connected to a row wiring connected to a first cell and a second cell, a second row pad connected to a row wiring connected to a third cell and a fourth cell, and a column pad connected to a column wiring connected to the first cell and the third cell are arranged such that a straight line connecting the first row pad and the column pad crosses a straight line connecting the second row pad and the column pad.

Abstract: In one embodiment, a reservation order processing system has an order item acceptance device, an order station, and an output device. The order item acceptance device transmits information of an order including a reception time. The order station obtains a cooking start time based on the reception time, item information of an ordered item, and characteristic information of a person in charge of cooking the relevant item information. Further, the order station transmits cooking instruction information to the output device at the obtained cooking start time.

Abstract: A photoelectric conversion apparatus includes a first substrate including a pixel array, a second substrate including a readout circuit configured to read out a signal from the pixel array, and a drive terminal to which a drive potential is externally applied. The readout circuit includes a first node to which the drive potential is supplied from the drive terminal via an electrically conductive line arranged in the pixel array, and a second node to which the drive potential is supplied from the drive terminal without going through the pixel array.

Abstract: A particle beam treatment apparatus includes: a rotating gantry configured to axially rotate in a state where a bed fixed to a stationary system is disposed inside the rotating gantry and an irradiation port of a beam is fixed to a body of the rotating gantry; a tunnel structure configured to have at least a horizontal floor surface and have an internal space in which at least a part of the bed is accommodated; and a rotation supporter configured to cause the tunnel structure to be stationary in the stationary system independently of axis rotation of the rotating gantry by rotationally displacing the tunnel structure with respect to an inner side surface of the rotating gantry.

Abstract: A microprotrusion device (1A) according to the present invention includes a needle-like and hollow first protrusion portion (3) that is formed so as to protrude from one surface (2a) of a substrate sheet (2) and a hollow second protrusion portion (4) that is formed so as to protrude from a vicinity of the first protrusion portion (3) on the one surface (2a) of the substrate sheet (2) and has a protrusion height lower than that of the first protrusion portion (3). The first protrusion portion (3) has an opening at its tip end portion, and a hollow portion (30) of the first protrusion portion (3) is in communication with the outside via the opening portion (31). The opening portion (31) is formed at the tip end of the first protrusion portion (3).

Abstract: An imaging device includes: an imaging device body including an imaging element that receives reflected light representing a subject as a subject image, and a body-side suppression unit that suppresses an influence of vibration, which is applied to a device, on the subject image on the basis of a detection result of a detection unit detecting the vibration; and a control unit performing control on the body-side suppression unit to suppress the influence with a limit that is a degree for limiting the suppression of the influence performed by the body-side suppression unit and is determined according to information about an interchangeable imaging lens mounted on the imaging device body.

Abstract: The present invention provides a fine hollow protruding tool (1) having a basal member (2) and a fine hollow protrusions (3) project from the basal member (2). The fine hollow protrusions (3) each has an opening portion (3h) on a tip side thereof and an interior in which an interior space linked to the opening portion (3h) is formed. In any vertical cross-section passing through an apex of the fine hollow protrusion (3), a wall thickness (T1) in an apex-side region (TB) on the apex side is thinner than a wall thickness (T2) in a lower-side region (BP) that is closer to the basal member (2) than the apex-side region (TB) is, and a gap (M1c) between inner walls (31) in the apex-side region (TB) is smaller than a gap (M2c) between the inner walls (31) in the lower-side region (BP). A base portion (34) of the fine hollow protrusion (3) projecting from the basal member (2) has a curvature.

Abstract: An imaging apparatus includes a plurality of pixels, a plurality of signal lines, and a plurality of comparators. The imaging apparatus further includes a first switch and a second switch. The first switch includes a first terminal configured to receive signal from one of the signal lines is input, and a second terminal connected to an input node of one of the comparators. The second switch includes a first terminal connected to the input node of the one comparator, and a second terminal to which a signal from another one of the signal lines is input.

Abstract: Provided are a lens barrel and an imaging device, with which it is possible to lock an optical member of which the movement in an optical axis direction is made free in a case where there is no electrification, particularly to hold the optical member in a locked state without use of electric power. A movable frame that holds a focus lens is driven in the optical axis direction by a linear motor. In a case where the movable frame is to be locked with the linear motor being not electrified, the movable frame (engagement portion) is caused to abut onto a restriction portion at an end portion of the movable range of the movable frame and a locking ring is caused to rotationally move to a locking position by an electric actuator. Accordingly, the movable frame is fixed by the restriction portion and a locking portion of the locking ring to become unable to move.

Abstract: In an imaging device, a differential stage includes an input transistor having an input node connected to a floating diffusion portion, a first control line and a second control line are located in a plurality of sets, the first control line is connected to connection portions of some sets of the plurality of sets, and the second control line is connected to connection portions of the other sets of the plurality of sets.

Abstract: A semiconductor apparatus includes a stack of first and second chips each having a plurality of pixel circuits arranged in a matrix form. The pixel circuit of the a-th row and the e1-th column is connected to the electric circuit of the p-th row and the v-th column. The pixel circuit of the a-th row and the f1-th column is connected to the electric circuit of the q-th row and the v-th column. The pixel circuit of the a-th row and the g1-th column is connected to the electric circuit of the r-th row and the v-th column. The pixel circuit of the a-th row and the h1-th column is connected to the electric circuit of the s-th row and the v-th column.